Patent Application
20230387280
The invention relates to a high electron mobility transistor (HEMT) and fabrication method thereof.
High electron mobility transistor (HEMT) fabricated from GaN-based materials have various advantages in electrical, mechanical, and chemical aspects of the field. For instance, advantages including wide band gap, high break down voltage, high electron mobility, high elastic modulus, high piezoelectric and piezoresistive coefficients, and chemical inertness. All of these advantages allow GaN-based materials to be used in numerous applications including high intensity light emitting diodes (LEDs), power switching devices, regulators, battery protectors, display panel drivers, and communication devices.
According to an embodiment of the present invention, a method for fabricating high electron mobility transistor (HEMT) includes the steps of forming a buffer layer on a substrate, forming a barrier layer on the buffer layer, forming a p-type semiconductor layer on the barrier layer, forming a titanium nitride (TiN) layer on the p-type semiconductor layer as a nitrogen to titanium (N/Ti) ratio of the TiN layer is greater than 1, forming a passivation layer on the TiN layer and the barrier layer, removing the passivation layer to form an opening, forming a gate electrode in the opening, and then forming a source electrode and a drain electrode adjacent to two sides of the gate electrode on the buffer layer.
According to another aspect of the present invention, a high electron mobility transistor (HEMT) includes a buffer layer on a substrate, a barrier layer on the buffer layer, a p-type semiconductor layer on the barrier layer, and a titanium nitride (TiN) layer on the p-type semiconductor layer. Preferably, a nitrogen to titanium (N/Ti) ratio of the TiN layer is greater than 1.
These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings.
Referring to
Next, a selective nucleation layer (not shown) and a buffer layer 14 are formed on the substrate 12. According to an embodiment of the present invention, the nucleation layer preferably includes aluminum nitride (AlN) and the buffer layer 14 is preferably made of III-V semiconductors such as gallium nitride (GaN), in which a thickness of the buffer layer 14 could be between 0.5 microns to 10 microns. According to an embodiment of the present invention, the formation of the buffer layer 14 on the substrate 12 could be accomplished by a molecular-beam epitaxy (MBE) process, a metal organic chemical vapor deposition (MOCVD) process, a chemical vapor deposition (CVD) process, a hydride vapor phase epitaxy (HVPE) process, or combination thereof.
Next, a selective unintentionally doped (UID) buffer layer (not shown) could be formed on the surface of the buffer layer 14. In this embodiment, the UID buffer layer is preferably made of III-V semiconductors such as gallium nitride (GaN) or more specifically unintentionally doped GaN. According to an embodiment of the present invention, the formation of the UID buffer layer on the buffer layer 14 could be accomplished by a molecular-beam epitaxy (MBE) process, a metal organic chemical vapor deposition (MOCVD) process, a chemical vapor deposition (CVD) process, a hydride vapor phase epitaxy (HVPE) process, or combination thereof.
Next, a barrier layer 16 is formed on the surface of the buffer layer 14 or UID buffer layer. In this embodiment, the barrier layer 16 is preferably made of III-V semiconductor such as n-type or n-graded aluminum gallium nitride (AlxGa1-xN), in which 0<x<1, the barrier layer 20 preferably includes an epitaxial layer formed through epitaxial growth process, and the barrier layer 16 could include dopants such as silicon or germanium. Similar to the buffer layer 14, the formation of the barrier layer 16 could be accomplished by a molecular-beam epitaxy (MBE) process, a metal organic chemical vapor deposition (MOCVD) process, a chemical vapor deposition (CVD) process, a hydride vapor phase epitaxy (HVPE) process, or combination thereof.
Next, a p-type semiconductor layer 18 and a metal nitride layer such as a titanium nitride (TiN) layer 20 is formed on the barrier layer 16 and then a photo-etching process is conducted to remove part of the TiN layer 20 and part of the p-type semiconductor layer 18. In this embodiment, the p-type semiconductor layer 32 is a III-V compound semiconductor layer preferably including p-type GaN (pGaN) and the formation of the p-type semiconductor layer 18 on the barrier layer 16 could be accomplished by a molecular-beam epitaxy (MBE) process, a metal organic chemical vapor deposition (MOCVD) process, a chemical vapor deposition (CVD) process, a hydride vapor phase epitaxy (HVPE) process, or combination thereof.
It should be noted that during the formation of the TiN layer 20, it would be desirable to adjust the power of the semiconductor equipment and the ratio of the gas injected so that the nitrogen to titanium (N/Ti) ratio of the TiN layer 20 is greater than 1 of more specifically at 1.042 and a (200) orientation to (111) orientation or (200)/(111) orientation ratio of the TiN layer 20 is greater than 0.6. Preferably, the (200)/(111) orientation ratio at the center region of the TiN layer 20 is adjusted between 0.735 to 0.745 or most preferably at 0.740 while the (200)/(111) orientation ratio at the edge region of the TiN layer 20 is between 0.730 to 0.740 or most preferably at 0.734. By using the aforementioned parameters to adjust the nitrogen to titanium (N/Ti) ratio and the ratio between (200) orientation and (111) orientation of the TiN layer 20, it would be desirable to increase the overall strength of the TiN layer 20 thereby improving protection for the p-type semiconductor layer 18 underneath.
Next, as shown in
In this embodiment, the gate electrode 26, the source electrode 28, and the drain electrode 30 are preferably made of metal, in which the gate electrode 26 is preferably made of Schottky metal while the source electrode 28 and the drain electrode 30 are preferably made of ohmic contact metals. According to an embodiment of the present invention, each of the gate electrode 26, source electrode 28, and drain electrode 30 could include gold (Au), Silver (Ag), platinum (Pt), titanium (Ti), aluminum (Al), tungsten (W), palladium (Pd), or combination thereof. Preferably, it would be desirable to conduct an electroplating process, sputtering process, resistance heating evaporation process, electron beam evaporation process, physical vapor deposition (PVD) process, chemical vapor deposition (CVD) process, or combination thereof to form electrode materials in the aforementioned openings, and then pattern the electrode materials through one or more etching processes to form the gate electrode 26, source electrode 28, and the drain electrode 30. This completes the fabrication of a HEMT according to an embodiment of the present invention.
Overall, the present invention preferably adjusts the power of the semiconductor equipment and the ratio of the gas injected when the TiN layer 20 is formed on the surface of the p-type semiconductor layer 18 so that the nitrogen to titanium (N/Ti) ratio of the TiN layer 20 is greater than 1 of more specifically at 1.042 and a (200)/(111) orientation ratio of the TiN layer 20 is greater than 0.6. Preferably, the (200)/(111) orientation ratio at the center region of the TiN layer 20 is adjusted between 0.735 to 0.745 or most preferably at 0.740 whereas the (200)/(111) orientation ratio at the edge region of the TiN layer 20 is between 0.730 to 0.740 or most preferably at 0.734. By using the aforementioned parameters to adjust the nitrogen to titanium (N/Ti) ratio and the ratio between (200) orientation and (111) orientation of the TiN layer 20, it would be desirable to increase the overall strength of the TiN layer 20 thereby improving protection for the p-type semiconductor layer 18 underneath.
According to an embodiment of the present invention, the TiN layer fabricated from the aforementioned process has characteristics of both anti-etching and anti-oxidation. In the anti-etching aspect, in contrast to that the overall thickness of the TiN layer may be lost up to 13 nm or more such as 13.35 nm during conventional approach for fabricating the TiN layer, the TiN layer of the present invention would only lost approximately 7.25 nm of its overall thickness during the fabrication. Moreover, in the anti-oxidation aspect, in contrast to that the overall thickness of the TiN layer could be consumed or lost up to 4 nm or more specifically 4.962 nm or more during conventional approach for fabricating the TiN layer, the TiN layer of the present invention would only lost approximately 2.29 nm of its overall thickness during the fabrication. It is evident that the novel TiN layer fabricated according to the aforementioned approach shows significant improvement in both anti-etching and anti-oxidation.
Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202210597758.2 | May 2022 | CN | national |
