Patent Application
20120318481
1. Technical Field
The present disclosure relates to heat dissipation devices, and more particularly to a heat dissipation device incorporating heat pipes.
2. Description of Related Art
Some electronic components, such as central processing units (CPUs) and integrated circuit (IC) packages, comprise numerous circuits operating at high speed and generating substantial heat. Under most circumstances, it is necessary to cool the electronic components in order to maintain safe operating conditions and assure that the electronic components function properly and reliably. Typically, a finned metal heat dissipation device is attached to an outer surface of the electronic component to remove the heat therefrom. The heat absorbed by the heat dissipation device is then dissipated to ambient air.
However, as the operating speed of electronic components has been continually upgraded, these kinds of conventional heat sinks are increasingly no longer able to meet the heat dissipation requirements of modern electronic components.
What is needed, therefore, is a heat dissipation device which can overcome the above-described problems.
Many aspects of the present heat dissipation device can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present heat dissipation device. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
Referring to
The first base 10 is made of metal with good heat conductivity, such as aluminum, copper, or alloys thereof. The first base 10 has a rectangular profile. A plurality of elongated first receiving grooves 12 are defined in a top face of the first base 10. In this embodiment, there are three first receiving grooves 12. The first receiving grooves 12 are spaced from and parallel to each other. Two first recessed portions 14 are defined in the top face of the first base 10. The two first recessed portions 14 are located at two opposite lateral sides of the first base 10. In this embodiment, the first receiving grooves 12 extend along a lengthwise direction of the first base 10.
The second base 20 is made of metal with good heat conductivity, such as aluminum, copper, or alloys thereof. The second base 20 has a rectangular profile. Two first cutouts 22 are defined at two opposite lateral sides of the second base 20, respectively. The first cutouts 22 are located corresponding to the recessed portions 14 of the first base 10. In other words, the first cutouts 22 correspondingly face the recessed portions 14. Two second cutouts 24 are defined at the two opposite lateral sides of the second base 20, respectively. The second cutouts 24 are spaced from the first cutouts 22. The two second cutouts 24 are located corresponding to two opposite outmost first receiving grooves 12 of the first base 10. A bottom face of the second base 20 thermally contacts the top face of the first base 10. An area of the second base 20 is larger than that of the first base 10. In this embodiment, a width of the second base 20 is equal to a length of the first base 10.
Referring to
Two elongated through holes 36 are defined in the fin set 30. The through holes 36 extend transversely through the fin set 30. The through holes 36 are located adjacent a top end of the fin set 30. Two receiving slots 38 are respectively defined at two opposite lateral sides of the fin set 30. Each receiving slot 38 extends from the bottom face of the fin set 30 to a corresponding through hole 36, whereby the receiving slot 38 defines two openings (not labeled) respectively in the bottom face of the fin set 30 and a corresponding lateral side of the fine set 30. The openings defined in the bottom face of the fin set 30 are correspondingly communicated with the two second cutouts 24 of the second base 20.
The first heat pipe 40 comprises a first evaporating section 42, two first condensing sections 44 spaced from the first evaporating section 42, and two first connecting sections 46 respectively interconnecting the first evaporating section 42 and the first condensing sections 44. The first evaporating section 42 is S-shaped. The first evaporating section 42 is parallel to the first condensing sections 44. The first evaporating section 42 and the first condensing sections 44 each have a semicircular cross section. The two first condensing sections 44 are respectively located at two lateral sides of the first evaporating section 42. The first evaporating section 42 of the first heat pipe 40 is received in a corresponding first receiving groove 12 of the first base 10. The first evaporating section 42 of the first heat pipe 40 is sandwiched between the first base 10 and the second base 20. A top face of the first evaporating section 42 is coplanar with the top face of the first base 10. The first condensing sections 44 of the first heat pipe 40 are respectively received in the two second receiving grooves 32 of the fin set 30. The first condensing sections 44 of the first heat pipe 40 are sandwiched between the second base 20 and the fin set 30. Bottom faces of the first condensing sections 44 of the first heat pipe 40 are coplanar with the bottom face of the fin set 30. The first condensing sections 44 of the first heat pipe 40 are spaced from the top face of the first base 10. Each first connecting section 46 of the first heat pipe 40 is accommodated in a corresponding receiving space.
Each of the second heat pipes 50 comprises a second evaporating section 52, a second condensing section 54 spaced from the second evaporating section 52, and a second connecting section 56 interconnecting the second evaporating section 52 and the second condensing section 54. Each second heat pipe 50 is U-shaped. The second evaporating section 52 is parallel to the second condensing section 54 of each second heat pipe 50. In this embodiment, there are two second heat pipes 50 juxtaposed with each other. The second evaporating section 52 of each second heat pipe 50 is received in a corresponding first receiving groove 12 of the first base 10. The second evaporating sections 52 of the second heat pipes 50 are sandwiched between the first base 10 and the second base 20. Top faces of the second evaporating sections 52 of the second heat pipes 50 are coplanar with the top face of the first base 10. The second condensing section 54 of each second heat pipe 50 is fittedly received in a corresponding through hole 36 of the fin set 30. The second connecting section 56 of each second heat pipe 50 is accommodated in a corresponding receiving slot 38.
In use of the heat dissipation device, heat absorbed by the first base 10 is transferred to the second base 20 and then distributed to the fin set 30. The heat dissipates into the ambient from the fin set 30. A thermal conductive capability between the first base 10 and the fin set 30 is enhanced via the first heat pipe 40 and the second heat pipes 50. The first evaporating section 42 of the first heat pipe 40 is sandwiched between the first base 10 and the second base 20, and the first condensing sections 44 of the first heat pipe 40 are sandwiched between the second base 20 and the fin set 30. The second evaporating section 52 of the second heat pipe 50 is sandwiched between the first base 10 and the second base 20, and the second condensing section 54 of the second heat pipe 50 is inserted into the through hole 36 of the fin set 30 and located adjacent to the top end of the fin set 30. Thus, heat accumulated in the first base 10 is more quickly conducted to the fin set 30, and the heat dissipation efficiency of the heat dissipation device is thus greatly improved.
Additionally, besides the electronic component mounted on the printed circuit board, there may be other electronic components nearby. In a typical application, the area of the first base 10 is limited to a certain extent, in order to avoid interference with such other electronic components. However, as the first base 10, the second base 20 and the fin set 30 are separate components, the area of the second base 20 positioned on the first base 10 is adaptable, and the size of the fin set 30 positioned on the second base 20 is likewise adaptable. Hence, the area of the second base 20 can be configured to be quite large, and the size of the fin set 30 can be configured to be correspondingly large. Thus the heat dissipation device can provide a large heat dissipation area for efficient heat dissipation, without interfering with the other electronic components mounted on the printed circuit board.
It is to be understood, however, that even though numerous characteristics and advantages of the present embodiment(s) have been set forth in the foregoing description, together with details of the structures and functions of the embodiment(s), the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201110159778.3 | Jun 2011 | CN | national |
