Cross-sectional geometry

Industry

CPC
H01L23/5283

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5283Cross-sectional geometry

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Memory arrays comprising strings of memory cells and methods used i...
- Patent number 12,176,034
- Issue date Dec 24, 2024
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory arrays comprising strings of memory cells and methods used i...
- Patent number 12,176,035
- Issue date Dec 24, 2024
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory device and method of forming the same
- Patent number 12,176,286
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Shyue Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric capping structure overlying a conductive structure to in...
- Patent number 12,176,246
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices having improved contact plug structures...
- Patent number 12,176,287
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Won Kyu Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including support structures
- Patent number 12,176,300
- Issue date Dec 24, 2024
- Micron Technology, Inc.
- Andrew Zhe Wei Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating redistribution circuit structure
- Patent number 12,170,223
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact features and methods of fabricating the same in Fin field-e...
- Patent number 12,170,245
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene BEOL integration interconnection structures
- Patent number 12,170,248
- Issue date Dec 17, 2024
- DESTINATION 2D
- Klaus Schuegraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frame reveals with maskless lithography in the manufacture of integ...
- Patent number 12,165,987
- Issue date Dec 10, 2024
- Intel Corporation
- Grant Kloster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory devices, methods of manufact...
- Patent number 12,167,598
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Kanamori Kohji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical memory devices
- Patent number 12,167,605
- Issue date Dec 10, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming interconnect structure having a barrier layer
- Patent number 12,165,975
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor device including a through-via stru...
- Patent number 12,165,976
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Junhyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 12,166,009
- Issue date Dec 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device contact and method of making same
- Patent number 12,165,915
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory structure and interconnect structure of semico...
- Patent number 12,165,970
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for preparing semiconductor stru...
- Patent number 12,166,028
- Issue date Dec 10, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xiao Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,159,883
- Issue date Dec 3, 2024
- Innolux Corporation
- Yun-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing integrated circuit device with bonding stru...
- Patent number 12,159,831
- Issue date Dec 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Tzu-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including an isolation-trench etch...
- Patent number 12,160,989
- Issue date Dec 3, 2024
- SanDisk Technologies LLC
- Ramy Nashed Bassely Said
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and data storage system including the same
- Patent number 12,160,991
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Haemin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 12,159,834
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Jungho Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with non-uniformly distributed vias
- Patent number 12,159,829
- Issue date Dec 3, 2024
- Infineon Technologies Austria AG
- Sergey Yuferev
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chemical direct pattern plating method
- Patent number 12,159,837
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Jiun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shared bit lines for memory cells
- Patent number 12,160,985
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ping-Wei Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory devices including different tier pitches, and related electr...
- Patent number 12,160,993
- Issue date Dec 3, 2024
- Yifen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,159,843
- Issue date Dec 3, 2024
- Kioxia Corporation
- Daisuke Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method of forming
- Patent number 12,154,838
- Issue date Nov 26, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell and semiconductor device having the same
- Patent number 12,156,485
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chao Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Contact Feature Through Heterogeneous Stacked Film and Methods of M...
- Publication number 20240429090
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jhen Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT WITH TOP CHIP INCLUDING LOCAL...
- Publication number 20240429128
- Publication date Dec 26, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Anupam Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240429170
- Publication date Dec 26, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Junichi KOEZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D FLASH MEMORY AND MANUFACTURING METHOD THEREOF
- Publication number 20240431103
- Publication date Dec 26, 2024
- IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
- Yun Heub SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BLOCK-ON-BLOCK MEMORY ARRAY ARCHITECTURE USING BI-DIRECTIONAL STAIR...
- Publication number 20240431110
- Publication date Dec 26, 2024
- Lodestar Licensing Group LLC
- Aaron S. Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429159
- Publication date Dec 26, 2024
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HIGH VOLTAGE TERMINATION
- Publication number 20240429288
- Publication date Dec 26, 2024
- Infineon Technologies Austria AG
- Felix Simon Winterer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240429118
- Publication date Dec 26, 2024
- KIOXIA Corporation
- Keisuke TOKUBUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429165
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Dongsik PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240431099
- Publication date Dec 26, 2024
- WINBOND ELECTRONICS CORP.
- Frederick CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH FLIPPED STAIRCASE INTERCONNECT STRU...
- Publication number 20240429164
- Publication date Dec 26, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL BUDGET ENHANCED BURIED POWER RAIL AND METHOD OF MANUFACTURI...
- Publication number 20240429169
- Publication date Dec 26, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- Saehan PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY AND FABRICATION METHOD THEREOF, MEMORY SYS...
- Publication number 20240431100
- Publication date Dec 26, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240421071
- Publication date Dec 19, 2024
- KIOXIA Corporation
- Ha HOANG
- G11 - INFORMATION STORAGE
Information Patent Application
METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)
- Publication number 20240421067
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240421072
- Publication date Dec 19, 2024
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH MEMORY STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240421080
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240422966
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Yanghee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING
- Publication number 20240421027
- Publication date Dec 19, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF MIDDLE-OF-LINE RESISTANCE AND CAPACITANCE
- Publication number 20240421078
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LEVELS WITH MULTIPLE LINE TYPES
- Publication number 20240421079
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END DIELECTRIC-BASED MEMORY STRUCTURE IN A SEMICONDUCTOR DEVICE
- Publication number 20240421036
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Feng Kao
- G11 - INFORMATION STORAGE
Information Patent Application
STACKED DEVICES WITH BACKSIDE CONTACTS
- Publication number 20240421038
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240421166
- Publication date Dec 19, 2024
- RENESAS ELECTRONICS CORPORATION
- Makoto KOSHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240421083
- Publication date Dec 19, 2024
- KIOXIA Corporation
- Tatsuya KOGISO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20240422983
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Kohji Kanamori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20240421081
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Seulji Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421082
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Jeon Won Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR MANUFACTURING SEMICONDU...
- Publication number 20240421084
- Publication date Dec 19, 2024
- KIOXIA Corporation
- Kyosuke NANAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR FABRICATING THE SAME
- Publication number 20240413007
- Publication date Dec 12, 2024
- NANYA TECHNOLOGY CORPORATION
- CHIH-WEI HUANG
- H01 - BASIC ELECTRIC ELEMENTS

Cross-sectional geometry

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Memory arrays comprising strings of memory cells and methods used i...

Memory arrays comprising strings of memory cells and methods used i...

Memory device and method of forming the same

Dielectric capping structure overlying a conductive structure to in...

Integrated circuit devices having improved contact plug structures...

Memory device including support structures

Method of fabricating redistribution circuit structure

Contact features and methods of fabricating the same in Fin field-e...

Graphene BEOL integration interconnection structures

Frame reveals with maskless lithography in the manufacture of integ...

Three-dimensional semiconductor memory devices, methods of manufact...

Vertical memory devices

Method of forming interconnect structure having a barrier layer

Three-dimensional semiconductor device including a through-via stru...

Semiconductor device packages and methods of manufacturing the same

Semiconductor device contact and method of making same

Semiconductor memory structure and interconnect structure of semico...

Semiconductor structure and method for preparing semiconductor stru...

Display device

Method of manufacturing integrated circuit device with bonding stru...

Three-dimensional memory device including an isolation-trench etch...

Semiconductor device and data storage system including the same

Semiconductor devices

Semiconductor package with non-uniformly distributed vias

Chemical direct pattern plating method

Shared bit lines for memory cells

Memory devices including different tier pitches, and related electr...

Semiconductor device

Semiconductor arrangement and method of forming

Memory cell and semiconductor device having the same

Patents Applicationslast 30 patents

Contact Feature Through Heterogeneous Stacked Film and Methods of M...

THREE-DIMENSIONAL INTEGRATED CIRCUIT WITH TOP CHIP INCLUDING LOCAL...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

3D FLASH MEMORY AND MANUFACTURING METHOD THEREOF

BLOCK-ON-BLOCK MEMORY ARRAY ARCHITECTURE USING BI-DIRECTIONAL STAIR...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH HIGH VOLTAGE TERMINATION

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FORMING THE SAME

INTEGRATED CIRCUIT DEVICES WITH FLIPPED STAIRCASE INTERCONNECT STRU...

THERMAL BUDGET ENHANCED BURIED POWER RAIL AND METHOD OF MANUFACTURI...

THREE-DIMENSIONAL MEMORY AND FABRICATION METHOD THEREOF, MEMORY SYS...

SEMICONDUCTOR MEMORY DEVICE

METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

HIGH BANDWIDTH MEMORY STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING

REDUCTION OF MIDDLE-OF-LINE RESISTANCE AND CAPACITANCE

INTERCONNECT LEVELS WITH MULTIPLE LINE TYPES

BACK END DIELECTRIC-BASED MEMORY STRUCTURE IN A SEMICONDUCTOR DEVICE

STACKED DEVICES WITH BACKSIDE CONTACTS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

MEMORY DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR MANUFACTURING SEMICONDU...

SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR FABRICATING THE SAME