1. Field of the Invention
The field of the invention generally relates to heating apparatus. In particular, the field of the invention relates to a heating element for providing contamination free processing of a substrate or workpiece at elevated temperatures, wherein temperature differences between the heating element and a substrate or workpiece are minimized. The heating element has a modular, feed-through configuration that enables it to be inserted directly into a process chamber from the exterior of a furnace for ease of removal and replacement.
1. Background of Related Art
The manufacture of semiconductor devices requires the deposition of thin dielectric films upon semiconductor wafers at high working temperatures. The most commonly used process is chemical vapor deposition (CVD), using precursors such as silane, disilane, tetraethyl orthosilicate and others for the formation of a variety of films on a semiconductor substrate. CVD processes supply reactive gases to the substrate surface where heat-induced chemical reactions take place at elevated temperatures to produce a desired thin film. Preparation of micro-circuitry on silicon wafer semiconductor substrates also requires high temperature CVD formation of conductive, insulative, optical and dopant source coatings for later formation of source/drain junctions.
At high temperatures, suitable structural materials for heating elements are limited. Even heating elements with high temperature structural capacity may be unable to withstand the oxidation or other chemical conditions imposed by high temperature CVD processes. Heating elements themselves thus become sources of contamination. Therefore, what is needed is a heating element suitable for a high temperature CVD process that is characterized by both structural integrity as well as oxidation and contamination free operation.
Evaporation and/or spalling of metal, such as from a heating element, can become a serious contamination factor in a conventional furnace for semiconductor processing, beginning at about 500° C. Such evaporation is a natural consequence of the vapor pressure of materials. Vapor pressure varies with materials and is about 100 billion times greater at 1200° C. than at 500° C. Thus, the potential for particulate contamination through out gassing, spalling, or oxidation of a heating element operating at high temperatures is a critical process limitation.
Increasingly stringent requirements for CVD processes are needed in order to produce quality thin film devices without impurities at reduced dimensions and at high production rates. It is desirable for improved quality and purity of thin film structures that produce source/drain junctions to achieve a process temperature of 1200° to 1300° C.; and even 1400° C. For a substrate to be heated to such temperature, the conventional heating element must be even hotter. This has resulted in the development of heating elements comprising materials capable of withstanding high temperatures, such as graphite, tungsten, molybdenum and others. However, such materials are expensive and difficult to use, requiring a disadvantageously high current power supply. Molybdenum in particular is subject to out gassing and may result in the processed substrates becoming coated with a thin molybdenum film, or the surface of the workpiece may react with molybdenum vapor. Therefore, what is needed is a heating element that can maintain structural integrity and operate reliably in long term exposure to such temperatures, while not becoming a source of contamination in the intended process.
As the need for thin film devices accelerates, so too does the need for a more efficient and economical furnace for device fabrication. Unfortunately, simultaneous improvement in device fabrication processes, device performance and cost, has been difficult to achieve due to a number of structural and functional limitations in conventional furnaces. Conventional heating elements employ wire coiling, to increase power density and to accommodate thermal expansion. However, conventional heating element coils are characterized by increased resistivity and are prone to oxidation at high temperatures. In a coil configuration it is difficult to maintain constant resistance at high temperatures. The resistance per linear inch varies as the coils expand and contract. The spacing between coils cannot be closely regulated at high temperatures, producing temperature variations and hot spots. When pushed to high operating temperature, hot spots in the coils frequently result in heating element failure. Furnaces employing conventional elements are often unsuitable for economical and high throughput thin film device fabrication, even at 500° C. process temperatures, let alone operating ranges at 1200° C. and above.
In an attempt to overcome high temperature spalling of particles and process contamination from heating elements, many conventional furnaces for CVD isolate or separate the process area and the substrate or product from the heat source. The process chamber is typically a horizontal tunnel (muffle) through which product (such as a silicon wafer) is carried on a wire mesh belt or conveyor. The heating elements are often placed outside the process chamber. Such remote location of the heating elements from the workpiece forces the heating elements to operate at a higher temperature to achieve a desired processing temperature. When heating elements are located outside the muffle, the heating elements may be operating at 1200° C. to heat the muffle to 750° C., which heats the conveyor belt to 650° C., which then heats the substrate to the desired temperature of 500° C.
Note that in such a conventional furnace, more time is required for heating and cooling, and a larger temperature difference, ΔT, between heat source and substrate is required to induce desired heating of the substrate. Traditional thermal insulation generally is used to minimize heat loss and smooth out temperature gradients. However, this disadvantageously forces the process chamber to operate at high temperature and causes a slow rate of heating and cooling (poor thermal response) when a temperature change is required.
Further, such a large ΔT between the substrate or product and heating elements located externally with respect to the process chamber means that the process chamber itself must act as a heat source hotter than the work. Accordingly, conventional process chamber materials are subject to heat damage, distortion, and may act as a source of contamination, thus resulting in time-consuming maintenance issues and slow processing rates.
It is therefore desirable to provide an improved, thermally efficient furnace for CVD processing, wherein the ΔT between the substrate and heating elements is minimized for enhanced process control and wherein heating elements are able to meet the higher thermal demands for forming ultra-shallow doped regions including, source/drain junctions without causing evaporative metal contamination.
In order to overcome the foregoing disadvantages of conventional heating elements for semiconductor processing systems, an aspect of the invention provides a heating element comprising an aluminum oxide (Al2O3) ceramic sheath for supporting and enclosing a graded Ohmic composite wire comprising a main heating portion consisting of a Fe Cr Al resistance heating alloy, such as KANTHAL®, or the like, a transition portion of nichrome, and a terminal portion comprising nickel for connection to a source of electric current. The term KANTHAL®, as used herein refers to any commonly known Fe Cr Al resistance heating alloy containing, apart from iron, approximate amounts of the following: chromium (20-30 percent), aluminum 4-7.5 percent and small amounts of cobalt.
In another aspect of the invention, a non-permeable aluminum oxide ceramic sheath has the effect of chemically isolating the Fe Cr Al resistance heating wire, thereby preventing the heating elements from becoming a source of contamination. Conversely, the aluminum oxide ceramic sheath also prevents process chamber gases or sputtered particles of the workpiece or substrate from contaminating or degrading the heating element wire.
The Fe Cr Al resistance heating element wire is provided in flush engagement in through holes defined in the aluminum oxide ceramic sheath. The flush engagement of the aluminum oxide ceramic against the Fe Cr Al wire, allows for differential thermal expansion of the wire, but does not chemically react with the wire.
The flush engagement between the heating element wire and the surrounding material of the aluminum oxide ceramic provides the following advantages. It effectively seals the Fe Cr Al portion of the heating element. That is, the aluminum ceramic sheath provides a chemically compatible enclosure that forms a protective shell, limiting the formation of the oxide layer on the KANTHAL® wire and protecting the workpiece or substrate from spalling of particles from the wire. Also, the flush engagement of the aluminum oxide ceramic restricts entry of oxygen into the interior of the through holes, such that no additional oxygen is available to react with the Fe Cr Al wire to increase the thickness of the oxide layer.
In a preferred embodiment, a plurality of heating elements is provided for modular, insertion into a furnace containing a process chamber. The ends of the ceramic portion of each heating element terminate in a plenum on either side of the process chamber, each plenum holding an inert gas. The inert gas further restricts the entry of oxygen to the heating element wire and strictly limits the thickness of an oxide layer able to form on the wire.
In another aspect of the invention, a plurality of heating elements are provided for modular insertion into a highly reflective enclosure or process chamber to increase energy efficiency and place the elements in close proximity with a substrate or work piece to minimize temperature differences (ΔT) between the heating elements and substrate. The heating elements are disposed preferably in parallel through opposite sidewalls of the highly reflective process chamber The modular configuration allows each heating element to be separately removed and replaced for repair or maintenance from outside the process chamber, leaving the process chamber intact.
In a further aspect of the invention, the heating elements are preferably supported in tangential, point contact on the bottom surface of through holes provided in opposite walls of a process chamber. The walls of a preferred highly reflective process chamber comprise polished aluminum and are provided with cooling channels for the circulation of a coolant such as water. The tangential point contact between the heating element and water-cooled aluminum wall provides a minimized surface to surface point of contact. While a significant ΔT exists between the heating element and the water-cooled aluminum wall, there is no melting or aluminum contamination as the thermal resistance provided by the minimized point of contact affords an enormous thermal gradient. This enables the heating element to operate at full temperature minimizing the ΔT with the workpiece or substrate. Differential thermal expansion of the element also can take place without structural change or distortions.
In accordance with another aspect of the invention, the Fe Cr Al resistance heating alloy, such as KANTHAL® can be provided in an essentially linear, double backed fashion through the aluminum ceramic sheath. This aspect of the invention advantageously overcomes the problems associated with traditional coiling of heating element wire, used to increase power density. The spacing of coils cannot be closely regulated and leads to temperature variations. When pushed to high operating temperature, hot spots in the coils lead to heating element failure.
The linear configuration of the heating element wire, coupled with the minimized ΔT with the substrate or workpiece, enables temperature of the heating elements and workpiece to be accurately determined and closely controlled, thereby providing a quick thermal response for faster processing and high throughput.
The foregoing aspects of the invention enable a KANTHAL® or other Fe Cr Al heating element to have a prolonged service life at a given temperature and to be used in higher temperature applications than was previously possible, up to about 1400° C. and above. The ΔT between heating elements and a work piece is minimized, such that the temperature of the workpiece can be closely controlled and is only slightly less than the temperature of the heating elements. Contamination cannot permeate through the aluminum ceramic sheath to degrade the heating element wire, and the heating element does not contaminate the workpiece.
The drawings are heuristic for clarity. The foregoing and other features, aspects and advantages of the invention will become better understood with regard to the following descriptions, appended claims and accompanying drawings in which:
Overview
Referring to
Referring to
As shown in
The configuration of the heating element assembly 100 and wire 104 is substantially linear, providing a consistent relationship of watts per linear inch. This enables temperature to be determined directly by monitoring the electrical resistance of the KANTHAL®, or similar Fe Cr Al, portion within the ceramic sleeve. This tracks the temperature within the heating elements and thus provides an accurate, substantially instantaneous measurement of temperature within the heating element, without the time lag of a conventional thermocouple. Temperature control with active feedback may be provided by a microprocessor controller in accordance with means that are well known to those skilled in the art to ensure a quick thermal response when desired.
Referring to
An aspect of the present invention comprises encasing the heating element wire 104 in an aluminum oxide ceramic sheath 102 comprising commercially available 99.8% alumina. While a number of ceramics may be compatible with a 1400° C. service temperature, if they are not strictly aluminum oxide (Al2O3), there is a risk that a lower melting eutectic will form between the heating element metal's oxide layer and the ceramic, also an oxide. For example, mullite, a high temperature crystalline compound of alumina and silica with the formula 3Al2O32SiO2 is nominally 60% alumina and 40% silica. Mullite has the risk of small inclusions that could destroy the thin protective oxide on the underlying heating element metal. Another ceramic, called alumina, is only 90-94% alumina, and thus has the same risk.
Therefore, aluminum oxide (Al2O3) is the preferred material for the ceramic sleeve enclosing the heating element wire. The melting point of KANTHAL®, is 1500° C., and in accordance with an aspect of the invention, the structure and composition of the heating element assembly 100 enable KANTHAL®, to attain a maximum practical service temperature of 1400° C. The expected service requirement is 1400° C. (to impart a workpiece or substrate temperature of 1200-1300° C.). At such temperatures, the mechanical strength of KANTHAL® or other Fe Cr Al resistance heating alloys is very weak and ordinarily would preclude their use as heating elements. Alumina ceramic (Al2O3), by comparison melts at 2050° C. and its mechanical strength at 1400° C. is excellent.
In air, Fe Cr Al resistance heating alloy, such as KANTHAL®, forms an outer layer of aluminum oxide. As long as this aluminum oxide layer is less than ˜100 Å, the bond strength between the aluminum oxide layer and the KANTHAL®, wire is greater than the shear strength through differential thermal expansion as the wire undergoes heating cycles. At high service temperature, the aluminum oxide coating of the Fe Cr Al resistance heating alloy wire becomes thicker. When the heating element cools, the difference in thermal expansion coefficient between the heating element metal and the aluminum oxide layer makes the oxide spall off. It must then re-form but at the expense of, and in deterioration of, the underlying metal of the heating element.
In order to overcome problems associated with oxide induced deterioration of conventional heating elements, the aluminum oxide ceramic sheath 102 effectively seals and chemically isolates the Fe Cr Al resistance heating wire 104, thereby limiting the thickness of an oxide layer and preventing the heating element from becoming a source of contamination. Conversely, the aluminum oxide ceramic sheath 104 also prevents process chamber gases or sputtered particles of the workpiece or substrate from contaminating or degrading the heating element wire.
Referring to
Thus, encasing the KANTHAL®, or other Fe Cr Al resistance heating alloy wire 104 in aluminum ceramic sheath 102 prevents the formation of oxide at a given temperature and enables a Fe Cr Al resistance heating alloy wire to be used in higher temperature applications than was previously possible, up to 1400 degrees C. and above. A further advantage of this aspect of the invention is that the enclosing aluminum oxide sheath 102 is non-permeable. Thus, any contamination due to vapor pressure or spalling from the heating element wire 104 is sealed within the aluminum ceramic sheath 102. And, contamination outside the sheath 102 cannot permeate through to degrade the heating element wire 104.
Composition of the Heating Element
Referring to
The graduated Ohmic transition in the heating element wire 104 is as follows. At 20° C., KANTHAL® has a resistivity of 120 micro Ohms/cm. Nichrome has a resistivity of about 110 micro Ohms/cm. Nickel has a resistivity of 6.9 micro Ohms/cm. The wires are transitioned both according to their resistivity and their respective diameters such that the wide diameter/low resistivity Nickel is provided for a connection to a source of electric current for maximized conduction of current. Nichrome is provided as a transitional material for fusion bonding or welding to KANTHAL®, without creating undue brittleness in the KANTHAL®,
The primary heating portion or section 108 comprises KANTHAL®, or other like Fe Cr Al wire characterized by high resistance and high heat. This section is fusion bonded to virtually the same size or slightly larger diameter nichrome 110, or other similar metal wire characterized by lower resistance, and lower heat. As shown in
Fusion bonding of the separate portions of the wires allows the heating element wire to be inserted through the minimally sized through holes 103 in ceramic (Al2O3) sleeve 104 that provides necessary mechanical support for the wire at high temperatures, and which keeps multiple heating portions 108 separate and accurately indexed to optimize thermal geometry.
The foregoing aspects of the invention make KANTHAL®, or other like Fe Cr Al wire useful and cost effective to process temperatures up to 1400° C. In contrast, in conventional applications KANTHAL® shows limitations at temperatures even as low as 500° C.
Welding Techniques
The transitions between KANTHAL®, or other like Fe Cr Al wire, nichrome, and nickel are accomplished by conventional TIG or tungsten inert gas welding techniques that are performed carefully to avoid eutectic degradation. It has been found that welding of Nichrome to KANTHAL® can be accomplished without eutectic degradation by a short duration TIG welds on the order of 1/10 of a second or less. Short duration TIG welding appears to prevent exaggerated crystal growth in the KANTHAL® and prevents breaking or brittleness along grain boundaries. It may be possible to weld KANTHAL® to Nichrome by other equivalent techniques such as frictional welding.
Other welding techniques for minimizing oxide formation, porosity, and other structural flaws are well know to those skilled in the art and can be use for welding KANTHAL® to Nichrome. One such technique is that of inert gas shielded arc welding.
Terminal Configuration
Referring again to
The preferred embodiment includes a short transverse rod (torque eliminator) 126 on the threaded terminal end 114 which conformably engages a recess provided in insulator 124. The transverse rod 126 prevents inadvertent torque, during terminal tightening, from causing damage to the heating element wire. The same insulator 124 can serve both terminals, incorporating them in a single unit 120 which facilitates element installation or removal. A preferred material insulator material 124 is TEFLON®. The terminals themselves are secured to the nickel portion 112 of heating element wire 104 by welding or brazing at a terminal weld or braze joint 128.
Example Application of Heating Elements
Referring to
Each plenum is provided with a series of access ports 146 on an external sidewall for external insertion of the heating elements in modular, cartridge-like fashion into the process chamber. Each external access port 146 is provided for receiving a terminal end 120 of the heating element. Each terminal end 120 covers a respective access port 146 to maintain a closure for the inert gas in each plenum. Each heating element is fastened to the outside of the plenum in a well-known manner.
In the example, a plurality of heating elements 102 are arranged in two planar arrays disposed above and beneath a substrate 148 in process chamber 142. Heating elements 102 are inserted into the process chamber through a series of respective access ports 150 defined in sidewalls 152 of the process chamber.
In the example of
Since aluminum melts at 660° C., it is not an obvious choice for the interior of a process chamber designed for process temperatures in the vicinity of 1200° C. and above. In a conventional CVD processing system, there is an aversion to the use of aluminum as a material for the walls in a high temperature process chamber due to its low melting point (660 degrees C.) and, “due to physical sputtering of ions which attack chamber surfaces, such as aluminum walls, resulting in metal contamination of the substrate.” See U.S. Pat. No. 6,444,037 (emphasis added). However, the active cooling channels of the polished aluminum process chamber overcome this presumed limitation and prove the opposite is true by removing as much heat as possible from the aluminum surface so that it remains relatively cool and thus inert with respect to the processing. Further, by polishing the aluminum to provide a mirror like surface, heat energy is reflected back to the heating elements and to the workpiece, minimizing heat loss that would otherwise force the heating elements to a higher temperature, and minimizing ΔT between the heating elements and the workpiece.
Referring to
Referring again to
As is well understood by one skilled in the art, other materials can be used for rails. Examples include refractory metals, such as high temperature molybdenum, provided the process atmosphere is not oxidizing or otherwise corrosive. The surface of refractory metals such as molybdenum can be treated with materials such as silicon or carbon to increase its resistance to chemical attack.
Example of Operation
The heating elements in
While the invention has been described in connection with what are presently considered to be the most practical and preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments and alternatives as set forth above, but on the contrary is intended to cover various modifications and equivalent arrangements included within the scope of the forthcoming claims. For example, other high temperature metals, such as tungsten, molybdenum, or the like can be encased in a ceramic sleeve enabling thermal expansion of the metals and providing mechanical support to enable such metals to function as high temperature heating elements. Therefore, persons of ordinary skill in this field are to understand that all such equivalent arrangements and modifications are to be included within the scope of the following claims.
This patent application is a continuation in part of U.S. Ser. No. 10/772,188, filed Feb. 3, 2004.
Number | Date | Country | |
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Parent | 10772188 | Feb 2004 | US |
Child | 11893254 | Aug 2007 | US |