Cross-sectional geometry

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H01L23/5283

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5283Cross-sectional geometry

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Ferroelectric memory cell
- Patent number 12,250,824
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cap structure for interconnect dielectrics and methods of fabrication
- Patent number 12,249,577
- Issue date Mar 11, 2025
- Intel Corporation
- Shashi Vyas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including penetration via structure
- Patent number 12,249,558
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with stacked conductive plugs and me...
- Patent number 12,249,576
- Issue date Mar 11, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-stack contact via structures for a three-dimensional memory...
- Patent number 12,250,814
- Issue date Mar 11, 2025
- SanDisk Technologies, Inc.
- Kenichi Shimomura
- G11 - INFORMATION STORAGE
Information Patent Grant
Protection structures for bonded wafers
- Patent number 12,243,772
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ssu-Chiang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,243,777
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Woojin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-mask alternating line deposition
- Patent number 12,243,819
- Issue date Mar 4, 2025
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with fine metal lines for BEOL structure and m...
- Patent number 12,243,820
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Taeyong Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive line structures and method of forming same
- Patent number 12,243,821
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hiranmay Biswas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory system with multiple wiring boards with multiple projecting...
- Patent number 12,243,612
- Issue date Mar 4, 2025
- Kioxia Corporation
- Kenta Iwasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Through-circuit vias in interconnect structures
- Patent number 12,243,805
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method of manufacturing the same
- Patent number 12,243,818
- Issue date Mar 4, 2025
- SK hynix Inc.
- Jin Ha Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SRAM cell word line structure with reduced RC effects
- Patent number 12,245,412
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hidehiro Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and same
- Patent number 12,237,222
- Issue date Feb 25, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Fan Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power rail for physical failure analysis (PFA)
- Patent number 12,237,233
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with stacked conductive plugs and me...
- Patent number 12,237,260
- Issue date Feb 25, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a contact structure
- Patent number 12,237,261
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell, semiconductor device having the same, and methods of m...
- Patent number 12,239,031
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crosstalk cancelation structures having metal layers between signal...
- Patent number 12,237,258
- Issue date Feb 25, 2025
- RAMBUS INC.
- Shahram Nikoukary
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with improved interposer structure
- Patent number 12,237,262
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures comprising a via structure with a first pr...
- Patent number 12,237,274
- Issue date Feb 25, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zongzheng Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-speed die connections using a conductive insert
- Patent number 12,237,286
- Issue date Feb 25, 2025
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device with increased reliability and method f...
- Patent number 12,238,930
- Issue date Feb 25, 2025
- KIOXIA CORPORATION
- Masaki Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric memory device, manufacturing method of the ferroelect...
- Patent number 12,238,932
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Rainer Yen-Chieh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,230,534
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy metal bonding pads for underfill application in semiconductor...
- Patent number 12,232,307
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory devices
- Patent number 12,232,323
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Euntaek Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices
- Patent number 12,232,328
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method to increase effective capacitance with layout...
- Patent number 12,230,569
- Issue date Feb 18, 2025
- Intel Corporation
- Kushal Sreedhar
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250079315
- Publication date Mar 6, 2025
- WINBOND ELECTRONICS CORP.
- Jian-Ting CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20250079391
- Publication date Mar 6, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR GAP FILL AND PLANARIZATION
- Publication number 20250079304
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Liang-Shiuan PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACTS IN SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME
- Publication number 20250081523
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079369
- Publication date Mar 6, 2025
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR AND STRUCTURE OF A SEMICONDUCTOR STRUCTURE
- Publication number 20250081437
- Publication date Mar 6, 2025
- CXMT Corporation
- Deyuan XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250081465
- Publication date Mar 6, 2025
- KIOXIA Corporation
- Hiroyuki KUTSUKAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING SUBSTRATE WITH INTERCONNECT UNITS BOUNDED B...
- Publication number 20250079307
- Publication date Mar 6, 2025
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE
- Publication number 20250079317
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Changyeon SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250079305
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Jun Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, FORMING METHOD THEREOF AND SEMICONDUCTOR D...
- Publication number 20250081451
- Publication date Mar 6, 2025
- Yangtze Memory Technologies Co., Ltd.
- Wugen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250081601
- Publication date Mar 6, 2025
- SOCIONEXT INC.
- Kazuo TODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250079306
- Publication date Mar 6, 2025
- KIOXIA Corporation
- Megumi ISHIDUKI
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM...
- Publication number 20250081459
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- SUSEONG NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250067793
- Publication date Feb 27, 2025
- InnoLux Corporation
- Chia-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC...
- Publication number 20250071968
- Publication date Feb 27, 2025
- Beijing Superstring Academy of Memory Technology
- Xuezheng AI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SAME
- Publication number 20250071977
- Publication date Feb 27, 2025
- CXMT Corporation
- Yexiao YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250072048
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Youngjin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-FUSE CELLS WITH BACKSIDE POWER RAILS
- Publication number 20250070018
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- I-Hsin Yang
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250070024
- Publication date Feb 27, 2025
- KIOXIA Corporation
- Takafumi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE BARRIER STRUCTURE AND METHOD FO...
- Publication number 20250069947
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- WEI-CHEN PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250070002
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Kyungtae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250070021
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Ki-Il KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING MEMORY DEVICE
- Publication number 20250070025
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Shyue Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICES AND ELECTRONIC...
- Publication number 20250069950
- Publication date Feb 27, 2025
- Micron Technology, Inc.
- Raja Kumar Varma Manthena
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabricating Redistribution Circuit Structure
- Publication number 20250069951
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR DEVICE INCLUDING A THROUGH-VIA STRU...
- Publication number 20250070029
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Junhyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICES, METHODS FOR FABRICATING THE SAME AND...
- Publication number 20250071992
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Min Yong Lee
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE CONTACT LAYER HAVING HO...
- Publication number 20250071998
- Publication date Feb 27, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Masanori TSUTSUMI
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE HAVING MEMORY STRINGS ARRANGED IN A VERTICAL D...
- Publication number 20250072001
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Hanbyeol LEE
- G11 - INFORMATION STORAGE

Cross-sectional geometry

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ferroelectric memory cell

Cap structure for interconnect dielectrics and methods of fabrication

Semiconductor device including penetration via structure

Semiconductor device structure with stacked conductive plugs and me...

Through-stack contact via structures for a three-dimensional memory...

Protection structures for bonded wafers

Semiconductor device and method of manufacturing the same

Single-mask alternating line deposition

Semiconductor device with fine metal lines for BEOL structure and m...

Conductive line structures and method of forming same

Memory system with multiple wiring boards with multiple projecting...

Through-circuit vias in interconnect structures

Memory device and method of manufacturing the same

SRAM cell word line structure with reduced RC effects

Method for manufacturing semiconductor device and same

Backside power rail for physical failure analysis (PFA)

Semiconductor device structure with stacked conductive plugs and me...

Semiconductor device having a contact structure

Memory cell, semiconductor device having the same, and methods of m...

Crosstalk cancelation structures having metal layers between signal...

Semiconductor package with improved interposer structure

Semiconductor structures comprising a via structure with a first pr...

High-speed die connections using a conductive insert

Semiconductor memory device with increased reliability and method f...

Ferroelectric memory device, manufacturing method of the ferroelect...

Semiconductor device and method of manufacture

Dummy metal bonding pads for underfill application in semiconductor...

Three-dimensional semiconductor memory devices

Memory devices

Apparatus and method to increase effective capacitance with layout...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

PACKAGING STRUCTURE AND PACKAGING METHOD

SEMICONDUCTOR GAP FILL AND PLANARIZATION

CONTACTS IN SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE

MANUFACTURING METHOD FOR AND STRUCTURE OF A SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR PACKAGING SUBSTRATE WITH INTERCONNECT UNITS BOUNDED B...

SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR STRUCTURE, FORMING METHOD THEREOF AND SEMICONDUCTOR D...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MEMORY DEVICE

THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM...

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SAME

SEMICONDUCTOR DEVICE

ANTI-FUSE CELLS WITH BACKSIDE POWER RAILS

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR DEVICE WITH COMPOSITE BARRIER STRUCTURE AND METHOD FO...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF FORMING MEMORY DEVICE

MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICES AND ELECTRONIC...

Method of Fabricating Redistribution Circuit Structure

THREE-DIMENSIONAL SEMICONDUCTOR DEVICE INCLUDING A THROUGH-VIA STRU...

SEMICONDUCTOR MEMORY DEVICES, METHODS FOR FABRICATING THE SAME AND...

THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE CONTACT LAYER HAVING HO...

SEMICONDUCTOR DEVICE HAVING MEMORY STRINGS ARRANGED IN A VERTICAL D...