This application claims the benefit of the filing date of Chinese patent application No. 202210523989.9 filed on May 13, 2022, the disclosure of which is hereby incorporated by reference in its entirety.
The present application generally relates to semiconductor technologies, and more particularly, to a heat spreader for use with a semiconductor component, a semiconductor device incorporating the heat spreader, and a method for making the semiconductor device.
Semiconductor devices are commonly found in modern electronic products, which perform a wide range of functions, such as signal processing, high-speed calculations, transmitting and receiving electromagnetic signals, controlling electronic devices, and creating visual images for television displays. An integrated circuit can be fabricated within a semiconductor die. The semiconductor die can also be referred to as a chip, and the die can be a so-called “flip-chip”. A flip-chip has a surface that includes conductive protrusions, which can be referred to as “bumps”.
During operation, the integrated circuits in the die can generate heat which requires a heat spreader to transfer from the die to a surrounding environment. A conventional heat spreader is usually attached onto a substrate via its foot portion, and thus a mounting space is required on the substrate. However, according to recent demands, lots of additional components are mounted on the substrate and surrounding the die, such as a big die and small components arrangement used in a fcBGA-SiP package. Under such circumstances, there may not be enough space on the substrate for mounting the heat spreader anymore. In addition, the conventional heat spreaders are unlikely to fulfill the growing demands of heat dissipation due to the increasing density of electronic components integrated within a single semiconductor package.
Therefore, a need exists for an improved heat spreader for use with semiconductor components.
An objective of the present application is to provide a heat spreader for use with a semiconductor component, a semiconductor device incorporating the heat spreader and a method for making the semiconductor device.
In an aspect of the present application, there is provided a heat spreader for use with a semiconductor component. The heat spreader comprises: a body having a bottom surface to be in thermal contact with the semiconductor component, and a top surface opposite to the bottom surface; a plurality of holes disposed at a non-peripheral region of the body, wherein each hole passes through the body between the top surface and the bottom surface; and a plurality of extensions each being disposed within one of the plurality of holes and extending from the top surface and downward below the bottom surface, wherein the plurality of extensions are configured to hold the semiconductor component when the heat spreader is mounted with the semiconductor component.
In an embodiment, the plurality of holes and the plurality of extensions are arranged in a two-dimensional array on the body.
In an embodiment, the plurality of extensions are integrally formed with the body.
In an embodiment, the plurality of extensions are bent away from the top surface to hold the semiconductor component therein.
In an embodiment, the plurality of holes are formed by cutting the body.
In an embodiment, the plurality of holes and the plurality of extensions are formed by cutting in the body non-closed slits each separating an extension from a respective hole.
In another aspect of the present application, there is provided a semiconductor device, comprising: a semiconductor component; a heat spreader, wherein the heat spreader comprises: a body having a bottom surface in thermal contact with the semiconductor component, and a top surface opposite to the bottom surface; a plurality of holes disposed at a non-peripheral region of the body, wherein each hole passes through the body between the top surface and the bottom surface; and a plurality of extensions each being disposed within one of the plurality of holes and extending from the top surface and downward below the bottom surface, wherein the plurality of extensions are configured to hold the semiconductor component.
In a further aspect of the present application, there is provided a method for making a semiconductor device, comprising: providing a semiconductor component; providing a heat spreader having a body, a plurality of holes and a plurality of extensions; wherein the body has a bottom surface and a top surface opposite to the bottom surface, and the plurality of holes are disposed at a non-peripheral region of the body; attaching the bottom surface of the heat spreader with the semiconductor component; and bending the plurality of extensions away from the top surface of the body and downward below the bottom surface of the body to engage each extension with a side face of the semiconductor component.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only, and are not restrictive of the invention. Further, the accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
The drawings referenced herein form a part of the specification. Features shown in the drawing illustrate only some embodiments of the application, and not of all embodiments of the application, unless the detailed description explicitly indicates otherwise, and readers of the specification should not make implications to the contrary.
The same reference numbers will be used throughout the drawings to refer to the same or like parts.
The following detailed description of exemplary embodiments of the application refers to the accompanying drawings that form a part of the description. The drawings illustrate specific exemplary embodiments in which the application may be practiced. The detailed description, including the drawings, describes these embodiments in sufficient detail to enable those skilled in the art to practice the application. Those skilled in the art may further utilize other embodiments of the application, and make logical, mechanical, and other changes without departing from the spirit or scope of the application. Readers of the following detailed description should, therefore, not interpret the description in a limiting sense, and only the appended claims define the scope of the embodiment of the application.
In this application, the use of the singular includes the plural unless specifically stated otherwise. In this application, the use of “or” means “and/or” unless stated otherwise. Furthermore, the use of the term “including” as well as other forms such as “includes” and “included” is not limiting. In addition, terms such as “element” or “component” encompass both elements and components including one unit, and elements and components that include more than one subunit, unless specifically stated otherwise. Additionally, the section headings used herein are for organizational purposes only, and are not to be construed as limiting the subject matter described.
As used herein, spatially relative terms, such as “beneath”, “below”, “above”, “over”, “on”, “upper”, “lower”, “left”, “right”, “vertical”, “horizontal”, “side” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly. It should be understood that when an element is referred to as being “connected to” or “coupled to” another element, it may be directly connected to or coupled to the other element, or intervening elements may be present.
Referring to
In some embodiments, the extensions 105 may be stamped or pressed to form on its surface a convex portion such as a contact point or a rib. When the heat spreader 100 is attached to a semiconductor component, the convex portions can be in direct contact with the side face of the semiconductor component and increase frictions between the extensions 105 and the semiconductor component. In some preferred embodiments, there may be grooves or recesses on the side faces of the semiconductor component, which may receive the respective convex portions of the extensions 105 when the heat spreader 100 is attached with the semiconductor component. In this way, the engagement between the heat spreader 100 and the semiconductor component can be further improved.
In the embodiment shown in
In some embodiments, the body 101 and the extensions 105 are formed as an integral structure and are thus made of the same material. Specifically, the holes 104 and extensions 105 can be formed by cutting such as laser cutting. For example, a non-closed slit can be formed by cutting the body 101, which defines the hole and the tab within the hole. Further, the tab can be bent by an angle substantially equal to 90 degrees relative to the bottom surface 103. In some examples, the tabs can be bent by another angle such as 80 degrees, 85 degrees, 88 degrees, 89 degrees or other suitable degrees. In this way, the bent tabs, or the extensions, can provide greater holding forces when the heat spreader 100 is mounted onto a semiconductor component. It can be understood that the heat spreader 100 can be made of metal or other materials with certain flexibility and rigidness, which creates interference fit between the extensions and the semiconductor component. In some other examples, the extensions 105 can be attached to the body 101 via adhering, welding or other suitable attachment process. Alternatively, the extensions can be made of a material different from the material of the body 101.
The heat spreader 100 as shown in
Now referring to
As shown in
The semiconductor device 200 as shown in
At step 301, at least one semiconductor component 201 and a heat spreader are provided. The semiconductor component 201 can be attached to the substrate 202. In some embodiments, two or more semiconductor components 201 can be provided and the additional electronic components 203 may be attached to the substrate 202 as well. Moreover, the heat spreader 100 has a body 101 with a top surface 102 and a bottom surface 103. A plurality of holes 104 are disposed at a non-peripheral region of the body 101. At this time, unbent tabs may be formed within the holes respectively.
At step 302, the heat spreader 100 and the semiconductor component 201 are attached with each other such that their facing faces are in thermal contact with each other. In particular, the bottom surface 103 of the heat spreader 100 may be in direct contact with the semiconductor component 201. Alternatively, the heat spreader 100 can be in thermal contact with the semiconductor component 201 by way of thermal interface material, such as thermal interface material layers.
At step 303, the extensions 105 are bent away from the top surface 102 of the body 101, and downward below the bottom surface 103, to engage respective side faces of the semiconductor component 201. As can be seen in
It should be noted that although in the above method 300 the attaching step 302 is prior to the bending step 303, in some other embodiments, the extensions 105 can be pre-bent, i.e., prior to being attached with the semiconductor component 201. For example, the extensions 105 can be pre-bent downward below the bottom surface 103. Afterwards, the heat spreader can be further attached with the semiconductor component, and if any of the extensions cannot fit the side face of the semiconductor component well, an angle of the extension can be adjusted.
Specifically, the dot-and-dash line rectangle shown in
Now referring to
As shown in
The discussion herein included numerous illustrative figures that showed various portions of a heat spreader for use with a semiconductor component and method of manufacturing thereof. For illustrative clarity, such figures did not show all aspects of each example assembly. Any of the example assemblies and/or methods provided herein may share any or all characteristics with any or all other assemblies and/or methods provided herein.
Various embodiments have been described herein with reference to the accompanying drawings. It will, however, be evident that various modifications and changes may be made thereto, and additional embodiments may be implemented, without departing from the broader scope of the invention as set forth in the claims that follow. Further, other embodiments will be apparent to those skilled in the art from consideration of the specification and practice of one or more embodiments of the invention disclosed herein. It is intended, therefore, that this application and the examples herein be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following listing of exemplary claims.
Number | Date | Country | Kind |
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202210523989.9 | May 2022 | CN | national |