1. Technical Field
The disclosure generally relates to a heat sink apparatus with heat pipes.
2. Description of Related Art
Electronic components in computers, such as central processing units (CPUs), may generate a lot of heat during normal operations. Excess heat may deteriorate the operational stability of the electronic components and may damage the electronic components. Thus, excess heat must be removed quickly to maintain an acceptable operating temperature of the CPUs and other electronic components in the computers. One known method for removing heat from the CPU is by mounting a heat sink apparatus on the CPU. Such heat sink apparatus may include a heat sink and a plurality of heat pipes mounted on the heat sink. However, the heat pipes may easily come into contact other electronic elements in the computer which may cause undesirable effects on the other electronic elements.
Thus, there is room for improvement within the art.
The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Referring to
The first heat pipe 30 may include a first receiving portion 301, a first body 302, and a first connecting portion 303. The first connection portion 303 has a first end connected to the first receiving portion 301, and a second end connected to the first body 302. The first receiving portion 301 is in contact with an upper surface of the base 10 to carry the excess heat away from a heat generating element. The first body 302 extends through the fin module 20 to deliver the excess heat to the fin module 20 for dispersion. The first receiving portion 301, the first body 302, and the first connecting portion 303 may be on a first plane. The first heat pipe 30 may has a U-shaped cross-section, taken along the first plane.
The second heat pipe 40 may include a second receiving portion 401, a second body 402, and a second connecting portion 403. The second connection portion 403 has a first end connected to the second receiving portion 401, and a second end connected to the second body 402. The second receiving portion 401 is in contact with the upper surface of the base 10 to carry the excess heat away from a heat generating element. The second body 402 extends though the fin module 20 to deliver the excess heat to the fin module 20 for dispersion. The second receiving portion 401, the second body 402, and the second connecting portion 403 may be on a second plane. The second heat pipe 40 may has a U-shaped cross-section, taken along the second plane.
A lower surface of the base 10 may be used for contacting the heat generating element, such as a CPU. The upper surface of the base 10 may comprises a first slot 101 and a second slot 102. The first slot 101 and the second slot 102 may have U-shaped cross-sections, taken along a plane substantially perpendicular to the upper surface of the base 10. The first slot 101 may be substantially parallel to the second slot 102.
The fin module 20 includes a plurality of fins 201. Each of the plurality of fins 201 is substantially perpendicular to the base 10. The fin module 20 may further comprise a first through hole 202 and a second through hole 203. A distance, measured on a plane perpendicular to the upper surface of the base 10, between the first through hole 202 and the second through hole 203 is greater than that between the first slot 101 and the second slot 102. The fin module 20 may further comprise a first association slot 204 and a second association slot 205, wherein the first association slot 204 and the second association slot 205 are relatively located to match the first slot 101 and the second slot 102, respectively. The first association slot 204 and the second association slot 205 may have U-shaped cross-sections, taken along a plane substantially perpendicular to the upper surface of the base 10.
Referring to
It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of embodiments, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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201110058719.7 | Mar 2011 | CN | national |