Patent Application
20140332185
This application claims priority of Chinese Patent Application No. 201310175764.X, filed on May 13, 2013, the disclosure of which is incorporated herein by reference.
1. Field of the Disclosure
The disclosure relates to a heat dissipating system, more particularly to a heat dissipating system with a heat insulating device so that undesirable heat can be dissipated along a predetermined path. This disclosure also relates to a heat insulating device and a method for manufacturing the same.
2. Description of the Related Art
With the continuous creation and development in functions of electronic devices in the information technology industry, performance of chips, such as central processing unit (CPU) or graphic processing unit (GPU), used in the electronic devices, such as laptops, tablet computers, etc., has become ever more powerful. Meanwhile, the size of the electronic devices has become more compact and micronized.
As shown in
Due to micronization of the casing 91, the heat generated by the chip unit 93 during operation or transferred to the heat pipe 91 will be directly transferred to the casing 91. A user tends to be hurt when unintentionally touching the high temperature regions of the casing 91.
Therefore, an object of the disclosure is to provide a heat dissipating system that is capable of dissipating heat generated by a heat source which is disposed in a casing of an electronic apparatus along a predetermined heat dissipating path. Thereby, direct conduction of the heat to the casing is avoided.
The heat dissipating system of this disclosure is adapted to be disposed in the casing of the electronic apparatus in which the heat source is disposed and includes a heat dissipating device and a heat insulating device.
The heat dissipating device is in contact with the heat source and has a predetermined heat dissipating path for dissipating heat generated by the heat source.
The heat insulating device includes a first layer that is in contact with one of the heat source and the heat dissipating device, and a second layer that is bonded to the first layer and that cooperates with the first layer to define an evacuated space therebetween. The distance from the second layer to the casing is smaller than that from the first layer to the casing.
Preferably, the heat dissipating device includes a heat pipe and a fan. The heat pipe has a first end that is in contact with the heat source and a second end that is opposite to the first end and that is connected to the fan. The first layer of the heat insulating device is in contact with the first end of the heat pipe.
Preferably, the first layer of the heat insulating device has a profile conforming with that of the one of the heat source and the heat dissipating device so as to enclose the one of the heat source and the heat dissipating device.
Preferably, each of the first and second layers is made of a metallic material.
Another object of this disclosure is to provide a heat insulating device adapted to be incorporated with a heat dissipating device to be disposed in a casing of an electronic apparatus together. The electronic apparatus further includes a heat source disposed in the casing. The heat dissipating device is in contact with the heat source and has a predetermined heat dissipating path for dissipating heat generated by the heat source. Thereby, direct conduction of the heat to the casing is avoided.
The heat insulating device includes a first layer that is in contact with one of the heat source and the heat dissipating device; and a second layer that is bonded to the first layer and that cooperates with the first layer to define an evacuated space therebetween.
Yet another object of this disclosure is to provide a method for manufacturing a heat dissipating system that includes a heat dissipating device and a heat insulating device, including steps of:
dispensing a solder on a surface of one of a first layer and a second layer of the heat insulating device;
soldering the surface of the one of the first layer and the second layer to the other of the first layer and the second layer;
evacuating a closed space defined by and positioned between the soldered first and second layers, thereby completing formation of the heat insulating device; and
connecting the heat insulating device to the heat dissipating device in such a manner that the heat insulating device is disposed on a heat dissipating path of the heat dissipating device.
The effects of this disclosure reside in the use of the heat insulating device in combination with the heat dissipating device to ensure that the heat generated by the heat source is dissipated according to a predetermined heat dissipating path of the heat dissipating device. Conduction of the heat to the space outside of the heat dissipating device can be avoided. Hence, the heat dissipating efficiency of the electronic apparatus using the heat insulating device is enhanced, and the potentially harmful high temperature regions of the casing can be prevented.
Other features and advantages of the present disclosure will become apparent in the following detailed description of the embodiment with reference to the accompanying drawings, of which:
Referring to
The heat dissipating system 100 of the embodiment includes a heat dissipating device 1 and a heat insulating device 2.
The heat dissipating device 1 includes a heat conducting element 11 and a fan 12. In this embodiment, the heat conducting element 11 is a heat pipe having a first end that is in contact with the heat source 4 and a second end that is opposite to the first end and that is connected to the fan 12, and the fan 12 blows off the heat out of the casing 3. Thereby, a predetermined heat dissipating path of the heat dissipating device 1 is formed. The heat conducting element 11 of the heat dissipating device 1 of this disclosure may have variant types and is not limited to the heat pipe shown in the embodiment, as long as the heat generated by the heat source 4 can be effectively dissipated along the predetermined heat dissipating path.
The heat insulating device 2 of this embodiment is positioned in the predetermined heat dissipating path and includes a first layer 21 and a second layer 22. The first layer 21 is in contact with one of the heat source 4 and the heat dissipating device 1. The second layer 22 is bonded to the first layer 21 and cooperates with the first layer 21 to define an evacuated space 23 therebetween. In this embodiment, the first layer 21 is in contact with the first end of the heat pipe. Preferably, the first and second layers 21, 22 are made of a metallic material. Preferably, the distance from the second layer 22 to the casing 3 is smaller than that from the first layer 21 to the casing 3.
Preferably, as shown in
Referring to
step S1 of dispensing a solder on a surface of one of the first layer 21 and the second layer 22 of the heat insulating device 2;
step S2 of soldering the surface of the one of the first layer 21 and the second layer 22 to the other of the first layer 21 and the second layer 22;
step S3 of evacuating the closed space 23 defined by and positioned between the soldered first and second layers 21, 22, thereby completing the formation of the heat insulating device 2; and
step S4 of connecting the heat insulating device 2 to the heat dissipating device 1 in such a manner that the heat insulating device 2 is disposed on a heat dissipating path of the heat dissipating device 1.
It is noted that the abovementioned steps S2 and S3 may be conducted simultaneously in a vacuum environment. Alternatively, step S3 is conducted in a vacuum apparatus after step S2 is completed.
Preferably, before step S3 and after step S2, the soldered first and second layers 21, 22 may be moved to pass through a reflow oven. Since the atmospheric pressure is greater than the pressure inside the closed space 23, the first and second layers 21, 22 cannot be separated from each other and the pores present in the solder can be eliminated during the reflow heating process. Thereby, the bonding strength between the first and second layers 21, 22 is enhanced.
Preferably, in step S4, the heat dissipating device 1 is connected to the heat insulating device 2 by soldering techniques so that the heat insulating device 2 is located between the heat dissipating device 1 and the casing 3.
Moreover, when the size of the heat insulating device 2 is sufficiently large relative to the casing 3 as to be able to cover most of electronic components inside the casing 3, the heat insulating device 2 provides a heat-shielding effect since the first and second layers 21, 22 are made of a metallic material.
In sum, with the provision of the heat dissipating device 1 cooperating with the heat insulating device 2, the heat generated by the heat source 4 is blocked from being dissipated to the space outside the heat dissipating device 1 when encountering the heat insulating device 2 having the evacuated space 23. In such a manner, the heat is concentrated to be dissipated along the predetermined heat dissipating path of the heat dissipating device 1. The heat dissipating efficiency is enhanced and the potentially harmful high temperature region of the casing 3 is eliminated.
While the present disclosure has been described in connection with the embodiment, it is understood that this disclosure is not limited to the disclosed embodiment but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all such modifications and equivalent arrangements.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201310175764.X | May 2013 | CN | national |
