Patent Application
20130112387
1. Technical Field
The present disclosure relates to heat dissipation devices, and more particularly, to a heat dissipation device including two self-connecting heat sinks.
2. Description of Related Art
Heat dissipation devices are used with electronic components due to a large amount of heat generated by the electronic components. A typical heat dissipation device includes a base and a plurality of fins extending from the base. The base contacts the electronic component to absorb heat from the electronic component. The fins dissipate the heat from the base to the outside environment atmosphere. However, the base of the typical heat dissipation device often has a small size, resulting in heat dissipation areas of the heat dissipation device limited.
What is needed, therefore, is a heat dissipation device which can overcome the limitations described above.
Many aspects of the present disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
Referring to
Also referring to
The second heat sink 20 defines a groove 222 in one lateral face 220 thereof facing the rib 122 of the first heat sink 10. The groove 222 has a shape corresponding to that of the rib 122. The groove 222 has a length identical to that of the base 22 of the second heat sink 20. A width of the groove 222 gradually increases in a direction away from the lateral face 220 of the base 22 where the groove 222 is defined. The groove 222 has an elongated opening 224 facing the rib 122 of the first heat sink 10. A width of the opening 224 of the groove 222 is less than that of the wide end of the rib 122 and larger that that of the narrow end of the rib 122. The groove 222 has a depth similar to a thickness of the rib 122.
In use, the first heat sink 10 and the second heat sink 20 are assembled to each other. The first heat sink 10 and the second heat sink 20 are firstly staggered with each other to align the rib 122 of the first heat sink 10 with the groove 222 of the second heat sink 20 in a line. Then the rib 122 is brought to slide into the groove 222 to make the first heat sink 10 and the second heat sink 20 moving towards each other. When the rib 122 of the first heat sink 10 is retained in the groove 222 of the second heat sink 20, the first heat sink 10 and the second heat sink 20 are assembled completely. The rib 122 is entirely received in the groove 222. The rib 122 has three different faces thereof thermally contacting the second heat sink 20 in the groove 222. Especially, the three different faces of the rib 122 each directly contact the second heat sink 20 without intermedium therebetween. The bottom face 123 of the first heat sink 10 is coplanar with the bottom face 223 of the second heat sink 20.
Each of the first heat sink 10 and the second heat sink 20 cannot be made largely due to technology limitation of aluminum-extrusion. However, after the first heat sink 10 and the second heat sink 20 are assembled together, the combination of the first heat sink 10 and the second heat sink 20 can obtain a large area. Thus, heat dissipation areas of the heat dissipation device 100 are large enough to meet the heat dissipation requirement of the electronic component 30.
It is believed that the present disclosure and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the present disclosure or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201110349549.8 | Nov 2011 | CN | national |
