Claims
- 1. A method for high-speed, 3-D inspection of an array of electrical interconnects, the method including the steps of generating a first set of data values represented by height data obtained from a first direction with respect to the array of electrical interconnects and processing the height data from the first direction with an algorithm, the improvement comprising:
- determining a course position location for each interconnect wherein the algorithm processes the height data to determine a fine position location for each interconnect based on its course position location.
- 2. The method as claimed in claim 1 wherein the step of determining is also performed by the algorithm.
- 3. The method as claimed in claim 1 further comprising the step of generating a second set of data values represented by height data obtained from a second direction with respect to the array of electrical interconnects wherein the algorithm processes the height data from the first and second directions to obtain the fine position location for each interconnect based on its course position location.
- 4. A system for high-speed, 3-D inspection of an array of electrical interconnects, the system including means for generating a first set of data values represented by height data and intensity data obtained from a first direction with respect to the array of electrical interconnects and means for processing the height data and the intensity data from the first direction with an algorithm, the improvement comprising:
- means for determining course position location for each interconnect wherein the algorithm processes the height data to determine a fine position location for each interconnect based on its course position location.
- 5. The system as claimed in claim 4 wherein the means for determining includes the algorithm.
- 6. The system as claimed in claim 4 further comprising means for generating a second set of data values represented by height data obtained form a second direction with respect to the array of electrical interconnects wherein the algorithm processes the height data from the first and second directions to obtain the fine position location for each interconnect based on its course position location.
Parent Case Info
This is a continuation of application Ser. No. 08/138,776 filed on Oct. 19, 1993, now U.S. Pat. No. 5,652,658.
US Referenced Citations (12)
Non-Patent Literature Citations (3)
Entry |
"System Technology/Testing and Manufacturing", 8167 Computer Design, 25 (1986) Mar., No. 6, Littleton, Massachusetts, USA. |
.sctn.21.4 from brochure relating to Spatial Resolution and Frame Rate Reduction Techniques. |
"High-speed image processing of 1 Mbyte pictures", SPIE vol. 728, Optics, Illuminations, and Image Sensing for Machine Vision (1986), pp. 111-115. |
Continuations (1)
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Number |
Date |
Country |
Parent |
138776 |
Oct 1993 |
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