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H01L23/3736

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3736Metallic materials

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Thermal interface material, method of manufacturing the same, and s...
- Patent number 12,243,803
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Seunggeol Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device with submount includi...
- Patent number 12,243,796
- Issue date Mar 4, 2025
- Nichia Corporation
- Tadaaki Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,243,791
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Sunghawn Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising a thermal interface materia...
- Patent number 12,237,242
- Issue date Feb 25, 2025
- Infineon Technologies Austria AG
- Martin Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor circuit structure with direct die heat removal structure
- Patent number 12,224,225
- Issue date Feb 11, 2025
- INVENTION AND COLLABORATION LABORATORY, INC.
- Chao-Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adaptive structure for thermal regulation and optimization
- Patent number 12,224,223
- Issue date Feb 11, 2025
- Raytheon Company
- Edward L. Hieb
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Package structure with metallic layer over the surfaces of a plural...
- Patent number 12,224,224
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,218,025
- Issue date Feb 4, 2025
- Denso Corporation
- Syuhei Miyachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for heat dissipation
- Patent number 12,218,026
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation member and method of manufacturing the same
- Patent number 12,213,286
- Issue date Jan 28, 2025
- DENKA COMPANY LIMITED
- Daisuke Goto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Topside air cooling of electronic packages
- Patent number 12,212,087
- Issue date Jan 28, 2025
- Cobham Advanced Electronic Solutions, Inc.
- Chul Hong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal member and production method therefor
- Patent number 12,209,313
- Issue date Jan 28, 2025
- NGK Electronics Devices, Inc.
- Shigeru Yoshimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor structure and method for manufacturing same
- Patent number 12,211,767
- Issue date Jan 28, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Luguang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient liquid phase bonding compositions and power electronics a...
- Patent number 12,208,448
- Issue date Jan 28, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of processing a semiconductor wafer, semiconductor die, and...
- Patent number 12,205,919
- Issue date Jan 21, 2025
- Infineon Technologies AG
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package heat dissipation including a die attach film
- Patent number 12,199,008
- Issue date Jan 14, 2025
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular microchannel thermal solutions for integrated circuit devices
- Patent number 12,199,012
- Issue date Jan 14, 2025
- Intel Corporation
- Adel Elsherbini
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated power switching device heat sink
- Patent number 12,199,020
- Issue date Jan 14, 2025
- American Axle & Manufacturing, Inc.
- James P. Downs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon nitride sintered body, silicon nitride substrate, and silic...
- Patent number 12,187,651
- Issue date Jan 7, 2025
- Kabushiki Kaisha Toshiba
- Katsuyuki Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material and method for making the same
- Patent number 12,187,951
- Issue date Jan 7, 2025
- Google LLC
- Huijuan Chen
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 12,183,651
- Issue date Dec 31, 2024
- Amkor Technology Japan, Inc.
- Masao Hirobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with enhanced thermal dissipation and method f...
- Patent number 12,183,655
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cooling assembly including coolant channel on the backsi...
- Patent number 12,176,263
- Issue date Dec 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with multiple heat channels
- Patent number 12,176,274
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor component and method for producing a power semi...
- Patent number 12,165,950
- Issue date Dec 10, 2024
- Vitesco Technologies GmbH
- Christina Quest-Matt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder thermal interface material (STIM) with dopant
- Patent number 12,166,004
- Issue date Dec 10, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method of forming
- Patent number 12,154,838
- Issue date Nov 26, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical multichip package with multiple system-on-chip dies
- Patent number 12,148,744
- Issue date Nov 19, 2024
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising metal layer configured for electromagnetic inter...
- Patent number 12,142,577
- Issue date Nov 12, 2024
- QUALCOMM Technologies, Inc.
- Marc Huesgen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance two-phase cooling apparatus for portable applications
- Patent number 12,140,385
- Issue date Nov 12, 2024
- PiMEMS, Inc.
- Payam Bozorgi
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250096175
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- YISEUL HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A COOLING ARRANGEMENT AND COOLING ARRANGEME...
- Publication number 20250096065
- Publication date Mar 20, 2025
- MIBA SINTER AUSTRIA GMBH
- Manuel Pohn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL INTERFACE MATERIAL AND METHOD FOR MAKING THE SAME
- Publication number 20250092296
- Publication date Mar 20, 2025
- Google LLC
- Huijuan Chen
- B82 - NANO-TECHNOLOGY
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH CAVITY, AND AN INTEGRATED DEVIC...
- Publication number 20250096051
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Jaehyun YEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD OF FABRICATING THE SAME
- Publication number 20250096069
- Publication date Mar 20, 2025
- INFINEON TECHNOLOGIES AG
- Adrian Lis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...
- Publication number 20250087553
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20250079374
- Publication date Mar 6, 2025
- Fujitsu Limited
- Shinya SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH STIFFENER STRUCTURE
- Publication number 20250079246
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR INTEGRATED CIRCUIT WITH HEAT DISSIPATION
- Publication number 20250079259
- Publication date Mar 6, 2025
- STMicroelectronics International N.V.
- Jerome LOPEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREFOR
- Publication number 20250069983
- Publication date Feb 27, 2025
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250069986
- Publication date Feb 27, 2025
- Sumitomo Electric Industries, Ltd.
- So TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A HEAT SPREADER, AND AN ELECTRONIC MODULE
- Publication number 20250071945
- Publication date Feb 27, 2025
- Telefonaktiebolaget LM Ericsson (publ)
- Per Ingelhag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERCONNECT FOR INTEGRATED CIRCUITRY
- Publication number 20250062182
- Publication date Feb 20, 2025
- Telefonaktiebolaget LM Ericsson (publ)
- Emil NYLANDER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062186
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Junghoo Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250054828
- Publication date Feb 13, 2025
- Siliconware Precision Industries Co., Ltd.
- Wei-Shen HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING AN IRON AND MAGNETIC SLURRY IN SEMICONDUCTOR ASSEMBLY
- Publication number 20250054833
- Publication date Feb 13, 2025
- Lenovo (United States) Inc.
- Mark K. Summerville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRICALLY CONDUCTIVE CHANNEL STRUCTU...
- Publication number 20250046695
- Publication date Feb 6, 2025
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Wolfgang REINERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH HEAT DISSIPATING PART
- Publication number 20250046669
- Publication date Feb 6, 2025
- DENSO CORPORATION
- Takuya Mitsuhashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING, MANUFACTURING METHOD FOR ELECTRONIC PACKAGING...
- Publication number 20250038091
- Publication date Jan 30, 2025
- CHENGDU HAIGUANG INTEGRATED CIRCUIT DESIGN CO., LTD.
- Shuan Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liquid Metal Packaging Structure For Chip Heat Dissipation
- Publication number 20250038065
- Publication date Jan 30, 2025
- YUNNAN ZHONGXUAN LIQUID METAL TECHNOLOGY CO.,LTD
- Changli CAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250038156
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- YOUNG-JA KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MULTICHIP PACKAGE WITH MULTIPLE SYSTEM-ON-CHIP DIES
- Publication number 20250038163
- Publication date Jan 30, 2025
- Intel Corporation
- Zhichao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT APPARATUS AND CIRCUIT-INTEGRATED MOTOR
- Publication number 20250029889
- Publication date Jan 23, 2025
- Mikuni Corporation
- Yuki KONNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT TO CHIP APPLICATION OF BOILING ENHANCEMENT COATING
- Publication number 20250022769
- Publication date Jan 16, 2025
- MTS IP Holdings Ltd
- Luke Gregory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250022811
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Myungyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORTHOGONAL BRIDGE PACKAGING TECHNOLOGY
- Publication number 20250006699
- Publication date Jan 2, 2025
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE
- Publication number 20250006586
- Publication date Jan 2, 2025
- Invention And Collaboration Laboratory, Inc.
- Chao-Chun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH INDUCTORS AND CAPACITORS THAT ARE EMBEDDED WITHIN...
- Publication number 20240429217
- Publication date Dec 26, 2024
- Monolithic Power Systems, Inc.
- Daocheng HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240421031
- Publication date Dec 19, 2024
- InnoLux Corporation
- Te-Hsun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELL, THREE-DIMENSIONAL MEMORY, AND METHOD OF OPERATING THRE...
- Publication number 20240421032
- Publication date Dec 19, 2024
- Institute of Microelectronics, Chinese Academy of Sciences
- Gang ZHANG
- G11 - INFORMATION STORAGE

Metallic materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermal interface material, method of manufacturing the same, and s...

Method for manufacturing semiconductor device with submount includi...

Semiconductor package

Semiconductor device package comprising a thermal interface materia...

Semiconductor circuit structure with direct die heat removal structure

Adaptive structure for thermal regulation and optimization

Package structure with metallic layer over the surfaces of a plural...

Electronic device

Package structure for heat dissipation

Heat dissipation member and method of manufacturing the same

Topside air cooling of electronic packages

Metal member and production method therefor

Semiconductor structure and method for manufacturing same

Transient liquid phase bonding compositions and power electronics a...

Method of processing a semiconductor wafer, semiconductor die, and...

Package heat dissipation including a die attach film

Modular microchannel thermal solutions for integrated circuit devices

Integrated power switching device heat sink

Silicon nitride sintered body, silicon nitride substrate, and silic...

Thermal interface material and method for making the same

Semiconductor device

Semiconductor device with enhanced thermal dissipation and method f...

Integrated cooling assembly including coolant channel on the backsi...

Multi-die package with multiple heat channels

Power semiconductor component and method for producing a power semi...

Solder thermal interface material (STIM) with dopant

Semiconductor arrangement and method of forming

Optical multichip package with multiple system-on-chip dies

Package comprising metal layer configured for electromagnetic inter...

High performance two-phase cooling apparatus for portable applications

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING A COOLING ARRANGEMENT AND COOLING ARRANGEME...

THERMAL INTERFACE MATERIAL AND METHOD FOR MAKING THE SAME

PACKAGE COMPRISING A SUBSTRATE WITH CAVITY, AND AN INTEGRATED DEVIC...

POWER MODULE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

SEMICONDUCTOR PACKAGE WITH STIFFENER STRUCTURE

PACKAGE FOR INTEGRATED CIRCUIT WITH HEAT DISSIPATION

CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE

A HEAT SPREADER, AND AN ELECTRONIC MODULE

THERMAL INTERCONNECT FOR INTEGRATED CIRCUITRY

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

CONTROLLING AN IRON AND MAGNETIC SLURRY IN SEMICONDUCTOR ASSEMBLY

METHOD FOR MANUFACTURING AN ELECTRICALLY CONDUCTIVE CHANNEL STRUCTU...

ELECTRONIC COMPONENT WITH HEAT DISSIPATING PART

ELECTRONIC PACKAGING, MANUFACTURING METHOD FOR ELECTRONIC PACKAGING...

Liquid Metal Packaging Structure For Chip Heat Dissipation

SEMICONDUCTOR PACKAGE

OPTICAL MULTICHIP PACKAGE WITH MULTIPLE SYSTEM-ON-CHIP DIES

ELECTRONIC CIRCUIT APPARATUS AND CIRCUIT-INTEGRATED MOTOR

DIRECT TO CHIP APPLICATION OF BOILING ENHANCEMENT COATING

SEMICONDUCTOR PACKAGE

ORTHOGONAL BRIDGE PACKAGING TECHNOLOGY

SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE

POWER MODULE WITH INDUCTORS AND CAPACITORS THAT ARE EMBEDDED WITHIN...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

MEMORY CELL, THREE-DIMENSIONAL MEMORY, AND METHOD OF OPERATING THRE...