Ceramic materials or glass

Industry

CPC
H01L23/3731

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3731Ceramic materials or glass

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and method for forming the same
- Patent number 12,165,947
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Sheh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising antenna and communication m...
- Patent number 12,154,870
- Issue date Nov 26, 2024
- Advanced Semiconductor Engineering, Inc.
- Meng-Wei Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and manufacturing method thereof
- Patent number 12,148,735
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with high heat dissipation property using hexa...
- Patent number 12,131,978
- Issue date Oct 29, 2024
- Electronics and Telecommunications Research Institute
- Il Gyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive slugs/active dies to improve cooling of stacke...
- Patent number 12,094,800
- Issue date Sep 17, 2024
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method
- Patent number 12,085,769
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an insulating sheet and a conductive fi...
- Patent number 12,080,612
- Issue date Sep 3, 2024
- Fuji Electric Co., Ltd.
- Katsumi Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 12,074,106
- Issue date Aug 27, 2024
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct to chip application of boiling enhancement coating
- Patent number 12,051,637
- Issue date Jul 30, 2024
- MTS IP Holdings Ltd
- Luke Gregory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressible foamed thermal interface materials and methods of maki...
- Patent number 12,033,971
- Issue date Jul 9, 2024
- Laird Technologies, Inc.
- Vijayaraghavan Rajagopal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Bonded body of copper and ceramic, insulating circuit substrate, bo...
- Patent number 12,027,434
- Issue date Jul 2, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package device with dedicated heat-dissipation featur...
- Patent number 11,972,998
- Issue date Apr 30, 2024
- Shunsin Technology (Zhong Shan) Limited
- Shun-Hsing Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip device and method of formation
- Patent number 11,967,582
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number RE49912
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Akihiro Kimura
Information Patent Grant
Thermal management for package on package assembly
- Patent number 11,935,877
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Itai Leshniak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and electronic device
- Patent number 11,929,301
- Issue date Mar 12, 2024
- NGK Electronics Devices, Inc.
- Naoya Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier, assembly comprising a substrate and a carrier, and method...
- Patent number 11,810,845
- Issue date Nov 7, 2023
- OSRAM OLED GmbH
- Jörg Erich Sorg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressible foamed thermal interface materials and methods of maki...
- Patent number 11,776,928
- Issue date Oct 3, 2023
- Laird Technologies, Inc.
- Vijayaraghavan Rajagopal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Chip package
- Patent number 11,776,867
- Issue date Oct 3, 2023
- Industrial Technology Research Institute
- Kuo-Shu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor chamber structure
- Patent number 11,765,861
- Issue date Sep 19, 2023
- Asia Vital Components Co., Ltd.
- Hsiu-Wei Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing a power semiconductor component arrangement...
- Patent number 11,749,533
- Issue date Sep 5, 2023
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Steffen Ziesche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 11,699,651
- Issue date Jul 11, 2023
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High thermal conductivity vias by additive processing
- Patent number 11,676,880
- Issue date Jun 13, 2023
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip device and method of formation
- Patent number 11,637,087
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Continuous boron nitride nanotube fibers
- Patent number 11,623,865
- Issue date Apr 11, 2023
- BNNT, LLC
- Michael W. Smith
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Grant
Aluminum nitride film, method of manufacturing aluminum nitride fil...
- Patent number 11,572,275
- Issue date Feb 7, 2023
- Shibaura Institute of Technology
- Atsushi Yumoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Carrier substrate with a thick metal interlayer and a cooling struc...
- Patent number 11,564,307
- Issue date Jan 24, 2023
- Rogers Germany GmbH
- Andreas Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay module and method of assembling
- Patent number 11,551,993
- Issue date Jan 10, 2023
- GE Aviation Systems LLC
- David Richard Esler
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 11,551,992
- Issue date Jan 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jhih-Yang Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure having antenna module
- Patent number 11,515,269
- Issue date Nov 29, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240421031
- Publication date Dec 19, 2024
- InnoLux Corporation
- Te-Hsun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20240404912
- Publication date Dec 5, 2024
- Fuji Electric Co., Ltd.
- Taichi ITOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU MICRO-FLUIDIC CHANNELS FOR HEAT DISSIPATION IN GLASS SUBSTRATE
- Publication number 20240395661
- Publication date Nov 28, 2024
- Intel Corporation
- Numair Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Components For Increased Power Handling
- Publication number 20240395656
- Publication date Nov 28, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387318
- Publication date Nov 21, 2024
- DENSO CORPORATION
- Ryota KOJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387454
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD
- Publication number 20240361546
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY-INSULATING AND HIGHLY THERMAL CONDUCTIVE SHEET FOR ELE...
- Publication number 20240332121
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP DEVICE AND METHOD OF FORMATION
- Publication number 20240274577
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND VARIABLE FREQUENCY CONTROL SYSTEM USING ELECT...
- Publication number 20240274546
- Publication date Aug 15, 2024
- Shaoyang WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERMANENT LAYER FOR BUMP CHIP ATTACH
- Publication number 20240178097
- Publication date May 30, 2024
- Intel Corporation
- Frederick Atadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240170361
- Publication date May 23, 2024
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT CONDUCTOR AND THERMAL MANAGEMENT PART
- Publication number 20240145335
- Publication date May 2, 2024
- Shinko Electric Industries Co., Ltd.
- Takamasa NAGASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20240145331
- Publication date May 2, 2024
- HITACHI POWER SEMICONDUCTOR DEVICE, LTD.
- Hitoshi NISHIMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE FILM-LIKE ADHESIVE, SEMICONDUCTOR PACKAGE, AND...
- Publication number 20240128154
- Publication date Apr 18, 2024
- FURUKAWA ELECTRIC CO., LTD.
- Minoru MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...
- Publication number 20240105663
- Publication date Mar 28, 2024
- Laird Technologies, Inc.
- Vijayaraghavan RAJAGOPAL
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CIRCUIT PACKAGE WITH IMPROVED THERMAL MANAGEMENT
- Publication number 20240055319
- Publication date Feb 15, 2024
- Qorvo US, Inc.
- Matthew Irvine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240047294
- Publication date Feb 8, 2024
- Mitsubishi Electric Corporation
- Katsuhiko KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHOD FOR FORMING THE SAME
- Publication number 20240021494
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Sheh HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A TRANSISTOR WITH A HIGH DEGREE OF ELECTRON MO...
- Publication number 20230420542
- Publication date Dec 28, 2023
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Elke MEISSNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT INTERCONNECT INTEGRATION PROCESSES AND STRUCTURES
- Publication number 20230352402
- Publication date Nov 2, 2023
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THERMAL CONDUCTIVITY VIAS BY ADDITIVE PROCESSING
- Publication number 20230307312
- Publication date Sep 28, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE SHEET AND DEVICE PROVIDED WITH THERMALLY CONDU...
- Publication number 20230295398
- Publication date Sep 21, 2023
- Showa Denko Materials Co., Ltd.
- Mika KOBUNE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES FOR POWER STAGE ASSEMBLIES COMPRISING BOTTOM-COOLED SEMI...
- Publication number 20230282540
- Publication date Sep 7, 2023
- GaN Systems Inc.
- Ruoyu HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP DEVICE AND METHOD OF FORMATION
- Publication number 20230260963
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE COOLING USING THERMORESPONSIVE MATERIALS
- Publication number 20230253287
- Publication date Aug 10, 2023
- Intel Corporation
- Tsung-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIALS FOR THE INTERIOR, CENTER, AND EXTERIOR...
- Publication number 20230223313
- Publication date Jul 13, 2023
- G2F Tech Co., Ltd.
- Jie-Qi LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING AN IMPROVED THERMAL INTEGRATED CIRCUIT HA...
- Publication number 20230207420
- Publication date Jun 29, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PLACEMENT TABLE
- Publication number 20230197500
- Publication date Jun 22, 2023
- NGK Insulators, Ltd.
- Seiya INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE WITH DEDICATED HEAT-DISSIPATION FEATUR...
- Publication number 20230130484
- Publication date Apr 27, 2023
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS

Ceramic materials or glass

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices and method for forming the same

Semiconductor device package comprising antenna and communication m...

Memory device and manufacturing method thereof

Semiconductor device with high heat dissipation property using hexa...

Thermally conductive slugs/active dies to improve cooling of stacke...

Integrated circuit device and method

Semiconductor device having an insulating sheet and a conductive fi...

Fan-out interconnect integration processes and structures

Direct to chip application of boiling enhancement coating

Compressible foamed thermal interface materials and methods of maki...

Bonded body of copper and ceramic, insulating circuit substrate, bo...

Semiconductor package device with dedicated heat-dissipation featur...

Multi-chip device and method of formation

Semiconductor device

Thermal management for package on package assembly

Package and electronic device

Carrier, assembly comprising a substrate and a carrier, and method...

Compressible foamed thermal interface materials and methods of maki...

Chip package

Vapor chamber structure

Method of manufacturing a power semiconductor component arrangement...

Fan-out interconnect integration processes and structures

High thermal conductivity vias by additive processing

Multi-chip device and method of formation

Continuous boron nitride nanotube fibers

Aluminum nitride film, method of manufacturing aluminum nitride fil...

Carrier substrate with a thick metal interlayer and a cooling struc...

Power overlay module and method of assembling

Semiconductor device

Semiconductor packaging structure having antenna module

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

IN-SITU MICRO-FLUIDIC CHANNELS FOR HEAT DISSIPATION IN GLASS SUBSTRATE

Components For Increased Power Handling

SEMICONDUCTOR DEVICE

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD

ELECTRICALLY-INSULATING AND HIGHLY THERMAL CONDUCTIVE SHEET FOR ELE...

MULTI-CHIP DEVICE AND METHOD OF FORMATION

ELECTRONIC DEVICE AND VARIABLE FREQUENCY CONTROL SYSTEM USING ELECT...

PERMANENT LAYER FOR BUMP CHIP ATTACH

PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

HEAT CONDUCTOR AND THERMAL MANAGEMENT PART

POWER SEMICONDUCTOR MODULE

THERMALLY CONDUCTIVE FILM-LIKE ADHESIVE, SEMICONDUCTOR PACKAGE, AND...

COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...

CIRCUIT PACKAGE WITH IMPROVED THERMAL MANAGEMENT

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES AND METHOD FOR FORMING THE SAME

METHOD FOR PRODUCING A TRANSISTOR WITH A HIGH DEGREE OF ELECTRON MO...

FAN-OUT INTERCONNECT INTEGRATION PROCESSES AND STRUCTURES

HIGH THERMAL CONDUCTIVITY VIAS BY ADDITIVE PROCESSING

THERMALLY CONDUCTIVE SHEET AND DEVICE PROVIDED WITH THERMALLY CONDU...

SUBSTRATES FOR POWER STAGE ASSEMBLIES COMPRISING BOTTOM-COOLED SEMI...

MULTI-CHIP DEVICE AND METHOD OF FORMATION

INTEGRATED CIRCUIT DEVICE COOLING USING THERMORESPONSIVE MATERIALS

THERMAL INTERFACE MATERIALS FOR THE INTERIOR, CENTER, AND EXTERIOR...

INTEGRATED CIRCUIT HAVING AN IMPROVED THERMAL INTEGRATED CIRCUIT HA...

WAFER PLACEMENT TABLE

SEMICONDUCTOR PACKAGE DEVICE WITH DEDICATED HEAT-DISSIPATION FEATUR...