Patent Application
20140370222
This application claims the benefit of Korean Patent Application No. 10-2013-0069480, filed on Jun. 18, 2013, the disclosure of which is hereby incorporated herein by reference in its entirety.
1. Field of the Invention
The present invention relates to a heat-dissipation sheet assembly and more particularly, to a heat-dissipation sheet assembly manufactured by using an electrochemical method.
2. Description of the Related Art
Recently, the structural complexity and preciseness have more and more increased in various electrical and electronic equipment including televisions, computers, medical devices, office equipment, communication equipment, etc. As the electrical and electronic components which are used in these devices and equipment have become smaller in size and the quantity thereof has increased, the heat generated in these components has increased. To efficiently release and disperse the heat generated, heat-dissipation sheets are widely used. Especially, as slim notebooks, tablet PCs, smart phones, plasma display panels (PDP), liquid crystal displays (LCD) and light-emitting diodes (LED) are now made smaller in size and lighter in weight, heat-dissipation sheets are widely used in the devices in which a lot of heat is generated.
However, as shown in
Therefore, it is an object of the present invention to provide a heat-dissipation sheet assembly wherein a heat-dissipation sheet layer is prevented from being damaged even if an external force is applied to the heat-dissipation sheet assembly and no separation occurs between each layer even by the repetitive heat generation.
It is another object of the present invention to provide a heat-dissipation sheet assembly which is easily manufactured by a simple structure and has excellent effects of heat dissipation and dispersion.
In accordance with an aspect of the present invention, there is provided a heat-dissipation sheet assembly comprising: a heat-dissipation sheet layer having good heat conductivity, a protection layer which is electrodeposited on one or both sides of the heat-dissipation sheet layer. The protection layer is electrodeposited on one or both sides of the heat-dissipation sheet layer by immersing the heat-dissipation sheet layer into an aqueous solution for electrodeposition with an added material for electrodeposition and permitting electric current to flow in the aqueous solution for electrodeposition.
The heat-dissipation sheet assembly may be attached to a heat-generating unit by applying an adhesion layer to an underside of the heat-dissipation sheet assembly.
Preferably, the heat-dissipation sheet layer may be preprocessed by immersing the heat-dissipation sheet layer into an aqueous solution containing a copper component before immersing the heat-dissipation sheet layer into the aqueous solution for electrodeposition, for better electrodeposition.
Preferably, the heat-dissipation sheet layer may be a thin film made of a natural graphite, artificial graphite, copper, silver, aluminum or gold sheet. The material for electrodeposition may be gold, silver, copper, aluminium or nickel.
Preferably, the aqueous solution for electrodeposition may be a solution with added sodium cyanide or organic acid silver, or a solution with added nickel sulfamate, nickel chloride and boric acid.
Preferably, the thickness of the heat-dissipation sheet layer may be 10˜40 μm and the thickness of the protection layer may be 0.1˜3 μm.
Preferably, the heat-dissipation sheet assembly may further comprise an adhesion layer to attach the heat-dissipation sheet assembly to the heat-generating unit; and a release paper on an underside of the adhesion layer. The release paper can be easily detached from the adhesion layer.
The above and other features and advantages of the present invention will become more apparent to those of ordinary skill in the art by describing in detail the preferred embodiments thereof with reference to the attached drawings in which:
The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which the preferred embodiments of the invention are shown so that those of ordinary skill in the art can easily carry out the present invention.
As shown in
An important point is that the protection layers 12, 12′ are electrodeposited to the one or both sides of the heat-dissipation sheet layer 11 by using an electrochemical method, without using any adhesives. As a method to electrodeposit the protection layers 12, 12′ to the heat-dissipation sheet layer 11, the material for electrodeposition, such as gold, silver, copper or aluminum, is added, in an adequate ratio, into an aqueous solution for electrodeposition, for example, an aqueous solution with added sodium cyanide or organic acid silver, and then the heat-dissipation sheet layer 11 is immersed in the aqueous solution for electrodeposition with the added material for electrodeposition. Thereafter, when the heat-dissipation sheet layer 11 is connected to a cathode and an anode plate is installed nearby one side or both sides of the heat-dissipation sheet layer 11, electric current is allowed to flow. Then, the material for electrodeposition dissolved in the aqueous solution for electrodeposition is electrodeposited to one side or both sides of the heat-dissipation sheet layer 11, to form the protection layers 12, 12′. If the material of the protection layer, that is, the material for electrodeposition is nickel, the aqueous solution for electrodeposition may be a solution with added nickel sulfamate, nickel chloride and boric acid. If the heat-dissipation sheet layer is preprocessed by being immersed into an aqueous solution containing a copper component before being immersed into the aqueous solution, the electrodeposition may be better enhanced.
As shown in
As described above, when the protection layers 12, 12′ are electrodeposited to the heat-dissipation sheet layer 11, the elements of the protection layers 12, 12′ permeate into an inner structure of the heat-dissipation sheet layer 11 and the bonding force further increases. Therefore, even if heat is repetitively generated from the heat-generating unit 1, the bonding strength between the heat-dissipation sheet layer 11 and the protection layers 12, 12′ does not fall. Accordingly, for example, if a force is applied to pull the heat-dissipation sheet assemblies 10, 10′ from the heat-generating unit 1 for checking or repairing the heat-generating unit 1, the entire heat-dissipation sheet assemblies 10, 10′ will be separated from the heat-generating unit 1 without the heat-dissipation sheet layer 11 itself being damaged or without the heat-dissipation sheet layer 11 and the protection layers 12, 12′ being separated.
The heat-dissipation sheet assemblies 12, 12′ according to the present invention may comprise an adhesion layer 13 to attach the heat-dissipation sheet assemblies 12, 12′ to the heat-generating unit 1, and a release paper to protect this adhesion layer 13. The release paper may be attached to the adhesion layer 13, and can be easily detached from the adhesion layer 13. For the release paper, a material, such as a vinyl film, a polyester film, a paper or a cloth covered with release coating may be used.
In accordance with the present invention, the heat-dissipation sheet assembly has the following effects:
The invention has been described using preferred exemplary embodiments. However, it is to be understood that the scope of the invention is not limited to the disclosed embodiments. On the contrary, the scope of the invention is intended to include various modifications and alternative arrangements within the capabilities of persons skilled in the art using presently known or future technologies and equivalents. The scope of the claims, therefore, should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2013-0069480 | Jun 2013 | KR | national |
