Cross-sectional geometry

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H01L23/5283

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5283Cross-sectional geometry

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor memory device
- Patent number 12,272,646
- Issue date Apr 8, 2025
- United Microelectronics Corp.
- Feng-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell with top electrode via
- Patent number 12,274,183
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Che Ku
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure having an anchor-shaped backside via
- Patent number 12,272,634
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device
- Patent number 12,274,058
- Issue date Apr 8, 2025
- Macronix International Co., Ltd.
- Shih-Hung Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional semiconductor memory device and electronic system...
- Patent number 12,274,062
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Younjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,272,635
- Issue date Apr 8, 2025
- SK hynix Inc.
- Jae Yoon Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and fabricating methods thereof
- Patent number 12,272,645
- Issue date Apr 8, 2025
- Yangtze Memory Technologies Co., Ltd.
- Lei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,274,070
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method of fabricating the same
- Patent number 12,268,000
- Issue date Apr 1, 2025
- Macronix International Co., Ltd.
- Chia-Tze Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional NAND memory and fabrication method thereof
- Patent number 12,266,403
- Issue date Apr 1, 2025
- Yangtze Memory Technologies Co., Ltd.
- Di Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Enlarging contact area and process window for a contact via
- Patent number 12,266,563
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with an etch-stop layer forming a cavity
- Patent number 12,266,565
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top-interconnection metal lines for a memory array device and metho...
- Patent number 12,268,097
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Feng Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via interconnects with line wiggling prevention
- Patent number 12,266,605
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom barrier free interconnects without voids
- Patent number 12,266,607
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal device capacitance enhancement
- Patent number 12,261,196
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lu-Sheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-end-of-line strap for standard cell
- Patent number 12,261,113
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Hung Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,261,130
- Issue date Mar 25, 2025
- SK hynix Inc.
- Yeo Jin Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside signal routing
- Patent number 12,261,116
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a data storage system including the same
- Patent number 12,262,535
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Jongsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic flash memory (DFM) with multi-cells
- Patent number 12,262,533
- Issue date Mar 25, 2025
- Yangtze Memory Technologies Co., Ltd.
- Tao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional resistive random access memory structure
- Patent number 12,262,545
- Issue date Mar 25, 2025
- National Tsing Hua University
- Ya-Chin King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via patterning using metal as hard mask and via conductor
- Patent number 12,261,056
- Issue date Mar 25, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization stacks with self-aligned staggered metal lines
- Patent number 12,261,114
- Issue date Mar 25, 2025
- Intel Corporation
- Elijah V. Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices and related methods of forming a memory device
- Patent number 12,261,111
- Issue date Mar 25, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- G11 - INFORMATION STORAGE
Information Patent Grant
3D memory structure and method of forming the same
- Patent number 12,255,093
- Issue date Mar 18, 2025
- Macronix International Co., Ltd.
- Kuan-Yuan Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with thermal relaxation block and manufacturi...
- Patent number 12,255,196
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method of fabricating the same
- Patent number 12,256,543
- Issue date Mar 18, 2025
- Macronix International Co., Ltd.
- Jung-Chuan Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device, semiconductor device, and method of fabricating semi...
- Patent number 12,256,555
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Carlos H. Diaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 12,255,139
- Issue date Mar 18, 2025
- Samsung Electronics Co., Ltd.
- Anthony Dongick Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH THICKENING LAYER AND METHOD FOR FABRICATI...
- Publication number 20250118664
- Publication date Apr 10, 2025
- NANYA TECHNOLOGY CORPORATION
- CHUN-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250118669
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- EUI BOK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH MULTIPLE HBM STACKS
- Publication number 20250118719
- Publication date Apr 10, 2025
- ADVANCED MICRO DEVICES, INC.
- Brett P. WILKERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118594
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118596
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chih Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRACKING SCHEME CIRCUIT OF MEMORY DEVICE AND METHODS FOR OPERATING...
- Publication number 20250118361
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Ying Lee
- G11 - INFORMATION STORAGE
Information Patent Application
STACKED MULTI-GATE DEVICE WITH FRONT-AND-BACK INTERCONNECTION AND M...
- Publication number 20250118657
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Xiang You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20250118665
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Shih CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250118668
- Publication date Apr 10, 2025
- SK HYNIX INC.
- Yun Cheol HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250118670
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Jun Sung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING STAIRWAY STRUCTURES
- Publication number 20250120079
- Publication date Apr 10, 2025
- SK HYNIX INC.
- Jin Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDE STACKED TRANSISTOR
- Publication number 20250118630
- Publication date Apr 10, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250118671
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Su Hyun Bark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250120075
- Publication date Apr 10, 2025
- SK HYNIX INC.
- Nam Jae LEE
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250118656
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- HWEI-JAY CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250118666
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- TZU PEI CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THICKENING LAYER AND METHOD FOR FABRICATI...
- Publication number 20250118667
- Publication date Apr 10, 2025
- NANYA TECHNOLOGY CORPORATION
- CHUN-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC ASSEMBLIES WITH METAL PASSIVATION AT BOND INTERFACES
- Publication number 20250112127
- Publication date Apr 3, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND ME...
- Publication number 20250112159
- Publication date Apr 3, 2025
- NANYA TECHNOLOGY CORPORATION
- Jhen-Yu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND...
- Publication number 20250112169
- Publication date Apr 3, 2025
- NANYA TECHNOLOGY CORPORATION
- FENG-WEN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250112180
- Publication date Apr 3, 2025
- AOI ELECTRONICS CO., LTD.
- Shinji WAKISAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250113597
- Publication date Apr 3, 2025
- Samsung Electronics Co., Ltd.
- Sung Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250113495
- Publication date Apr 3, 2025
- United Microelectronics Corp.
- Wen-Jen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL COATINGS WITH SPATIALLY DEFINED SURFACE ENERGIES FOR DIE-...
- Publication number 20250112155
- Publication date Apr 3, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER GATING
- Publication number 20250112122
- Publication date Apr 3, 2025
- Intel Corporation
- Kevin P. O'Brien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE WITH THICK CONDUCTIVE STAIRCASED STEPS FOR 3...
- Publication number 20250112151
- Publication date Apr 3, 2025
- Micron Technology, Inc.
- Si-Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND ME...
- Publication number 20250112158
- Publication date Apr 3, 2025
- NANYA TECHNOLOGY CORPORATION
- Jhen-Yu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME
- Publication number 20250112149
- Publication date Apr 3, 2025
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- SHU HUI LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIRTUAL GROUND NET FOR PROCESS-INDUCED DAMAGE PREVENTION
- Publication number 20250112153
- Publication date Apr 3, 2025
- Intel Corporation
- Inanc Meric
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND...
- Publication number 20250112171
- Publication date Apr 3, 2025
- NANYA TECHNOLOGY CORPORATION
- FENG-WEN HSU
- H01 - BASIC ELECTRIC ELEMENTS

Cross-sectional geometry

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor memory device

Memory cell with top electrode via

Semiconductor structure having an anchor-shaped backside via

Memory device

Three-dimensional semiconductor memory device and electronic system...

Semiconductor device and manufacturing method thereof

Three-dimensional memory devices and fabricating methods thereof

Semiconductor device and manufacturing method thereof

Memory device and method of fabricating the same

Three-dimensional NAND memory and fabrication method thereof

Enlarging contact area and process window for a contact via

Integrated chip with an etch-stop layer forming a cavity

Top-interconnection metal lines for a memory array device and metho...

Top via interconnects with line wiggling prevention

Bottom barrier free interconnects without voids

Metal-insulator-metal device capacitance enhancement

Middle-end-of-line strap for standard cell

Semiconductor device

Backside signal routing

Semiconductor device and a data storage system including the same

Dynamic flash memory (DFM) with multi-cells

Three-dimensional resistive random access memory structure

Top via patterning using metal as hard mask and via conductor

Metallization stacks with self-aligned staggered metal lines

Memory devices and related methods of forming a memory device

3D memory structure and method of forming the same

Semiconductor package with thermal relaxation block and manufacturi...

Memory device and method of fabricating the same

Memory device, semiconductor device, and method of fabricating semi...

Semiconductor devices

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH THICKENING LAYER AND METHOD FOR FABRICATI...

SEMICONDUCTOR DEVICES

CHIP PACKAGE WITH MULTIPLE HBM STACKS

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

TRACKING SCHEME CIRCUIT OF MEMORY DEVICE AND METHODS FOR OPERATING...

STACKED MULTI-GATE DEVICE WITH FRONT-AND-BACK INTERCONNECTION AND M...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL MEMORY DEVICE HAVING STAIRWAY STRUCTURES

DUAL SIDE STACKED TRANSISTOR

SEMICONDUCTOR DEVICE

MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH THICKENING LAYER AND METHOD FOR FABRICATI...

IC ASSEMBLIES WITH METAL PASSIVATION AT BOND INTERFACES

CONTACT STRUCTURE, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND ME...

SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CONFORMAL COATINGS WITH SPATIALLY DEFINED SURFACE ENERGIES FOR DIE-...

BACKSIDE POWER GATING

MICROELECTRONIC DEVICE WITH THICK CONDUCTIVE STAIRCASED STEPS FOR 3...

CONTACT STRUCTURE, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND ME...

SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME

VIRTUAL GROUND NET FOR PROCESS-INDUCED DAMAGE PREVENTION

SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND...