The present invention generally relates to thermal management systems for semiconductor devices and, more particularly, to systems for cooling such semiconductor devices during burn-in testing.
In the conventional manufacture of semiconductor devices, semiconductor wafers are first produced in batches. Each semiconductor wafer can contain many individual electronic devices or electronic circuits, which are known as dies. Each die is electrically tested by connecting it to special purpose test equipment. Probes, which are connected to the test equipment, are brought into contact with the die to be tested. This generally occurs at a prober station, which conventionally includes a platform arranged for supporting the wafer. It is important to test each individual circuit chip die while it is still attached in a wafer, and to also test the individual integrated circuit devices once they have been packaged for their intended use. In many testing applications, the tests must be performed at elevated temperatures which, if not regulated, could cause damage to the chip during testing. Accordingly, automated test systems are commonly outfitted with temperature control systems which can control the temperature of a semiconductor wafer or packaged integrated circuit under test.
For example, and referring to
In many cases such support platforms are required to be able to both heat and cool the device. Many types of temperature-controlled support platforms are known and are widely available. Cooling is very often provided by a heat sink that is cooled by a recirculating fluid, or in other designs by passing a fluid through the support platform without recirculating it. The fluid can be a liquid or a gas, usually air in the latter case. The liquid or air can be chilled for greater cooling effect in passing through the support platform, and can be recirculated for greater efficiency. A support platform cooled by means of a fluid chilled to a temperature below ambient temperature enables device probing at temperatures below ambient. In general, conventional heat-sink designs often incorporate simple cooling channels cross-drilled and capped in the support platform.
None of the foregoing systems and methods have been found to be completely satisfactory.
The present invention provides a cooling system for a semiconductor device burn-in test station comprising a heat pipe including a tubular body having an exterior surface and a central passageway. A capillary wick is disposed on at least an evaporator portion of the central passageway and a base seals off the evaporator portion of the central passageway. The base is sized and shaped so as to be releasably thermally engaged with a semiconductor device during burn-in testing. An elongate tube is coiled around the outer surface of the heat pipe so as to form a first set of coils that are often brazed to that outer surface. The open ends of the elongate tube are arranged in flow communication with a pressurized source of chilled coolant fluid so that the coolant circulates through the first set of coils and thereby removes heat from the heat pipe.
These and other features and advantages of the present invention will be more fully disclosed in, or rendered obvious by, the following detailed description of the preferred embodiment of the invention, which is to be considered together with the accompanying drawings wherein like numbers refer to like parts and further wherein:
This description of preferred embodiments is intended to be read in connection with the accompanying drawings, which are to be considered part of the entire written description of this invention. The drawing figures are not necessarily to scale and certain features of the invention may be shown exaggerated in scale or in somewhat schematic form in the interest of clarity and conciseness. In the description, relative terms such as “horizontal,” “vertical,” “up,” “down,” “top” and “bottom” as well as derivatives thereof (e.g., “horizontally,” “downwardly,” “upwardly,” etc.) should be construed to refer to the orientation as then described or as shown in the drawing figure under discussion. These relative terms are for convenience of description and normally are not intended to require a particular orientation. Terms including “inwardly” versus “outwardly,” “longitudinal” versus “lateral” and the like are to be interpreted relative to one another or relative to an axis of elongation, or an axis or center of rotation, as appropriate. Terms concerning attachments, coupling and the like, such as “connected” and “interconnected,” refer to a relationship wherein structures are secured or attached to one another either directly or indirectly through intervening structures, as well as both movable or rigid attachments or relationships, unless expressly described otherwise. The term “operatively connected” is such an attachment, coupling or connection that allows the pertinent structures to operate as intended by virtue of that relationship. In the claims, means-plus-function clauses are intended to cover the structures described, suggested, or rendered obvious by the written description or drawings for performing the recited function, including not only structural equivalents but also equivalent structures.
Referring to
Wick 15 is disposed upon interior surface 28 of vessel 10, and may comprise adjacent layers of screening or a sintered powder structure with interstices between the particles of powder. In one embodiment, wick 15 may comprise sintered copper powder, sintered aluminum-silicon-carbide (AlSiC) or copper-silicon-carbide (CuSiC) having an average thickness of about 0.1 mm to 1.0 mm. The working fluid (not shown) may comprise any of the well known two-phase vaporizable liquids, e.g., water, alcohol, freon, etc.
Heat exchanger coil 7 comprises an elongate hollow tube 35 having a central passageway 37 of stainless steel, copper or its alloys, or the like highly thermally conductive material. Tube 35 includes a first conduit end 40 and a second conduit end 42 that are in fluid communication with one another through central passageway 37. Heat exchanger coil 7 is coiled around the outer surface 21 of vessel 10 such that a first set of interior coils 45 are formed adjacent to outer surface 21 (
In operation, base 27 of heat pipe 5 is exposed to one or more heat sources, e.g., semiconductor chip F, while at the same time first end 22 of heat pipe 5 is thermally engaged with heat exchanger coil 7, which is at a substantially lower temperature than semiconductor chip F. Heat is absorbed from semiconductor chip F by evaporation of liquid-phase working fluid 20 to vapor phase inside heat pipe 5 at second end 24. Working fluid 20 in vapor phase with its absorbed heat load is thermodynamically driven first end 22 of heat pipe 5 due to a pressure difference created between second end 24 and first end 22 by the heat generated by semiconductor chip F (
The heat load created by operation of semiconductor chip F in test mode is rejected by working fluid 20 to vessel 10 adjacent to first end 22, with consequent condensation of working fluid 20 to liquid phase. Then, without leaving the same heat pipe chamber, condensed working fluid 20 is returned in liquid phase to second end 24 by capillary wick 15. As this two-phase heat exchange cycle occurs within heat pipe 5, conduit ends 40 and 42 of elongate tube 35 are arranged in flow communication with a pressurized source 50 of chilled coolant fluid 51. As a result, chilled coolant circulates through first set of coils 45 and thereby removes heat from first end 22 of heat pipe 5.
It is to be understood that the present invention is by no means limited only to the particular constructions herein disclosed and shown in the drawings, but also comprises any modifications or equivalents within the scope of the claims.
This application claims the benefit of U.S. Provisional Patent Application No. 60/499,483, filed Sep. 2, 2003 and U.S. Provisional Patent Application No. 60/502,125, filed Sep. 11, 2003.
Number | Name | Date | Kind |
---|---|---|---|
2137044 | Dawson | Nov 1938 | A |
4037830 | Poluzzi et al. | Jul 1977 | A |
4213698 | Firtion et al. | Jul 1980 | A |
RE31053 | Firtion et al. | Oct 1982 | E |
4551192 | Di Milia et al. | Nov 1985 | A |
4609037 | Wheeler et al. | Sep 1986 | A |
4633371 | Nagy et al. | Dec 1986 | A |
4784213 | Eager et al. | Nov 1988 | A |
5001423 | Abrami et al. | Mar 1991 | A |
5084671 | Miyata et al. | Jan 1992 | A |
5382311 | Ishikawa et al. | Jan 1995 | A |
5383971 | Selbrede | Jan 1995 | A |
5412535 | Chao et al. | May 1995 | A |
5413167 | Hara et al. | May 1995 | A |
5435379 | Moslehi et al. | Jul 1995 | A |
5458687 | Shichida et al. | Oct 1995 | A |
5460684 | Saeki et al. | Oct 1995 | A |
5474877 | Suzuki | Dec 1995 | A |
5478609 | Okamura | Dec 1995 | A |
5534073 | Kinoshita et al. | Jul 1996 | A |
5582242 | Hamburgen et al. | Dec 1996 | A |
5588827 | Muka | Dec 1996 | A |
5610529 | Schwindt | Mar 1997 | A |
5632158 | Tajima | May 1997 | A |
5663653 | Schwindt et al. | Sep 1997 | A |
5721090 | Okamoto et al. | Feb 1998 | A |
5730803 | Steger et al. | Mar 1998 | A |
5738165 | Imai | Apr 1998 | A |
5762714 | Mohn et al. | Jun 1998 | A |
5820723 | Benjamin et al. | Oct 1998 | A |
5830808 | Chapman | Nov 1998 | A |
5885353 | Strodtbeck et al. | Mar 1999 | A |
5894887 | Kelsey et al. | Apr 1999 | A |
5904776 | Donde et al. | May 1999 | A |
5904779 | Dhindsa et al. | May 1999 | A |
5944093 | Viswanath | Aug 1999 | A |
5958140 | Arami et al. | Sep 1999 | A |
6032724 | Hatta | Mar 2000 | A |
6037793 | Miyazawa et al. | Mar 2000 | A |
6073681 | Getchel et al. | Jun 2000 | A |
6245202 | Edamura et al. | Jun 2001 | B1 |
6313649 | Harwood et al. | Nov 2001 | B1 |
6394797 | Sugaya et al. | May 2002 | B1 |
6471913 | Weaver et al. | Oct 2002 | B1 |
6583638 | Costello et al. | Jun 2003 | B1 |
6700641 | Shiraishi | Mar 2004 | B1 |
6725909 | Luo | Apr 2004 | B1 |
6771086 | Lutz et al. | Aug 2004 | B1 |
6793009 | Sarraf | Sep 2004 | B1 |
6867974 | Luo | Mar 2005 | B1 |
6938680 | Garner et al. | Sep 2005 | B1 |
20030066628 | Mochizuki et al. | Apr 2003 | A1 |
Number | Date | Country |
---|---|---|
1814606 | May 1993 | RU |
Number | Date | Country | |
---|---|---|---|
20050068734 A1 | Mar 2005 | US |
Number | Date | Country | |
---|---|---|---|
60502125 | Sep 2003 | US | |
60499483 | Sep 2003 | US |