1. Field of the Invention
The field of the invention generally relates to a furnace for the formation of highly controlled, high purity films on a variety of substrates. In particular, the field of the invention relates to a high reflectivity furnace for chemical vapor deposition processes for the formation of source/drain junctions on a substrate at process temperatures reaching 1200° C. or more, at atmospheric pressure. The furnace achieves contamination-free heating of a work piece by using reflective heat containment rather than conventional thermal insulation and facilitates continuous processing with high throughput.
2. Background of Related Art
The manufacture of semiconductor devices requires the deposition of thin dielectric films upon semiconductor wafers at high working temperatures. The most commonly used process is chemical vapor deposition (CVD), using precursors such as silane, disilane, tetraethyl orthosilicate and others for the formation of a variety of films.
The manufacture of many devices requires the deposition of a variety of thin films on a variety of substrates. The most common is the preparation of microcircuitry on silicon wafer semiconductor substrates. Conductive, insulative, optical and dopant source coatings for later formation of source/ drain junctions are formed using a wide range of chemical processes.
Low temperature processes are preferred to avoid exaggerated diffusion effects. But high temperature processes are sometimes necessary to produce diffusion (e.g. dopants) in the first place, along with crystal formation and diffusion-purification effects. At high temperature, however, the list of suitable structural materials for a process chamber gets very small. And, even those with high temperature structural capacity, may be serious sources of contamination, or be unable to withstand the oxidation or other chemical conditions imposed. The materials list for a high temperature furnace or process chamber is therefore small and tends to get smaller as process specifications become more demanding.
Evaporation of metal can become a serious contamination factor in a conventional furnace for semiconductor processing, beginning at about 500° C. Such evaporation is a natural consequence of the vapor pressure of materials. Vapor pressure varies with materials and is about 100 billion times greater at 1200° C. than at 500° C. Yet, process conditions of 1200° C. and even higher are a focus of emerging interest.
As the need for thin film devices intensifies, so too does the need for a more efficient and economical furnace for device fabrication. Unfortunately, simultaneous improvement in fabrication processes, device performance and cost, has been difficult to achieve due to a number of structural and functional limitations in conventional furnaces. Conventional furnaces are often unsuitable for economical and high throughput thin film device fabrication, even for 500° C. processes, let alone operating ranges at 1200° C. and above.
In many furnaces for CVD, the process area and the product are isolated or separated from the heat source. Note that in such a furnace, the relationship between the heat source and the product is distant. More time is required for heating and cooling, and more heat source temperature is required to achieve the same product temperature. In other words, a larger temperature difference, ΔT, between heat source and product is required to induce heating of the work piece. Traditional thermal insulation generally is used to minimize heat loss and smooth out temperature gradients. But, this disadvantageously forces the process chamber to operate at high temperature and causes a slow rate of heating and cooling (poor thermal response) when a temperature change is required.
Therefore, what is needed is a furnace for CVD processing, especially at high temperatures, in which:
Increasingly stringent requirements for processes are needed in order to produce quality thin film devices without impurities at reduced dimensions and at high production rates. And, conventional semiconductor processing systems are having more difficulty meeting these requirements. The materials for the process chamber are an important factor. The heat source and process chamber components are not acceptable if they are source of contamination.
Thus, in a conventional furnace, heating elements are typically located outside the process chamber. This means that the elements must now heat the process chamber, which in turn heats the work. This results in a disadvantageously large ΔT. Such a large ΔT means that the process chamber itself acts as a heat source hotter than the work. Accordingly, conventional process chamber materials are subject to drawbacks such as heat damage, distortion, may act as a source of contamination, entail time-consuming maintenance issues, are expensive, and slow down processing rates.
In a conventional substrate processing system, there is an aversion to the use of aluminum as a material for the walls in a high temperature process chamber due to its low melting point (660 degrees C.) and, in the case of a high temperature plasma, “due to physical sputtering of ions which attack chamber surfaces, such as aluminum walls, resulting in metal contamination of the substrate.” See U.S. Pat. No. 6,444,037 (emphasis added). However, as explained in further detail below, an aspect of the invention overcomes this presumed limitation and proves the opposite is true by removing as much heat as possible from the aluminum surface so that it remains relatively cool and thus inert with respect to the processing. Further, by polishing the aluminum to provide a mirror like surface, heat energy is thereby reflected back to heating elements, minimizing heat loss that would force the heating elements to a higher temperature for the same work temperature (thereby minimizing ΔT).
Another source of contamination in a conventional furnace for continuous CVD processing is the conveyor belt on which the substrate rests as it travels through various portions of the chamber for sequential processing. The conveyor belt typically comprises inconel alloy. At temperatures above 500° C., inconel itself becomes a source of evaporative metal contamination of the workpiece. Thus, what is needed is an improved furnace for CVD processing wherein all materials must be compatible with the process and the work product. CVD systems must be able to meet the higher demands for forming ultra-shallow doped regions including, source/drain junctions without evaporative metal contamination.
In conventional high throughput, thin film CVD processing, heating requirements are pushed to extreme limits. It thus becomes evident that in spite of the long history of furnaces, there is a great deal of room for improvement in the heating elements as well as in the design and construction of the process chamber. It is desirable for improved quality and purity of the thin film structures which produce source/drain junctions to achieve a process temperature of 1200° to 1300° C.; perhaps even 1350° C. For a workpiece to be heated to such temperature, the heating element itself must be even hotter. Materials that can survive such temperatures, are very few, fragile, very expensive, or limited to protective enclosures to prevent burnout or cannot survive exposure to required process atmospheres, or are themselves sources of contamination in the intended process.
With respect to heating elements, it is advantageous for the relationship between the heat source and product to be close (minimum ΔT). The thermal mass can be small, the thermal response much faster, and the means of control much improved. Most materials for heating elements are either too expensive or burn up too easily. Nickel chromium alloy (“Nichrome”) as a heating element takes advantage of chromium's tendency to quickly form chromium oxide (a highly stable ceramic) on the wire surface which then protects the remaining underlying metal. Nichrome wire is thus ductile, weldable, strong, has a desirable high electrical resistivity, and a reasonable service temperature of about 1200° C.
Another more recent alloy uses nickel and iron with a small percentage of aluminum. The aluminum melting point is low (660° C.) and thus not itself a high temperature material. However, it has a strong tendency to form aluminum oxide, a ceramic more stable and protective than chromium oxide. This material (“Kanthal”) has a service temperature of about 1400° C. The wire is ductile but becomes brittle as a result of excessive recrystallization at elevated temperature. Welding of Kanthal thus tends to produce a very fragile construction. The electrical resistivity of Kanthal is about 20% higher than Nichrome.
Wires can be made of higher temperature materials than Nichrome or Kanthal. Tungsten and molybdenum, for example, can have high surface temperatures exceeding 2000° C., but only under protected, oxygen free, and corrosive chemical free conditions. An ordinary light bulb, for instance, has a tungsten filament, actually a small heating element, operating typically at 2100° C. The filament is the light and heat source; the bulb provides the required protection. Such a bulb can be used as a heat source (e.g. heat lamp), but the bulb is often too fragile, and limits versatility in shaping the thermal structure.
The range of metallic materials used for electrical heat sources also can be used for a process chamber enclosure. Nickel chromium iron alloys such as stainless steel and inconel can be fabricated to intricate shapes and are much more durable than ceramic type materials. Semiconductors require a thermal process chamber where conditions can be very precisely maintained, but the process chamber must be fully compatible to process requirements. This is always more difficult as temperature gets higher.
For such a process chamber, the heat source, that is, the electrical heat element must obviously be the hottest component. As temperature rises, the first potential source for evaporative metal contamination must be the heat element. In addition, the processing conditions may involve gaseous chemicals which would be damaging to the heat elements.
Another problem in a conventional process chamber for semiconductor materials is that electrical connections through the wall of the process chamber may be a difficult and over-complicating structural feature. The heating elements are often placed outside the process chamber. Since this makes the heating elements more remote from the workload, it forces the elements to a higher temperature for the same product temperature. In a modem apparatus, the process chamber is a horizontal tunnel (muffle) through which product (such as silicon wafers) is carried on a wire mesh belt or conveyor.
The heating elements are typically all located outside the muffle. Such an arrangement is cost effective and production oriented, but it means that the heating elements may be operating at 1200° C., to heat the muffle to 750° C., which heats the belt to 650° C. which then heats the wafer to the desired temperature of 500° C.
The heat elements are within their reasonable surface temperature, but still the ΔT (element vs. wafer) is undesirably large, a consequence of the fact that the heating elements are remote from the silicon wafer. The situation is made more difficult by the fact that process gases flowing into the chamber tend to cause cooling, for which the heating elements can't compensate because they are too remote. The 500° C. example is a relatively low process temperature. A process temperature on the order of 1200° C. would be desirable, but this would put the elements well beyond their service limit. The process chamber and conveyor belt also would experience severe warpage, exaggerated oxidation and unacceptable metal evaporation and resulting workpiece contamination. Conventional furnaces for chemical vapor deposition (CVD) of silicon exhibit all of the foregoing disadvantages and undesirable features.
A factor that critically affects the throughput of a CVD process is the wafer temperature ramp rate. Such temperature ramping can be required at several points during a given process cycle. For example, a cold wafer must be heated to the appropriate treatment temperature. Also, the process may require different temperatures for different treatment steps. At the end of the process, the wafer ordinarily is cooled to a level that the wafer handling device can tolerate. The heating and cooling steps can represent a significant percentage of the processing time and can limit the reactor's throughput. The time between the steady state temperatures is essentially time which should be minimized to increase throughput.
The rate at which the wafer temperature can change from one steady state to another depends on the reactor's ramp rate. The reactor's ramp rate depends on the temperature controller type, temperature sensor, energy source, and other process considerations. A thermocouple is a device for measuring temperature in which a pair of wires of dissimilar metals (e.g., copper and iron) is joined and the wire's free ends are connected to an instrument (e.g., a voltmeter) that measures the difference in potential that is created at the junction of the two metals. When thermocouples are used to measure the wafer temperature, the thermocouple's thermal mass limits the response time to temperature changes. Thus, during a ramp, the thermocouple measurement significantly lags the wafer temperature. Reactors employing thermocouples are typically operated at ramp rates slower than the heating mechanisms can handle to limit the temperature difference between the wafer and thermocouple. If the ramp rate is too high, such that by the time the thermocouple temperature catches up to the wafer temperature, the wafer has been at a significantly higher temperature. Thus, the temperature controller reacts after the wafer temperature overshoots the target temperatures.
As a practical matter, a thermocouple cannot be attached to multiple wafers undergoing processing. Instead, a thermocouple is attached to a test wafer, and a periodic test must be run to determine process temperatures. However, this method is vulnerable to changing parameters during actual wafer processing.
Therefore, what is needed is a new furnace design wherein the temperature difference between the heating elements and the work is small (minimum ΔT). Then, the heating element temperature would provide an accurate measurement of work temperature.
What is also needed is an improved furnace design for CVD processing that places the heating elements in close proximity to a workpiece such that ΔT is minimized.
What is also needed is an improved furnace which can meet the increasing need to achieve consistent high yields in a CVD process for manufacturing semiconductor devices, at high working temperatures in a range from 1200° C.-1400° C. with precise process control. It also is desirable to provide new materials for a process chamber that can prevent contamination by metal evaporation at elevated temperatures, as vapor pressure of materials can increase 100 billion times from 500° C. to 1200° C.
In order to overcome the foregoing disadvantages of conventional semiconductor processing systems, an aspect of the invention provides a thermal design that reduces heating element temperature, while providing a precisely controlled process temperature of 1200° to 1350° C. As set forth above, the heating element always must be hotter than the object being heated in order for heat to flow. But the temperature difference, or delta “T” (ΔT), can be greatly influenced by thermal design.
To achieve a minimal ΔT, an aspect of the invention disposes a plurality of heating elements in a planar array, and as close to the work as possible. The planar arrangement of the heating elements causes them to share the thermal workload. A second planar array of heating elements disposed beneath the work approximates an isothermal condition with respect to the work.
Another aspect of the invention overcomes the need to heat the process chamber. Instead, means are provided for bringing the heating elements into the process chamber.
In contrast to a conventional furnace, the internal surfaces of the process chamber are highly polished to reflect heat. At process temperatures mentioned, above 1200-1350° C., the dominant mode of heat transfer is radiation, which is then effectively contained by mirror surfaces. In other words, the process chamber is actually cold, but it looks hot. Since no mirror is perfect, some heat is absorbed which would begin to heat a polished process chamber. To counteract this effect, process chamber walls are made of a highly thermally conductive material (aluminum) with built-in active cooling to carry non-reflected heat away. This has been found to effectively compensate for the fact that, as mirrors rise in temperature, their ability to reflect heat decreases, even without damage to the polished surface. In other words, reflectivity decreases as temperature rises.
A further aspect of the invention uses aluminum as the material for the process chamber. Because aluminum melts at 660° C., it is not an obvious choice for the interior of a process chamber designed for process temperatures in the vicinity of 1200° C. and above. The aluminum walls forming the process chamber are polished to provide an “optical mirror” finish, characterized by very low emissivity (i.e. high reflectivity). It has been found that active cooling of the polished aluminum surface can be achieved by forced circulation of coolant (e.g. water) through channels disposed in or against exterior walls of the chamber or by circulating a gas (e.g. air) around cooling fins.
Aluminum also has the advantages of excellent thermal conductivity to facilitate uniform cooling, is economical in price, readily available, durable, adaptable to a wide range of mechanical structures, capable of being machined, formed, drilled and threaded as required and compatible with cooling and plumbing attachments
An aspect of the invention has found that it is not necessary for the process chamber itself to reach such elevated temperatures with all incumbent problems, in order to heat the workpiece. Instead, an important point of the invention is to bypass heating of the process chamber “box” to thereby avoid many other problems in a conventional furnace associated with the heating of the process chamber. In a conventional furnace, insulation (bricks, mineral wool, asbestos, etc.) is used for reducing heat loss. The thermal mechanism involves heating of such insulation. As the insulation gets hot, it radiates just like the heating elements do. This is similar to the mirror action. The mirror reflects heat back toward the heating elements, thus reducing the element temperature required to maintain the heating process. The heat insulation radiates heat back toward the heating elements, thus reducing the element temperature required to maintain the process.
Thermodynamically, reflection looks just like radiation. However, there is an important difference. For the insulation to radiate, it must become physically hot. That means heat is stored in the insulation. Time is required to store this heat. This means that the thermal response in a conventional insulated furnace is poor. Initial heat-up or cool-down or adjustment to a new process can take hours. This undesirably results in reduced ability to control temperature and thus dopant uniformity and junction depth of ultra-shallow doped regions formed in a conventional sequential CVD chamber; and is unsuitable for high throughput processing. In contrast, the heat reflector walls comprising the process chamber of the present invention are characterized by low thermal (zero) mass and do not store any heat. This advantageously enables rapid thermal response and high throughput.
Another aspect of the invention provides an improved heating element configuration comprising a plurality of Kanthal elements disposed within a ceramic sleeve. Multiple heating elements are then disposed in parallel across the process chamber. The heating elements are placed about three eighths inch (0.375) apart, which thermodynamically approaches a single continuous sheet of hot surface. If one such sheet is disposed above the work being processed, and a second sheet below, the work is exposed to a good approximation of an isothermal chamber; the work being surrounded by a hot (element) surface with reflective heat containment.
The heating element terminal structure is designed so that the heating elements are modular for ease of removal without disassembly of the furnace. When a heating element is installed through an access port in a terminal panel, an electric terminal covers the access port. The terminal panel thus forms a secondary chamber along side the process chamber. The terminal chamber is purged with inert gas (such as argon). Thermal oxidation of heating elements is advantageously suppressed or eliminated by argon. Such purging action also implies that high temperature, oxidation sensitive material like molybdenum, can be considered for heating element service. The argon is also circulated through the terminal chamber to keep it oxygen free, such that heating elements are exposed to an inert atmosphere inside the walls of the terminal chamber. Thus, the heating elements are kept in an oxygen free atmosphere that prevents oxidation.
The configuration of the heating elements is linear, providing a consistent relationship of watts per linear inch. This enables temperature to be determined directly by monitoring the electrical resistance of the Kanthal within the ceramic sleeve. This method tracks the temperature within the heating elements and thus provides an accurate, substantially instantaneous measurement of temperature within the heating element, without the time lag of a conventional thermocouple. Active feedback of temperature is provided to a temperature controller to ensure a quick thermal response when desired.
Yet another aspect of the invention provides sequential processing of a semiconductor substrate without the need for a conveyor belt. A rail is provided on the walls of the process chamber to enable substrates to slide in one end, continuously, for thermal processing steps and exit the other end. Alternatively, a quartz plate or equivalent structure capable of withstanding elevated temperatures without warping can be used to slideably transport a substrate through the furnace without the need for a conveyor belt.
A further aspect enables surface coatings of higher purity to be deposited on a substrate due to the 1200° C. process temperature achieved by the invention. This can upgrade the performance of the substrate in terms of optical qualities, wear characteristics or electrical qualities. For example, an aspect of the invention enables a surface layer of silicon to be deposited under conditions that provide substantially higher purity with respect to a silicon substrate. The high temperature process makes the deposited silicon more crystalline, but the crystals orient themselves with respect to the structure of the underlying crystals in the substrate. This has particular application to the cost effective production of solar cells. Also, formerly cost sensitive PN junctions for photovoltaic devices now can be produced economically with high throughput.
These and other features, aspects and advantages of the invention will become better understood with regard to the following descriptions, appended claims and accompanying drawings in which:
Reducing Source Temperature Required To Heat A Workpiece Referring to
Referring to
Conventional process chamber materials are subject to drawbacks such as heat damage, distortion, may act as a source of contamination, entail time-consuming maintenance issues, are expensive, and slow down processing rates.
Overcoming The Need To Heat The Process Chamber
An aspect of the invention provides a means for bringing the heat elements 106 into the process chamber 102 which bypasses the above damage to, or damage caused by conventional heating of the process chamber. That is, according to this aspect of the invention, the process chamber no longer needs to be heated. Of course, a cold chamber would now be a source of heat loss, disrupting process temperature control, and forcing the heating elements to work harder; i.e. achieve higher temperature to make up for such heat loss. The heat loss could be minimized by using thermal insulation. But all such insulation is dusty, crumbly, and porous, factors which would severely interfere with process control.
Containing Heat with Polished Surfaces
Referring to
Cooled Polished Surfaces
To counteract this effect, a process chamber 102 is made of a highly thermally conductive material, aluminum, with built-in cooling channels 120 to carry non-reflected heat away. In a preferred embodiment, cooling channels 120 comprise copper pipes conformably held in aluminum extrusions 122 which are integral with external surfaces of the walls of process chamber 102. Preferably, a silicone heat sink compound (grease) mixed with zinc oxide powder is used to coat the copper tubing to provide a more efficient transfer of heat out of the process chamber walls 103. The heat sink compound forms a liquid interface between the cooling channels and the process chamber walls. It eliminates air gaps and provides more efficient heat transfer.
Alternatively, one can make the aluminum extrusions so that they form an enclosed channel or bore integral with the walls 103 of the process chamber 102.
Referring again to
Mirrors can be made so the heat facing side is highly polished and the backside black. Such an arrangement minimizes hot side absorption while the black side facilitates radiant loss of that heat fraction which is absorbed. However, the mirror temperature still must rise undesirably, because even black body radiation is too small at low temperature to dissipate absorbed heat.
Liquid And/Or Gas Cooling
Thus, the best way to cool the polished surface is by active cooling through liquid channels (e.g. water) or gas cooling fins (e.g. air). Thus, in an alternate embodiment, aluminum extrusions can be provided on exterior surfaces of process chamber walls to aid in removing heat.
Aluminum As A Material Choice
A problem arises in finding “a mirror” which is economical in price, readily available, durable, adaptable to a wide range of mechanical structures, capable of being machined, formed, drilled and threaded as required and compatible with cooling and plumbing attachments. Aluminum meets the foregoing requirements, has excellent thermal conductivity to facilitate uniform cooling, and optically can be polished to a very low emissivity (i.e. high reflectivity). This is the reason that aluminum, and not Chromium, stainless steel, or even gold, is used in the most demanding of optical applications (such as the Hubble Orbiting Telescope). Aluminum is further amenable to extrusion techniques which make it readily available in myriad shapes to facilitate structures and cooling. An advantage of gold or other precious metal is corrosion resistance. If corrosive conditions attack polished aluminum, gold plating of aluminum can be a useful alternative.
Because aluminum melts at 660° C., it is not an obvious choice for the interior of a process chamber designed for process temperatures in a range of 1250° C. and above. Prototype furnaces have been made according to the invention and have achieved 1250° C. process temperatures even though the furnace is made of a material which melts at 660° C. Moreover, the exterior surface temperature of the prototype furnaces only reaches about 35° C.
Workpiece Temperature And Process Chamber Temperature No Longer Related
An aspect of the invention provides that it is not necessary for the process chamber itself to reach such elevated temperatures, with all incumbent problems, in order to heat the workpiece. Instead, an important point of the invention is to bypass problems which come with the heating of the process chamber.
In a conventional furnace, insulation, bricks, mineral wool, asbestos, etc. are used for reducing heat loss. The thermal mechanism involves heating of such insulation. As the insulation gets hot, it radiates just like the heating elements do. This is similar to the mirror action. The mirror reflects heat back toward the heating elements, thus reducing the element temperature required to maintain the heating process. The heat insulation radiates heat back toward the heating elements, thus reducing the element temperature required to maintain the process.
Zero Thermal Mass Of Reflectors Provides Rapid Thermal Response
Thermodynamically, reflection looks just like radiation. However, there is an important difference. For the insulation to radiate, it must become physically hot. That means heat is stored in the insulation. Time is required to store this heat. This means that the thermal response in a conventional insulated furnace is poor. Once reached, temperature stability of a conventional insulated system can be very good. But initial heat-up or cool-down or adjustment to a new process can take hours. Heat reflectors, by comparison, are characterized by low thermal (zero) mass and do not store any heat. This advantageously enables rapid thermal response on the order of minutes.
Means for Minimizing Convection
Another mode of heat loss which could force a higher ΔT is convection. That is, the circulation of gases in the process chamber carrying heat from hot surfaces to cold surfaces. Convection is a “chimney effect” inducing upward cooling flows induced by hotter, lighter gases carrying lost energy with them. Referring to
Minimizing Conduction At Contact Points
Referring to
Maximizing Conduction At Contact Points
Referring to
The rail 500 is polished to minimize heat absorption and cooled through the action of the support screws 502. Referring to
Other Rail Concepts
There are other rail concepts which may work effectively, and even have advantages. Examples include making the rail structure out of a refractory metal, such as molybdenum, which can readily handle such temperature, provided the process atmosphere is not oxidizing or otherwise corrosive. The surface of the molybdenum can be treated with materials such as silicon or carbon to increase its resistance to chemical attack. The substrates may also roll on small ceramic balls moving in grooves formed on the rails or on a grooved feature of aluminum extrusion which has no separate attached rails.
The invention description thus far has been mostly related to design concepts which enable reduction of ΔT (actual element temperature minus work temperature). A sufficiently small ΔT improves the chance that conventional heating element material (such as one of the Kanthal series) may be up to the task. A practical service limit for Kanthal is 1400° C. Thus, if a ΔT of 100° C. can be achieved, then a work process temperature of 1300° C. can also be achieved. However, in industry it is evident that a ΔT of many hundreds, even 1000° C. may be required. From prototype apparatus relating to this invention, it appears that the ΔT achieved is less than 200° C., thus providing capability for the use of Kanthal.
Referring to
As mentioned near the beginning text, the design concept is to place the heating elements as close to the work as possible. However, at this operating temperature, the Kanthal metal would be a serious evaporative contamination risk to the substrates being processed. Referring to
1. Convenient Installation
Heating elements in many commercial furnaces are prohibitively difficult to replace. The implication is that if the element operates at a modest temperature its life will be long. The expectation in this case is one of pushing the limit; failure may be more likely (because of the high temperature service), but tolerable, if replacement is easy and practical.
2. Means Of Power Distribution
The operating temperature of an element varies with input power and also with heat loss. The end of a heating element may operate cooler, for example, than the interior because of increased heat loss. If the element design can enable increased resistive heating in this area, the compensation makes temperature and process more uniform. The electrical terminals 704 themselves have to be one such “end” to the elements. But here the temperature must be kept low to avoid destruction of the electrical connection. Lowering resistive heating in this area reduces risk of terminal damage.
3. Coiling
Heating elements are more durable when made of larger wire, but then circuit resistance is low. This means the power supply must be oriented to high current and low voltage, an undesirable combination. To off-set this effect, the wire is often coiled. Coiling increases the length of wire between terminals and increases resistance in proportion. There is often the perception that this larger amount of wire can handle proportionally larger amount of power (wattage). It is visibly evident that coiled wire heats more readily. But what is actually happening is that when each coil heats it has a strong tendency to also heat adjacent coils. The coiled wire gets hot more readily, but that's because the heat energy can't escape as readily. The heat has to escape in order to heat the work.
The heating element has to get hot, but its purpose is to heat the work. These are really separate concepts. Coiling thus works to increase ΔT. For low temperature applications, coiling can be effective. For high temperature applications, coiling may push the element wire beyond its limits.
Another aspect of coiling is that if the coils are not kept accurately spaced (they usually aren't), closer spacing produces hot spots (element failure) and wider spaces produce cold spots (process temperature non-uniformity).
Referring to
4. Heating Element Density
Referring to
5. Electrical Insulation
Referring to
The presently available heating element material, Kanthal, is a metallic alloy made of nickel, iron and a few percent aluminum. For high temperature service, this alloy, by its nature, forms a surface layer of aluminum oxide. This oxide is a form of corrosion which then becomes highly protective to the remaining underlying metal. Aluminum oxide (in pure crystalline form, sapphire) is one of the most durable of ceramics. It is this nature of Kanthal which makes it a prime high temperature element material.
Any contamination of this surface oxide is likely to degrade its performance. Any insulator in contact with the hot wire would have to be a contamination suspect unless it also is high-grade aluminum oxide. Thus, alumina ceramic emerges as the preferred high temperature insulator, because of its compatibility with Kanthal.
There are other potential element materials besides Kanthal. Their advantages, disadvantages, material and design requirements could be considered just as with the Kanthal/alumina system.
6. Element Structural Support
The melting point of Kanthal is 1500° C. Maximum practical service temperature is 1400° C. The expected service requirement is 1400° C. (for a work temperature of 1200-1300° C.). At this temperature, Kanthal's mechanical strength is very weak (the term “wet noodle” is applicable). Alumina ceramic, by comparison melts at 2050° C. and its strength at 1400° C. is excellent.
Ceramic tubing 702 with element wire 700 threaded therethrough thus emerges as an attractive element structural configuration.
7.Element/Ceramic Heat Transfer
Referring to
8. Feed Wire Orientation
Referring again to
9. Terminal Configuration
Referring to
Terminal ends 704 are screw terminals that provide durable secure connections. The preferred embodiment includes a short transverse rod (torque eliminator) 720 on the threaded terminal end 704 which conformably engages a recess provided in insulation material 724. The transverse rod 720 prevents inadvertent torque, during terminal tightening, from causing damage to the heating element wire 700. The same piece of insulation material 724 can serve both terminals, incorporating them in a single unit which facilitates element installation or removal. A preferred insulation material 724 is Teflon. The terminals themselves are secured to the heating elements by welding or brazing at a terminal weld or braze joint 728.
10. Terminal Heat Reduction
Referring to
Referring to
The welding of Kanthal, especially to a different material such as Nichrome, is challenging. There is the risk that the weld joint would be a weak spot in the element structure incompatible with the intended high temperature service. Kanthal also tends to get very brittle and fragile after welding. However, welding techniques have been developed which make such structures feasible and practical.
At the terminal end, the Kanthal is also welded to Nichrome at 812. The Nichrome is then welded to nickel at 814 which has much lower electrical resistance but not as much heat resistance. The nickel is then finally welded to the screw terminal 704 itself at terminal weld 728 (
With this configuration, 80% or more of the heating can be generated within the process chamber 102.
The heating element design was completed with the needs of the process chamber in mind. Referring to
Referring to
Diffusion flow is completely random. In an unsealed enclosure, diffusion is going on into and out of the enclosure at the leak sites. If the enclosure is pressurized so that directed flow out of the leaks occurs, this outward flow competes with diffusion flow. Once the flow induced by pressure exceeds the diffusion flow, outside air cannot get into the enclosure and the enclosure is thus purged.
For the purging of the process chamber enclosure formed by gas purge structures 1102, the velocity at the leaks, due to input flow, is proportional to the square root of the induced pressure (differential, “in” vs. “out”). Comparing liquids and gasses this way is a bit awkward because of gas compressibility, but if the actual pressure differential is small it doesn't have much effect on the result.
If the velocity (V) is in centimeters per second (cm/sec) and the density (d) is in grams per cubic centimeter (g/cm3), the pressure (P) is in dynes per square centimeter (dynes/cm2), an uncommon unit. For small pressure, inches of water (In.H2O) may be the preferred unit. Accordingly, a pressure, P, of:
or conversely
Therefore, if a velocity of 2 inches per second, which equals 5.08 cm/sec, is the purge requirement to overcome diffusion, the associated pressure is:
If the accumulated “leaks” amount to one square inch, (=6.45 cm2) the flow volume is:
The above calculations compare very favorably to an empirical listing (called the Beaufort Scale) used in meteorology, where wind velocity is compared to pressure (force per area) induced on surfaces such as buildings. The Beaufort Scale can thus be described as (for air at 25° C.):
As set forth above, in accordance with an aspect of the invention, only one quarter of one millionth of one PSI is necessary to form a gas curtain at diffusers 1108 for complete isolation of the process chamber while enabling processing at atmospheric pressure.
Referring to
This arrangement also benefits the heating elements themselves. As mentioned, the Kanthal alloy serves at high temperature by forming a protective surface of aluminum oxide. But this oxide is formed at the expense of the underlying metal. If the element operates in an inert atmosphere, the protective oxide is unnecessary, or, exaggerated thicknesses of oxide don't tend to form. At high service temperature, there is a tendency for thicker oxide to form on Kanthal. But, because the oxide thermal expansion is different than the metal, it spalls off when the element cools and has to reform when reheated. This action is suppressed or eliminated in argon. Such purging action also implies that high temperature, but oxidation sensitive material, like molybdenum, can be considered for heating element service.
The terminal chamber purge, however, would not protect the far end of the heating elements or process chamber leaks around the elements. As mentioned, the elements are disposed in an upper row and lower row. The upper row terminals 1208 are all fastened to the terminal panel 1204 on one side. The lower terminals need a separate panel which is on the other side of the process chamber. Thus, the upper row terminal chamber protects its own terminals, plus the far end of the lower row elements, and vice versa. The element ends, and the process chamber are thus fully protected.
As mentioned, the Kanthal can be benefited by this gas protection. The nickel and Nichrome also benefit.
It is unlikely that the argon purge can remove the unwanted residual heat reaching the terminals. Argon would also be expensive as a cooling gas.
The terminal panel 1204 with elements installed forms an array of exposed electrical contacts which should be covered for safety purposes. This terminal cover (not shown) is thus included in the design concept.
The power connections 1214 to the terminals are designed to include a cooling fin bus bar feature 1218. Under the terminal cover, these cooling fins can be subjected to blowers or air jets as a means of removing unwanted heat.
Referring to
This aspect of the invention enables accurate measurement and precise control of the work piece temperature to bring the workpiece or substrate to a desired temperature for a corresponding CVD process. In a CVD process, substrate temperature is a critical parameter during each process step. Deposition gases react within particular temperature windows and deposit on the substrate. This aspect of the invention advantageously enables process parameters and materials to be carefully controlled to ensure the high quality of the resulting device layers.
While the invention has been described in connection with what are presently considered to be the most practical and preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments and alternatives as set forth above, but on the contrary is intended to cover various modifications and equivalent arrangements included within the scope of the forthcoming claims. For example, other metals, such as molybdenum can be encased in a ceramic sleeve enabling thermal expansion of the metals and providing mechanical support to enable such metals to function as high temperature heating elements. Also, a seam can be provided in the aluminum walls along the line of the access ports for the heating elements. The seam would enable the furnace to be assembled in two halves; and would provide ease of disassembly of the furnace for cleaning and replacement of heating elements
Therefore, persons of ordinary skill in this field are to understand that all such equivalent arrangements and modifications are to be included within the scope of the following claims.
This patent application claims the benefit of U.S. provisional patent application Ser. No. 60/445,562, filed Feb. 7, 2003, which is incorporated herein by reference.