Cross-sectional geometry

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5283Cross-sectional geometry

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor manufacturing system, method of manufacturing a semic...
- Patent number 12,217,962
- Issue date Feb 4, 2025
- Kioxia Corporation
- Shingo Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driving connection structures of memory devices
- Patent number 12,218,061
- Issue date Feb 4, 2025
- Macronix International Co., Ltd.
- Ya-Chun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including self-aligned conductive contacts
- Patent number 12,218,008
- Issue date Feb 4, 2025
- Micron Technology, Inc.
- Kar Wui Thong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated circuit device having an etch-stop...
- Patent number 12,218,054
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Taeyong Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with logic and memory
- Patent number 12,219,769
- Issue date Feb 4, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,218,046
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Eui Bok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with a polysilicon structure above a stairc...
- Patent number 12,218,081
- Issue date Feb 4, 2025
- Lodestar Licensing Group LLC
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective ILD deposition for fully aligned via with airgap
- Patent number 12,218,003
- Issue date Feb 4, 2025
- Adeia Semiconductor Solutions LLC
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier layer for metal insulator metal capacitors
- Patent number 12,218,181
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with conductive contacts of differen...
- Patent number 12,218,055
- Issue date Feb 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Ming-Hung Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an individualization zone of an integrated circuit
- Patent number 12,218,083
- Issue date Feb 4, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Nicolas Posseme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 12,219,763
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Jisung Cheon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonvolatile memory chip and semiconductor package including the same
- Patent number 12,219,774
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Min Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,211,738
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chih Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 12,213,317
- Issue date Jan 28, 2025
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuit and fabrication thereof
- Patent number 12,211,789
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chenming Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier layer for metal insulator metal capacitors
- Patent number 12,211,890
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,213,309
- Issue date Jan 28, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Gongyi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of fabrication thereof
- Patent number 12,211,787
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic system including the same
- Patent number 12,213,313
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Junghyun Roh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,211,846
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Sung Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing recessed gate structure with protection layer
- Patent number 12,211,905
- Issue date Jan 28, 2025
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device with improved cutoff characteristics
- Patent number 12,211,913
- Issue date Jan 28, 2025
- Kioxia Corporation
- Yoshiro Shimojo
- G11 - INFORMATION STORAGE
Information Patent Grant
Wafer-level design and wiring pattern for a semiconductor package
- Patent number 12,205,904
- Issue date Jan 21, 2025
- Nepes Co., Ltd.
- Yong Tae Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring
- Patent number 12,205,885
- Issue date Jan 21, 2025
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact via formation
- Patent number 12,205,896
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Lin-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure, semiconductor device and method of manufacturing...
- Patent number 12,205,890
- Issue date Jan 21, 2025
- Macronix International Co., Ltd.
- Li-Yen Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having staircase structure and meth...
- Patent number 12,205,895
- Issue date Jan 21, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, circuit board structure and manufacturing met...
- Patent number 12,205,923
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices
- Patent number 12,207,473
- Issue date Jan 21, 2025
- Lodestar Licensing Group LLC
- Umberto Maria Meotto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH PROTECTION LAYER AND METHOD FOR FABRICATI...
- Publication number 20250046708
- Publication date Feb 6, 2025
- NANYA TECHNOLOGY CORPORATION
- CHUN-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PROTECTION LAYER AND METHOD FOR FABRICATI...
- Publication number 20250046709
- Publication date Feb 6, 2025
- NANYA TECHNOLOGY CORPORATION
- CHUN-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE ENHANCED ASPECT RATIO CONNECTOR FOR SEMICONDUCTOR DE...
- Publication number 20250046711
- Publication date Feb 6, 2025
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20250046712
- Publication date Feb 6, 2025
- Shinko Electric Industries Co., Ltd.
- Yoshiki AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM...
- Publication number 20250048628
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Joonyoung Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MEMORY CELL AND SEMICONDUCTOR DEVICE HAVING MEMO...
- Publication number 20250048941
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGES INCLUDING COMMAND/ADDRESS CONNECTIONS, AND RELATED...
- Publication number 20250046710
- Publication date Feb 6, 2025
- Micron Technology Inc.
- Scott Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20250046653
- Publication date Feb 6, 2025
- RENESAS ELECTRONICS CORPORATION
- Katsuhiko HOTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20250046355
- Publication date Feb 6, 2025
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED PATTERNING WITH COLORED BLOCKING AND STRUCTURES RESULT...
- Publication number 20250046713
- Publication date Feb 6, 2025
- Intel Corporation
- Mohit K. HARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046725
- Publication date Feb 6, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seok Hwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF SIZE OF EDGE CELL REGION IN MEMORY DEVICES
- Publication number 20250048612
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
One-Time Programming Memory Device with Backside Isolation Structure
- Publication number 20250048686
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND STRUCTURE
- Publication number 20250038106
- Publication date Jan 30, 2025
- Advanced Semiconductor Engineering, Inc.
- Chun-Wei CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH OVERLAPPING METAL VIAS
- Publication number 20250038107
- Publication date Jan 30, 2025
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20250038131
- Publication date Jan 30, 2025
- Yangtze Memory Technologies Co., Ltd.
- Wei Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH BACKSIDE INTERCONNECT STRUCTURE AND THRO...
- Publication number 20250038074
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING STAIRS IN THREE-DIMENSIONAL MEMORY DEVICES
- Publication number 20250038046
- Publication date Jan 30, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xiangning Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF MIM CAPACITOR AND HEAT SINK
- Publication number 20250038103
- Publication date Jan 30, 2025
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED ELECTRON...
- Publication number 20250038109
- Publication date Jan 30, 2025
- Micron Technology, Inc.
- Paolo Tessariol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20250040144
- Publication date Jan 30, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250040185
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Hyojin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250038067
- Publication date Jan 30, 2025
- nD-HI Technologies Lab, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS HAVING HIGHLY COMPACT DEVICES THEREIN, AND MEMO...
- Publication number 20250038108
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Eunsuk HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...
- Publication number 20250029922
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- SZU-LING LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORRUGATED TIER SUPPORT STRUCTURE AND REPLACEMENT SOURCE INTERIOR C...
- Publication number 20250029924
- Publication date Jan 23, 2025
- Micron Technology, Inc.
- Darwin A. Clampitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING 2-TRANSISTOR MEMORY CELL STRUCTURE FOR NEUR...
- Publication number 20250029638
- Publication date Jan 23, 2025
- Micron Technology, Inc.
- Kamal M. Karda
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH LINER STRUCTURE
- Publication number 20250029873
- Publication date Jan 23, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250029923
- Publication date Jan 23, 2025
- SOCIONEXT INC.
- Masato NAKOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING VIAS WITH DIFFERENT DIMENSIONS AND M...
- Publication number 20250029945
- Publication date Jan 23, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS

Cross-sectional geometry

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor manufacturing system, method of manufacturing a semic...

Driving connection structures of memory devices

Memory device including self-aligned conductive contacts

Method of forming an integrated circuit device having an etch-stop...

3D semiconductor device and structure with logic and memory

Semiconductor device and method of fabricating the same

Microelectronic devices with a polysilicon structure above a stairc...

Selective ILD deposition for fully aligned via with airgap

Barrier layer for metal insulator metal capacitors

Semiconductor device structure with conductive contacts of differen...

Method of making an individualization zone of an integrated circuit

Integrated circuit device

Nonvolatile memory chip and semiconductor package including the same

Semiconductor structure and manufacturing method thereof

Memory arrays and methods used in forming a memory array comprising...

Three dimensional integrated circuit and fabrication thereof

Barrier layer for metal insulator metal capacitors

Semiconductor device and manufacturing method thereof

Interconnect structures and methods of fabrication thereof

Semiconductor device and electronic system including the same

Semiconductor device

Method for preparing recessed gate structure with protection layer

Semiconductor storage device with improved cutoff characteristics

Wafer-level design and wiring pattern for a semiconductor package

Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring

Contact via formation

Circuit structure, semiconductor device and method of manufacturing...

Three-dimensional memory device having staircase structure and meth...

Semiconductor device, circuit board structure and manufacturing met...

Memory devices

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH PROTECTION LAYER AND METHOD FOR FABRICATI...

SEMICONDUCTOR DEVICE WITH PROTECTION LAYER AND METHOD FOR FABRICATI...

LOW RESISTANCE ENHANCED ASPECT RATIO CONNECTOR FOR SEMICONDUCTOR DE...

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM...

METHODS OF FORMING MEMORY CELL AND SEMICONDUCTOR DEVICE HAVING MEMO...

DEVICE PACKAGES INCLUDING COMMAND/ADDRESS CONNECTIONS, AND RELATED...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING SEMICONDUCT...

SELF-ALIGNED PATTERNING WITH COLORED BLOCKING AND STRUCTURES RESULT...

SEMICONDUCTOR PACKAGE

REDUCTION OF SIZE OF EDGE CELL REGION IN MEMORY DEVICES

One-Time Programming Memory Device with Backside Isolation Structure

BOND STRUCTURE

INTERCONNECT STRUCTURES WITH OVERLAPPING METAL VIAS

THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR DEVICES WITH BACKSIDE INTERCONNECT STRUCTURE AND THRO...

METHODS FOR FORMING STAIRS IN THREE-DIMENSIONAL MEMORY DEVICES

STRUCTURE OF MIM CAPACITOR AND HEAT SINK

MEMORY DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED ELECTRON...

MEMORY DEVICE

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUITS HAVING HIGHLY COMPACT DEVICES THEREIN, AND MEMO...

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...

CORRUGATED TIER SUPPORT STRUCTURE AND REPLACEMENT SOURCE INTERIOR C...

MEMORY DEVICE INCLUDING 2-TRANSISTOR MEMORY CELL STRUCTURE FOR NEUR...

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH LINER STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE HAVING VIAS WITH DIFFERENT DIMENSIONS AND M...