High-speed routing composite material

Abstract

An electronic system includes a circuit board formed from a composite material. The composite material includes fibers embedded within a substrate and the fibers are oriented substantially orthogonal to one another. A plurality of traces are formed on the board, and the plurality of traces are oriented relative to at least one of the fibers at an angle between about 17.5° and about 27.5° or between about 20.0° and about 25.0°. A pair of the traces are oriented substantially orthogonal to one another, and a pair of the traces are oriented relative to one another at an angle of about 45.0°. The fibers are fiberglass, and the substrate is an epoxy resin. The fibers have a different dielectric constant than the substrate.

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention. The embodiments illustrated herein are presently preferred, it being understood, however, that the invention is not limited to the precise arrangements and instrumentalities shown, wherein:

FIG. 1 is a top view of conventional traces on a circuit board.;

FIG. 2A is another top view of a conventional pair of traces on a circuit board;

FIG. 2B is a side view of FIG. 2A; and

FIG. 3 is a top view of traces on a circuit board in accordance with the inventive arrangements.

Claims

1. A circuit board, comprising: a board formed from a composite material of fibers embedded within a substrate and the fibers oriented substantially orthogonal to one another;a plurality of traces formed on the board, whereinthe plurality of traces are oriented relative to at least one of the fibers at an angle between about 17.5° and about 27.5°.

2. The circuit board of claim 1, wherein the angle is between about 20.0° and about 25.0°.

3. The circuit board of claim 1, wherein a pair of the traces are oriented substantially orthogonal to one another.

4. The circuit board of claim 1, wherein a pair of the traces are oriented relative to one another at an angle of about 45.0°.

5. The circuit board of claim 1, wherein the fibers are fiberglass.

6. The circuit board of claim 5, wherein the substrate is an epoxy resin.

7. The circuit board of claim 1, wherein the fibers having a different dielectric constant than the substrate.

8. An electronic system, comprising: a circuit board formed from a composite material, the composite material including fibers embedded within a substrate and the fibers oriented substantially orthogonal to one another;a plurality of traces formed on the board, whereinthe plurality of traces are oriented relative to at least one of the fibers at an angle between about 17.5° and about 27.5°.

9. The electronic system of claim 8, wherein the angle is between about 20.0° and about 25.0°.

10. The electronic system of claim 8, wherein a pair of the traces are oriented substantially orthogonal to one another.

11. The electronic system of claim 8, wherein a pair of the traces are oriented relative to one another at an angle of about 45.0°.

12. The electronic system of claim 8, wherein the fibers are fiberglass.

13. The electronic system of claim 12, wherein the substrate is an epoxy resin.

14. The electronic system of claim 8, wherein the fibers having a different dielectric constant than the substrate.