The present invention relates to a multi-metal wire used in semi-conductors and the hollow wire reduces the series resistance of the wire together with the parasitic capacitance between the wires and improves the operation efficiency.
A higher standard and quality is requested for the audio and video equipment due to rapid progress of multiple media, conventional monitors made of Cathode Ray Tube (CRT) are not satisfied besides requests of thin, compact and durable designs. Plasma Display Panels (PDP), Liquid Crystal Displays (LCD) or Field Emitting Displays (FED) gradually replace the Cathode Ray Tube (CRT) in the market.
The cross section area of the metal wires and the correspondent gaps between them in the Liquid Crystal Displays (LCD) have to be narrowed due to the increase of the pixels. However, the series resistance of the wires and the parasitic capacitance between the wires are increased when the cross sections and the gaps are narrowed, and the interruption of series capacitance between wires are more seriously concerned.
A multiplayer of wire having more cross areas is used to reduce the resistance, such as disclosed in Taiwan Patent No. 533325. According to the Skin Effect, the electric charges move along the surface of the conductive objects so that the depth of the conductive objects is increased so as to maintain the narrow gaps between the wires and this becomes multi-layer structure which is deemed to be material-consuming design. When a thick wire is perpendicularly and alternatively located between the information line and gate matrixes causes protrusion on the surface and is difficult to be manufactured. It is also possible to reduce the operation efficiency of the LCDs because of the cross-talk noise due to the too close of distance between the wires.
Conventional way of arrangement of wires of LCDs results in high resistance, lower operation efficiency and interruption of series capacitance, and these affect the quality of the LCDs. This invention improves the shortcomings.
The present invention relates to a hollow wire that improves the shortcomings of series resistance and interruption by capacitance.
The main character for achieving the above mentioned purposes is that the hollow wire of the present invention comprises a base board and a first main wire and a plurality sections of separated and co-axial first sub-wires are located on the base board. Conductive material is respectively located on two ends of the first main wire and the first sub-wires. The top surfaces of the conductive material is flush with each other. A plurality of second sub-wires are axially formed on the top the conductive material on the first main wire. A second main wire is connected across the conductive material on the first sub-wires and the first main wire is located beneath the second main wire. The hollow wire includes upper layer wires and lower layer of wires which are alternatively arranged with the upper layer of wires.
Another object of the present invention is to provide a method for making the hollow wire which reduces both the series resistance and the interruption of capacitance and improves the operation efficiency.
In addition, the following steps are taken to manufacture the hollow wire of the present invention:
A. Coating a Metal Layer
A first metal layer 20 is coated on a semi conductor base board;
B. Making Wires
The first metal layer is defined with the first main wire and the first sub-wires which are located on the same axis and separated by the first main wire.
C. Coating Isolation Layer
An isolation layer is coated on the base board and covers the first main wire and the first sub-wires.
D. Defining Recesses
Several recesses are defined in the isolation layer and located corresponding to the two ends of the first main wire and the second sub-wires. A separation block is located between the two recesses located on the two ends of the first main wire such that the upper layer of metal wires form separated hollow portions.
E. Forming Conductive Material
Conductive material is filled in the recesses.
F. Making Metal Layer
A second metal layer is coated on the isolation layer and covers and connected with the conductive material.
G Forming Wires
The second metal layer includes a second main wire and a plurality of sections of second sub-wires which share the same axis and are in separate from each other. The second main wire perpendicularly located between the second sub-wires. The second main wire is located corresponding to the first sub-wires and the second sub-wires are located corresponding to the first main wire.
H. Removing the Isolation Layer
The isolation layer is removed.
The present invention will become more obvious from the following description when taken in connection with the accompanying drawings which show, for purposes of illustration only, a preferred embodiment in accordance with the present invention.
Referring to
To achieve the structure mentioned above, the following steps are taken which are:
A. Coating a Metal Layer
Referring to
B. Making Wires
Referring to
C. Coating Isolation Layer
Referring to
D. Defining Recesses
Referring to
E. Forming Conductive Material
Referring to
F. Making Metal Layer
Referring to
G Forming Wires
As shown in
H. Removing the Isolation Layer
As shown in
Accordingly, the hollow wire includes upper layer of wires and lower layer of wires which are alternatively arranged with the upper layer of wires and by this specific arrangement, both the series resistance and the interruption of capacitance are reduced and the operation efficiency is improved.
The formula for calculating the resistance is R=ρ*L/A
Wherein R represents the resistance of the material, ρ represents the resistivity, L is the length of the wire and A is the cross sectional area of the wire.
If the wires are made Aluminum and Copper respectively, assuming that the length of the wires is 10, the thickness, the width and the cross sectional area are both 1, the resistance for the wire made of Aluminum is 26.7 μO, and the resistance for the wire made of Copper is 16.7 μO.
If Aluminum and Copper are respectively used to made the hollow wire of the present invention, as shown in
It is noted that the hollow wire of the present invention has less resistance regardless of the ratio of length and width of the sub-wires.
While we have shown and described the embodiment in accordance with the present invention, it should be clear to those skilled in the art that further embodiments may be made without departing from the scope of the present invention.