Patent Application
20130014917
(a) Field of the Invention
The present invention relates to heat sink technology and more particularly, to a heat pipe-attached heat sink with bottom radiation fins, which uses a bonding agent to bond heat pipes to locating grooves of radiation fins and to keep the heat-absorbing face of each heat pipe in flush with a flat abutment edge of an extension abutment strip of each radiation fin for direct contact with the heat source.
(b) Description of the Prior Art
A conventional heat pipe attached heat sink is known comprising: a radiation fin module, one or a number of heat pipes and a metal bottom block. During application, the bottom block is kept in direct contact with the heat source, enabling waste heat to be transferred by the bottom block to the radiation fins of the radiation fin module through the heat pipe(s) for quick dissipation. This design of heat sink utilizes the bottom block, the heat pipe(s) and the radiation fin module to transfer heat in proper order. However, this heat transfer method has a low heat dissipation speed and performance. There is known another prior art heat sink design, which eliminates the use of a metal bottom block and has the heat-absorbing end of each heat pipe be directly press-fitted into a respective mounting groove on each of a number of radiation fins. After connection between heat pipes and radiation fins, heat pipes are kept flattened and kept in parallel for direct contact with the heat source for quick transfer of waste heat from the heat source to the radiation fins for quick dissipation. According to this design, the radiation fins are not directly kept in contact with the surface of the heat source for direct dissipation of waste heat.
The present invention has been accomplished under the circumstances in view. It is the main object of the present invention to provide a heat pipe-attached heat sink, which eliminates the drawbacks of the aforesaid various prior art designs.
To achieve this and other objects of the present invention, a heat pipe-attached heat sink comprises a radiation fin module, which comprises a plurality of radiation fins arranged in parallel, each radiation fin comprising an extension abutment strip having a flat abutment edge extending perpendicular relative to the respective radiation fin and a plurality of locating grooves located on the flat abutment edge, the flat abutment edge of one radiation fin being stopped against the flat abutment edge of another said the radiation fin in a flush manner, a plurality of heat pipes respectively press-fitted into the locating grooves of the extension abutment strips of the radiation fins each having a flat heat-absorbing face kept in flush with the flat abutment edges of the radiation fins of the radiation fin module, and a bonding agent applied to the locating grooves of the radiation fins to bond the heat pipes to the radiation fins. Further, the heat pipes are peripherally and tightly abutted against one another. As the flat heat-absorbing faces of the heat pipes are kept in flush with the flat abutment edges of the radiation fins of the radiation fin module, the heat pipes and the radiation fins can be directly attached to the heat source for quick dissipation of waste heat from the heat source.
Further, the bonding agent can be tin solder or any suitable material having high heat transfer coefficient.
Further, stop blocks may be fastened to the radiation fins and stopped against at least one of two opposite lateral sides of the flat abutment edges of the radiation fins of the radiation fin module to reinforce the structural strength.
Further, the stop block comprises a plurality of retaining grooves and retaining ribs located on the bottom side thereof and forced into engagement with the radiation fins. Further, each stop block has a top end edge kept in flush with the flat heat-absorbing faces of the heat pipes and the flat abutment edges of the radiation fins of the radiation fin module for direct contact with the heat source.
Referring to
The radiation fin module 10 consists of a plurality of radiation fins 1 arranged in parallel. Each radiation fin 1 comprises an extension abutment strip 11, as shown in
The heat pipes 20 are accommodated in the locating grooves 13 of the radiation fins 1 of the radiation fin module 10 and tightly abutted against one another side by side without leaving any gap between each two adjacent heat pipes 20, each having a flat heat-absorbing face 201 kept in flush with the flat abutment edges 12 of the radiation fins 1 of the radiation fin module 10.
The bonding agent 30 is applied to the locating grooves 13 of the radiation fins 1 of the radiation fin module 10 to bond the heat pipes 20 to the radiation fins 1. The adhesive 30 can be tin solder or thermal adhesive.
During installation, the bonding agent 30 is applied to the locating grooves 13 of the radiation fins 1 of the radiation fin module 10, and then the heat pipes 20 are attached to the locating grooves 13 and abutted against one another side by side keeping the flat heat-absorbing face 201 of each heat pipe 20 in flush with the flat abutment edges 12 of the radiation fins 1 of the radiation fin module 10 for direct contact with the heat source to facilitate quick dissipation of waste heat from the heat source.
Further, stop blocks 4 may be bonded to the radiation fins 1 of the radiation fin module 10 and stopped against the flat abutment edges 12 of the radiation fins 1 at one or each of two opposite lateral sides to reinforce the structural strength. As illustrated in
Referring to
The number of the locating grooves 13 of the radiation fins 1 of the radiation fin module 10 is determined subject to the number of the heat pipes 20. Further, the locating grooves 13 of the radiation fins 1 may be variously configured. For example, the locating grooves 13 can be made having a smoothly arched bottom wall (see
The aforesaid bottom notch 131 is not requisite and can be omitted. As illustrated in
Although particular embodiments of the invention have been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the invention. Accordingly, the invention is not to be limited except as by the appended claims.
