Patent Application
20140144019
This application claims the priority benefit of Taiwan patent application number 100130953 filed on Aug. 29, 2011.
The present invention relates to a heat dissipation device, and more particularly to a heat dissipation device having a heat dissipation element being directly connected at a heat transfer section to an clement made of a ceramic material, so as to overcome the problem of crack at an interface between the heat dissipation element and a heat source due to thermal fatigue. The present invention also relates to a method of manufacturing the above described heat dissipation device.
The progress in semiconductor technology enables various integrated circuits (ICs) to have a gradually reduced volume. For the purpose of processing more data, the number of computing elements provided on the presently available ICs is several times higher than that on the conventional ICs of the same volume. When the number of computing elements on the ICs increases, the heat generated by the computing elements during the operation thereof also increases. For example, the heat generated by a central processing unit (CPU) at full-load condition is high enough to burn out the whole CPU. Thus, it is always an important issue to properly provide a heat dissipation device for ICs.
The CPU and other chips are heat sources in the electronic device. When the electronic device operates, these heat sources will generate heat. The CPU and other chips are mainly encapsulated with a ceramic material. The ceramic material has a low thermal expansion coefficient close to that of chips used in general electronic devices and is electrically non-conductive, and is therefore widely employed as packaging material and semiconductor material.
On the other hand, a heat dissipation device usually includes a heat dissipating structure made of an aluminum material or a copper material, and is often used along with other heat dissipation elements, such as fans and heat pipes, in order to provide enhanced heat dissipation effect. However, in considering the reliability of the electronic device, the use of a heat dissipation structure with cooling fans and heat pipes would usually have adverse influence on the overall reliability of the electronic device.
Generally speaking, a heat dissipation device with simpler structural design would be better to the overall reliability of the electronic device. Thus, the heat transfer efficiency of the electronic device can be directly improved when the heat dissipation device used therewith uses a material having better heat transferring and radiating ability than copper.
In addition, heat stress is another potential factor having adverse influence on the reliability of the electronic device in contact with the heat dissipation device. The heat source, such as the chip in the CPU, has a relatively low thermal expansion coefficient. To pursue good product reliability, the electronic device manufacturers would usually use a ceramic material with low thermal expansion coefficient, such as aluminum nitride (AlN) or silicon carbide (SiC), to package the chip.
Further, in the application field of light-emitting diode (LED) heat dissipation, for example, aluminum and copper materials forming the heat dissipation device have thermal expansion coefficients much higher than that of an LED sapphire chip and the ceramic packaging material thereof. In a high-brightness LED, an interface between the aluminum or copper material of the heat dissipation device and the ceramic packaging material of the LED sapphire chip tends to crack due to thermal fatigue caused by the difference in the thermal expansion coefficients thereof when the LED has been used over a long period of time. The interface crack in turn causes a rising thermal resistance at the interface. For the high-brightness LED products, the rising thermal resistance at the heat dissipation interface would result in heat accumulation to cause burnout of the LED chip and bring permanent damage to the LED.
In brief, the difference between the thermal expansion coefficients of the ceramic packaging material of a heat source and the metal material of a heat dissipation device would cause crack at an interface between the heat source and the heat dissipation device due to thermal fatigue; and it is necessary to work out a way to solve the problem of such crack at the interface.
A primary object of the present invention is to provide a heat dissipation device that overcomes the problem of crack at an interface between the heat dissipation device and a heat source due to thermal fatigue.
Another object of the present invention is to provide a method of manufacturing a heat dissipation device that can overcome the problem of crack at an interface between the heat dissipation device and a heat source due to thermal fatigue.
To achieve the above and other objects, the heat dissipation device according to the present invention includes a heat dissipation element and a ceramic main body. The heat dissipation element includes a heat transfer section and a heat dissipation section located on one side of the heat transfer section; and the ceramic main body is connected to another side of the heat transfer section opposite to the heat dissipation section.
In the present invention, the heat dissipation element can be any one of a heat sink, a vapor chamber, a heat pipe, and a water block.
In the present invention, the ceramic main body is made of a material selected from the group consisting of silicon nitride (Si3N4), zirconium nitride (ZrO2), and aluminum oxide (Al2O3).
To achieve the above and other objects, the heat dissipation device manufacturing method according to the present invention includes the following steps:
providing a heat dissipation element and a ceramic main body; and
connecting the heat dissipation element and the ceramic main body to each other.
In the present invention, the heat dissipation element and the ceramic main body are connected to each other in a manner selected from the group consisting of soldering, brazing, diffusion bonding, ultrasonic welding, and direct bonding copper (DBC) process.
In the present invention, since the ceramic main body is directly connected to the heat dissipation element for contacting with a ceramic packaging material of a heat source, it is able to avoid the problem of crack at an interface between the heat dissipation device and the heat source due to thermal fatigue caused by different thermal expansion coefficients of the heat dissipation element and the heat source package.
The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein
a is an exploded perspective view of a heat dissipation device according to a first embodiment of the present invention;
b is an assembled view of
The present invention will now be described with some preferred embodiments thereof and with reference to the accompanying drawings. For the purpose of easy to understand, elements that are the same in the preferred embodiments are denoted by the same reference numerals.
Please refer to
The heat dissipation element 11 includes a heat transfer section 111 and a heat dissipation section 112 located on one side of the heat transfer section 111. The ceramic main body 12 is connected to another side of the heat transfer section 111 opposite to the heat dissipation section 112. In the illustrated first embodiment, the heat dissipation element 11 is a heat sink, and the ceramic main body 12 is made of a material selected from the group consisting of silicon nitride (Si3N4), zirconium nitride (ZrO2), and aluminum oxide (Al2O3).
Please refer to
Please refer to
In the step S1, a heat dissipation element and a ceramic main body are provided.
More specifically, a heat dissipation element 11 and a ceramic main body 12 are provided. The heat dissipation element 11 can be any one of a heat sink, a vapor chamber, a heat pipe, and a water block. The ceramic main body 12 is made of a material selected from the group consisting of silicon nitride (Si3N4), zirconium nitride (ZrO2), and aluminum oxide (Al2O3).
In the step S2, the heat dissipation element and the ceramic main body are connected to each other.
More specifically, the heat dissipation element 11 and the ceramic main body 12 are connected to each other by way of soldering, brazing, diffusion bonding, ultrasonic welding, or direct bonding copper (DBC) process.
The present invention is characterized in that the heat dissipation element 11, which can be a heat sink, a vapor chamber, a heat pipe or a water block, has a heat transfer section 111 for transferring heat from a heat source to a heat dissipation 112; and that the ceramic main body 12 is connected to the heat transfer section 111 of the heat dissipation element 11 for contacting with the heat source. Since the ceramic main body 12 has a thermal expansion coefficient close to that of a ceramic packaging material of the heat source, it is able to avoid the problem of crack at an interface between the heat dissipation element 11 and the heat source due to thermal fatigue caused by different thermal expansion coefficients of the heat dissipation element 11 and the heat source package. Further, the heat dissipation element with the ceramic main body connected to the heat transfer section thereof can be applied to more different fields.
The present invention has been described with some preferred embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 100130953 | Aug 2011 | TW | national |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 13274359 | Oct 2011 | US |
| Child | 14167447 | US |
