Cross-sectional geometry

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H01L23/5283

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/5283Cross-sectional geometry

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic devices with through-substrate interconnects and as...
- Patent number 12,368,096
- Issue date Jul 22, 2025
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor device
- Patent number 12,368,098
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell and semiconductor memory device with the same
- Patent number 12,369,306
- Issue date Jul 22, 2025
- SK Hynix Inc.
- Seung Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices having a support stack comprising...
- Patent number 12,369,317
- Issue date Jul 22, 2025
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device with etched landing pad surface and manufactur...
- Patent number 12,369,298
- Issue date Jul 22, 2025
- NANYA TECHNOLOGY CORPORATION
- Yen-Ho Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device
- Patent number 12,369,292
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsin Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing dual-depth drain-select-...
- Patent number 12,369,319
- Issue date Jul 22, 2025
- SanDisk Technologies, Inc.
- Akihiro Tobioka
- G11 - INFORMATION STORAGE
Information Patent Grant
IGBT chip integrating temperature sensor
- Patent number 12,368,082
- Issue date Jul 22, 2025
- Huawei Technologies Co., Ltd.
- Boning Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures for reducing electrical shorts and methods of fo...
- Patent number 12,368,097
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory array structure
- Patent number 12,362,015
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Gerben Doornbos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a semiconductor device bonded to a cir...
- Patent number 12,362,276
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partial barrier free vias for cobalt-based interconnects and method...
- Patent number 12,362,281
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,362,280
- Issue date Jul 15, 2025
- Renesas Electronics Corporation
- Takeshi Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scaled 2T DRAM
- Patent number 12,362,004
- Issue date Jul 15, 2025
- International Business Machines Corporation
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,362,274
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and data storage systems including the same
- Patent number 12,363,899
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Yonghoon Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including TSVs of different lengths...
- Patent number 12,362,243
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package structure including a plurality of an...
- Patent number 12,362,275
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,362,277
- Issue date Jul 15, 2025
- Kioxia Corporation
- Takuya Inatsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,356,613
- Issue date Jul 8, 2025
- Kioxia Corporation
- Takuya Suzuki
- G11 - INFORMATION STORAGE
Information Patent Grant
Wafer structure including probe marked test pads
- Patent number 12,354,921
- Issue date Jul 8, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structures
- Patent number 12,354,953
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bi-layer alloy liner for interconnect metallization and methods of...
- Patent number 12,354,910
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Delamination control of dielectric layers of integrated circuit chips
- Patent number 12,354,946
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with high contact via density and m...
- Patent number 12,354,955
- Issue date Jul 8, 2025
- SanDisk Technologies, Inc.
- Tomohiro Kubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,354,671
- Issue date Jul 8, 2025
- Kioxia Corporation
- Koji Kato
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device including a variable resistance memory
- Patent number 12,356,635
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Hyunmog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer features
- Patent number 12,354,959
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory device and electronic system...
- Patent number 12,354,659
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Seung Yoon Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor devices
- Patent number 12,354,660
- Issue date Jul 8, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Eunseok Lee
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250239526
- Publication date Jul 24, 2025
- KIOXIA Corporation
- Hikaru ARAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND SYSTEM INCLUDING THE SAME
- Publication number 20250240963
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Junhyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250241057
- Publication date Jul 24, 2025
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT MEMORY DEVICES THAT SUPPORT CHIP-SCALE PACKAGING
- Publication number 20250240966
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Kohji Kanamori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING SELF-ALIGNED CONDUCTIVE CONTACTS
- Publication number 20250239485
- Publication date Jul 24, 2025
- Micron Technology, Inc.
- Kar Wui Thong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING DIFFERENT SHAPE SUPPORT PILL...
- Publication number 20250239305
- Publication date Jul 24, 2025
- SANDISK TECHNOLOGIES LLC
- Akira TAKAHASHI
- G11 - INFORMATION STORAGE
Information Patent Application
CROSS-POINT MEMORY CELL AND METHOD
- Publication number 20250240976
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui-Jen WU
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICE, METHOD OF MANUFACTURING, AND INTEGRATED CIRCUIT DEVICE
- Publication number 20250239304
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Huai-Ying HUANG
- G11 - INFORMATION STORAGE
Information Patent Application
STACKED TRANSISTORS WITH VERTICAL INTERCONNECT
- Publication number 20250233070
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shao-Tse Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250233071
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI-TA LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SELECTIVE BOTTOM WIDENING OF HIGH ASPECT RATIO OPENINGS T...
- Publication number 20250234553
- Publication date Jul 17, 2025
- SANDISK TECHNOLOGIES LLC
- Bing ZHOU
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250234599
- Publication date Jul 17, 2025
- Fuji Electric Co., Ltd.
- Motoyoshi KUBOUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING BONDING STRUCTURE
- Publication number 20250234511
- Publication date Jul 17, 2025
- NANYA TECHNOLOGY CORPORATION
- YI-JEN LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20250233075
- Publication date Jul 17, 2025
- WINBOND ELECTRONICS CORP.
- Yoshinori TANAKA
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENTIONAL SEMICONDUCTOR DEVICE
- Publication number 20250233065
- Publication date Jul 17, 2025
- SK HYNIX INC.
- Sung Lae OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, WIRING STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20250233068
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SELECTIVE METAL CAP FORMATION
- Publication number 20250233074
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH BONDING STRUCTURE AND METHOD FOR MANUF...
- Publication number 20250234593
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Jong Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20250233035
- Publication date Jul 17, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Kyeong Tae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH ULTRA THICK METAL AND MANUFACTURING ME...
- Publication number 20250233069
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jyun-Min Syu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250233084
- Publication date Jul 17, 2025
- KIOXIA Corporation
- Kyosuke NANAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250226314
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- JEEWOONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250227919
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Junghwan HUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MEMORY STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250228146
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hai-Dang Trinh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250226374
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Yongbum Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250226010
- Publication date Jul 10, 2025
- STMicroelectronics International N.V.
- Olivier WEBER
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING IMAGE SENSOR AND MRAM DEVICE
- Publication number 20250228027
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- YU-FANG CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STATIC RANDOM ACCESS MEMORY AND METHOD FOR FORMING THE SAME
- Publication number 20250227908
- Publication date Jul 10, 2025
- UNITED MICROELECTRONICS CORP.
- Chih-Kai Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED METAL-FILLING QUALITY OF METAL G...
- Publication number 20250226307
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuting CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LINES WITH LINE WIDTH PROFILE
- Publication number 20250226313
- Publication date Jul 10, 2025
- International Business Machines Corporation
- James P. Mazza
- H01 - BASIC ELECTRIC ELEMENTS

Cross-sectional geometry

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microelectronic devices with through-substrate interconnects and as...

Methods of forming semiconductor device

Memory cell and semiconductor memory device with the same

Three-dimensional memory devices having a support stack comprising...

Semiconductor device with etched landing pad surface and manufactur...

Memory device

Three-dimensional memory device containing dual-depth drain-select-...

IGBT chip integrating temperature sensor

Contact structures for reducing electrical shorts and methods of fo...

Memory array structure

Semiconductor package having a semiconductor device bonded to a cir...

Partial barrier free vias for cobalt-based interconnects and method...

Semiconductor device and method of manufacturing the same

Scaled 2T DRAM

Package structure and method of forming the same

Semiconductor devices and data storage systems including the same

Semiconductor device assemblies including TSVs of different lengths...

Method of fabricating package structure including a plurality of an...

Semiconductor device

Semiconductor memory device

Wafer structure including probe marked test pads

Via structures

Bi-layer alloy liner for interconnect metallization and methods of...

Delamination control of dielectric layers of integrated circuit chips

Three-dimensional memory device with high contact via density and m...

Semiconductor memory device

Three-dimensional memory device including a variable resistance memory

Redistribution layer features

Three-dimensional semiconductor memory device and electronic system...

Semiconductor devices

Patents Applicationslast 30 patents

SEMICONDUCTOR MEMORY DEVICE

MEMORY DEVICE AND SYSTEM INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT MEMORY DEVICES THAT SUPPORT CHIP-SCALE PACKAGING

MEMORY DEVICE INCLUDING SELF-ALIGNED CONDUCTIVE CONTACTS

THREE-DIMENSIONAL MEMORY DEVICE HAVING DIFFERENT SHAPE SUPPORT PILL...

CROSS-POINT MEMORY CELL AND METHOD

MEMORY DEVICE, METHOD OF MANUFACTURING, AND INTEGRATED CIRCUIT DEVICE

STACKED TRANSISTORS WITH VERTICAL INTERCONNECT

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD OF SELECTIVE BOTTOM WIDENING OF HIGH ASPECT RATIO OPENINGS T...

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING BONDING STRUCTURE

METHOD OF FORMING SEMICONDUCTOR STRUCTURE

THREE-DIMENTIONAL SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, WIRING STRUCTURE AND MANUFACTURING METHOD THE...

METHODS FOR SELECTIVE METAL CAP FORMATION

SEMICONDUCTOR STRUCTURE WITH BONDING STRUCTURE AND METHOD FOR MANUF...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

SEMICONDUCTOR STRUCTURE WITH ULTRA THICK METAL AND MANUFACTURING ME...

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, MEMORY STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE

SEMICONDUCTOR STRUCTURE INCLUDING IMAGE SENSOR AND MRAM DEVICE

STATIC RANDOM ACCESS MEMORY AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE WITH IMPROVED METAL-FILLING QUALITY OF METAL G...

INTERCONNECT LINES WITH LINE WIDTH PROFILE