Information
-
Patent Grant
-
6753922
-
Patent Number
6,753,922
-
Date Filed
Tuesday, October 13, 199825 years ago
-
Date Issued
Tuesday, June 22, 200420 years ago
-
Inventors
-
Original Assignees
-
Examiners
- Garber; Wendy R.
- Wilson; Jacqueline
Agents
- Blakely, Sokoloff, Taylor & Zafman LLP
-
CPC
-
US Classifications
Field of Search
US
- 348 374
- 348 340
- 348 297
- 257 783
- 257 782
- 257 784
- 257 778
- 257 668
- 438 108
- 438 118
- 438 119
- 174 259
- 174 260
-
International Classifications
-
Abstract
An imaging system includes an image sensor that is attached to a circuit board via a mass reflow process. The image sensor captures image data and provides the image data at an output of the imaging system. In one embodiment, the image sensor uses a color filter array (CFA) material that is substantially stable through the mass reflow process.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
The described invention relates to the field of integrated circuit packages. In particular, the invention relates to an integrated circuit package capable of being mounted to a circuit board via a mass reflow process.
2. Description of Related Art
A windowed integrated circuit package is used for various applications in which an integrated circuit is illuminated or irradiated by light or other radiation sources located outside the integrated circuit package. An image sensor is one use of a windowed integrated circuit package.
For example, a photodiode array may be placed within a windowed integrated circuit package. The photo-detector array provides an image data output based upon the light incident on the photo-detector array. The photo-detector array may be used for capturing images or for other image reproduction applications. A color filter array (CFA) material is used with the photo-detector to filter the light impinging on the image sensor to allow for the formation of full color images. Each filter allows a predetermined color of light to reach a corresponding photo-detector, thus determining what color light will be sensed by the photo-detector. By grouping sets of light sensors together, the intensity and color of light reaching an area can be determined.
Integrated circuit (IC) packages are mounted on circuit boards by various techniques including mass reflow and manual and hot bar soldering of the package to the circuit board. Manual soldering and hot bar soldering, however, are relatively slow and expensive processes.
Mass reflow board mounting is a faster, automated process. Mass reflow refers to one of several different techniques that raise the temperature of the IC package to approximately 215 to 225 degrees C. At these elevated temperatures, solder residing on pads of the integrated circuit board melts and adheres to leads on the IC package. After the solder cools, the IC package remains firmly coupled to the solder pads. Mass reflow includes infrared, convection, and vapor phase techniques.
Non-ceramic packages such as windowed plastic packages are more desirable than ceramic packages because they are of lower cost than corresponding ceramic windowed packages. However, available windowed plastic packages do not meet the thermal requirements for mass reflow board mounting. These windowed plastic packages are mounted to circuit boards using techniques such as manual soldering that keep the package bulk from reaching the elevated temperatures of the mass reflow process.
Standard windowed plastic packages tested on the mass reflow process exhibit problems such as cracked lids, lid-sealant separation due to thermal expansion mismatch between the plastic and glass window, and delamination of the die from the die attach.
Another problem with using mass reflow on image sensors is that the CFA material is not stable at high temperatures. For example, CFA material made with molecular dyes are often used in image sensors. Dyed CFA material, such as dyed polyimide, may become yellow-tinged when exposed to the high temperatures of mass reflow. This impacts the color performance of the image sensor.
SUMMARY OF THE INVENTION
An imaging system includes an image sensor that is attached to a circuit board via a mass reflow process. The image sensor captures image data and provides the image data at an output of the imaging system. In one embodiment, the image sensor uses a color filter array (CFA) material that is substantially stable through the mass reflow process.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1
shows a cross sectional block diagram of the windowed QFP package
10
as modified by the Applicants.
FIG. 2
shows a schematic of one embodiment of the package lid, including the ceramic frame and glass window.
FIG. 3
shows a schematic of one embodiment of the entire IC package.
FIG. 4
shows one embodiment of the process taken in attaching a die into a windowed non-ceramic package.
FIG. 5
shows one embodiment of the color filter process.
FIG. 6
shows an imaging system comprising an image sensor attached to a circuit board via a mass reflow process.
DETAILED DESCRIPTION
An image sensor capable of being mounted via a mass reflow process is disclosed. Applicants have found that modifying a windowed plastic QFP package available through Kyocera Corporation based in Kyoto, Japan allows the plastic package to withstand the mass reflow process without the lid separating from the mold package or the die delaminating from the mold package. Additionally, using a CFA material with high temperature stability allows the image sensor to maintain its color performance despite being exposed to a mass reflow process.
The Package
The following section describes one embodiment of a package used to house the image sensor. The package is also described in co-pending U.S. patent application, Ser. No. 09/172,710 entitled “Mass Reflowable Windowed Non-Ceramic Package,” assigned to Intel Corporation and Kyocera Corporation. This plastic package is preferred due to lower cost. However, the mass reflow process may also be applied to a windowed package made of ceramic instead of plastic.
Windowed plastic packages may be used to house an image sensor. In one embodiment, an image sensor die has dimensions larger than 240 mils by 240 mils. A direct glass-to-plastic seal is not achieved for the package housing such a large die. Instead, a ceramic frame is employed to allow a ceramic-to-plastic coupling and a ceramic-to-glass coupling, as will be described.
FIG. 1
shows a cross sectional block diagram of a windowed QFP package
10
that is mass reflowable. A non-ceramic mold package
12
makes up the package body. In one embodiment, the non-ceramic mold package is made with a low-moisture plastic, such as a low-moisture mold compound of ortho-cresol-novolac developed by Kyocera Corporation. In one embodiment, depressions
22
indicate where ejector pins were used to remove the mold package after being formed. Appendix 1 includes an example of the material characteristics of a low-moisture mold compound of Kyocera Corporation.
Die attach
14
is used to hold the die
16
in place. In one embodiment, the die attach
14
is a low rigidity epoxy such as a silver-filled epoxy manufactured by Ablestik Electronic Materials and Adhesives, based in Rancho Dominguez, Calif.
Wire bonds
18
attach the die
16
to a lead frame
20
. The die attach
14
is selected to withstand the elevated temperatures of the mass reflow process. Delamination of the die
16
from the die attach
14
or mold package
12
may be a problem during mass reflow. Applicants have determined that a two step cure process for the die attach, as will be discussed with respect to
FIG. 3
, solves this problem.
A lid
30
seals the mold package. In one embodiment, the lid
30
comprises a ceramic frame
32
made of alumina. The ceramic frame
32
holds a transparent window. In one embodiment, the ceramic frame
32
includes a recessed ledge within which a glass window
34
resides. In one embodiment, the mold package
12
and the ceramic frame
32
are sealed using a bis-phenol A type epoxy. The epoxy seal may also be used to seal the ceramic frame
32
to the glass window
34
. Appendix 2 summarizes the characteristics of a bis-phenol A-type sealant that is suitable for use with the present invention.
The modified windowed package is particularly suited for, but not limited to, Complementary Metal Oxide Semiconductor (CMOS) image sensors because their die size can exceed 240 mils by 240 mils. An embodiment of the package suitable for an image sensor includes a window having a slightly larger area than that of the light-sensitive portion of the die.
In one embodiment, the window is approximately 1.2 times the area of the light-sensitive portion of the die. The window size, however, varies depending on its distance away from the die.
FIGS. 2 and 3
shows schematic diagrams of one embodiment of the lid and mold package.
FIG. 2
shows a schematic of one embodiment of the package lid
30
, including the ceramic frame
32
and glass window
34
. In one embodiment, a glass window
34
is seated into a recessed ledge
40
in the ceramic frame
32
.
FIG. 3
shows a schematic of one embodiment of the entire IC package
50
in accordance with present invention. Although the embodiment shown includes a particular type of lead frame (quad flat pack—QFP), other types of lead frames may be employed. Moreover, other packages may be used, including leadless packages such as micro ball grid array (micro BGA), leadless chip carrier (LCC), dual in-line package (DIP), and so forth.
FIG. 4
shows the process steps taken in one embodiment of a method for attaching a die into a windowed non-ceramic package. At step
202
, die attach is dispensed on the mold package. In one embodiment, the die attach is comprised of a low rigidity epoxy such as a silver-filled epoxy, as previously stated.
The process continues at block
204
, at which the die is scrubbed, or moved back and forth while pressure is applied to firmly attach the die to the die attach. Good adhesion of the die to a smooth surface of the mold package is achieved without plating the back-side of the die with gold.
The die attach is cured at block
206
. It is important to eliminate voids in the die attach, which may cause delamination problems. It has been found that a two stage cure process works better than a one stage cure process for eliminating voids in the die attach. In one embodiment, the die attach is baked at approximately 100 degrees C. for approximately one hour, then the die attach is baked at approximately 150 degrees C. for approximately another hour.
At block
208
, wire bonds are attached between the die and the lead frame of the mold package.
At block
212
, the lid is attached to the mold package. In one embodiment, the lid comprises the glass window
34
attached to the ceramic frame
32
with a bis-phenol A type epoxy. The epoxy is cured by baking. In one embodiment, the curing is performed by raising the temperature to approximately 150 degrees C. for approximately 70 minutes. In one embodiment, the lid is attached to the mold package using the same epoxy that was used to attach the glass window
34
to the ceramic frame
32
, and the epoxy is cured by also raising the temperature to approximately 150 degrees C. for approximately 70 minutes.
In one embodiment, the above steps are performed using laminar flow hoods in a clean room that meets level class sub
100
, in which there is less than 100 particles of contamination of one micron or less per cubit meter. This helps to prevent particle contamination of the die during assembly.
In one embodiment, the window has a scratch-dig specification of 20 microns. The scratch-dig specification denotes the largest allowable defect in the glass. A larger defect may interfere with the imaging performance of the image sensor.
In order to reduce moisture in the sealed package prior to performing the mass reflow process, an extended bake cycle is used just prior to bag. In one embodiment, the sealed package is baked at 125 degrees C. for 48 hours, then it is vacuum sealed in a moisture barrier bag for storage or shipment. This allows the sealed package to meet the Institute for Interconnecting and Packaging Electronic Circuits (IPC) level 4 surface mount requirements. (The IPC is a trade association representing over 2300 companies in the electronic interconnection industry worldwide.)
When the sealed package is ready to be mounted, it is removed from the bag and mounted to a circuit board using a mass reflow process, as shown at block
214
. There are various types of mass reflow processes. In one embodiment, an IR/convection mass reflow process is employed that conforms to the following:
1) peak package body temperature of approximately 225 degrees C.;
2) time above 215 degrees C. is approximately 30 seconds;
3) time above 183 degrees C. is approximately 140 seconds.
The windowed non-ceramic package is able to withstand the above mass reflow process without the lid separating from the mold package or die detaching from the mold package.
The Die and CFA Material
In one embodiment, a pigmented color filter array (CFA) material is deposited on top of each photo-detector. Typically, one of the colors red, green or blue is deposited in a mosaic pattern. Pigments are chosen as the colorants over molecular dyes because of their superior light, heat, and chemical stability. Table 1 shows an example of the composition of the pigments used by Applicants. Applicant has found the CFA material to be extremely stable over various temperatures. This CFA material has previously been used in liquid crystal display (LCD) technology but has not been used as a color filter in image capture.
FIG. 5
shows one embodiment of the color filter process. The flowchart starts at block
300
, and continues with block
310
, at which the pigmented CFA material is deposited via a spin coat process. In one embodiment, the spin coating is applied at 4000 RPM for approximately 30 seconds. At block
312
, the CFA is put through a soft bake phase in which the part is baked for about one minute at approximately 90 degrees C. At block
314
, the CFA is exposed. In one embodiment, a mercury lamp of 500 W (I-line) is used.
A post exposure bake of about three minutes at approximately 180 degrees C. is performed at block
316
. At block
318
, the CFA is developed. In one embodiment, the developing is performed at about 27 degrees C. for approximately one minute to achieve a critical dimension of 20%. The part is then rinsed at block
320
, then cured at block
322
. Curing is performed for approximately 3 minutes at approximately 180 degrees C.
In one embodiment, a solvent of approximately 76 wt % of propylene glycol monomethyl ether acetate (PGMEA) and approximately 5 wt % of cyclohexanone is used to disperse the CFA material in the spin coating step (block
310
), and a developer of between approximately 0.13 wt % and 0.14 wt % tetramethyl ammonium hydroxide is used in the developer step (block
318
).
The flowchart steps are repeated for each of the different pigmented CFA materials. For example, in one embodiment, the flowchart steps are performed to apply a red, green then blue pigmented CFA material. However, various orders of applying the different colors of CFA materials may be used. Additionally, other color pigments may be used.
In one embodiment, the CFA material is deemed stable after the mass reflow process, if its color characteristics remain within a range that allows the image sensor to provide an image output of acceptable quality to a human observer. For example, a) the color characteristics of the image sensor may shift slightly during mass reflow, but the shift in image output is still less than human perception, or b) the color characteristics of the image sensor shift during mass reflow, but the shift in image output can be compensated to provide an image that is acceptable to a human observer.
One way in which the CFA stability can be measured quantitatively is by determining a color difference ΔEL
a*b*
. In one embodiment, a pass/fail threshold is based on ΔEL
a*b*
. For example, the CFA material can be considered to be substantially stable only if its color difference changes by less than a ΔEL
a*b*
of 5 from being exposed to the mass reflow process. Of course, other values of ΔEL
a*b*
can be implemented as the pass/fail threshold.
In one embodiment, the average color for each of the channels red, green, and blue is measured by the image sensor before and after the mass reflow process. The color difference ΔEL
a*b*
is determined, as is well-known. For example, color difference ΔEL
a*b*
is described in Color Science: Concepts and Methods, Quantitative Data and Formulae, 2
nd
edition, Gunter Wyszecki, W. S. Stiles (John Wiley & Sons, 1982).
The CFA material also may be used to provide a scratch protection layer as described in co-pending U.S. patent application Ser. No. 08/986,501, entitled “Passivation Protection On Sensor Devices During Electronic Assembly,” assigned to the common corporate assignee. In one embodiment, a red pigment layer and a green pigment layer of CFA material having a thickness of approximately 600 microns is applied to the perimeter of a die to provide scratch protection of the underlying circuitry while handling the die.
Imaging System
FIG. 6
shows an imaging system
400
comprising an image sensor attached to a circuit board via a mass reflow process. The image sensor
410
is employed as part of a camera, silicon eye, or other image device. Typically, the image sensor is electrically coupled to an image processor
420
and a memory
430
. The imaging system may also include interconnect circuitry
440
for communicating with other systems, such as a host computer system or other output device. The imaging system may also include a lens system (not shown) to focus the light on the image sensor, as is well-known in the art.
The ability to attach the image sensor via the mass reflow process reduces costs and speeds up the manufacturing process. It also may provide a more reliable connection then manual soldering methods.
Thus, an image sensor capable of being mounted to a circuit board via a mass reflow process is disclosed. The specific arrangements and methods described herein are merely illustrative of the principles of this invention. Numerous modifications in form and detail may be made without departing from the scope of the described invention. Although this invention has been shown in relation to a particular embodiment, it should not be considered so limited. Rather, the described invention is limited only by the scope of the appended claims.
TABLE 1
|
|
Composition of Pigment-dispersed Photopolymers
|
Composition
|
|
Monomer
Polyfunction Acrylates
|
|
|
Binder
Acrylic acid/Acrylate Copolymers
|
|
|
Initiator
Ditrihalomethyl-s-triazines
|
|
|
Pigment
Red: Diantraquinones
|
(main)
Green: Halo-Cu-phthalocyanines
|
Blue: Cu-phthalocyanines
|
Black: Carbon
|
Pigment
YellowA: Isoindolins
|
(color
YellowB: Diazo compounds
|
matching)
Violet: Dioxazines
|
Solvent
Cellusolves
|
|
APPENDIX 1
|
|
MATERIAL CHARACTERISTICS
|
(GENERAL PROPERTIES OF EO1B)
|
PROPERTY
NOMINAL VALUE
|
|
THERMAL CONDUCTIVITY
0.8 w/m · k
|
[ROOM TEMP.]
|
THERMAL EXPANSION (α1)
150 × 10−7/° C.,
|
490 × 10−7/° C.
|
BENDING STRENGTH
0.14 GPa
|
BENDING ELASTICITY
18 GPa
|
GLASS TRANSITION TEMPERATURE (Tg)
163° C.
|
VOLUME RESISTIVITY [ROOM TEMP.]
2 × 10
15
Ω · cm
|
DIELECTRIC CONSTANT [1 MHz]
3.8
|
[ROOM TEMP.]
|
α COUNT EMISSION (DPH)
0.06 COUNTS/cm2 Hr
|
|
APPENDIX 2
|
|
No KSD-248-0108-1
|
TECHNICAL SHEET
KYOCERA CORPORATION
|
SEMICONDUCTOR PARTS DIVISION4
|
SEALANT DIVISION
|
SEALANT
NCO-150H
|
|
1 Physical Property
|
Item
Unit
Data
|
|
Color
Translucence
|
Specific Gravity
1.7
|
* Shear Strength
MPa
26.48
|
Coefficient of Thermal Expansion
1/° C. × 10
−5
7
|
Glass Transition Point
° C.
160
|
Water Absorption
%
—
|
Dielectric Constant
ε (1 MHz)
6
|
Loss Factor
tan δ (1 MHz)
0.03
|
Thermal Conductivity
W/m · K
—
|
Surface Resistivity
Ω
1.0 × 10
14
|
|
Note
|
* Curing Sample: Ceramic/Ceramic
|
2 Reliability (Judgment: MIL-STD 883D 1014)
|
MIL-STD
NG:
|
Test Item
883D
Condition
N = 100
|
|
Temperature
1010-COND C
−85° C. ˜ 150° C.
0/100
|
Cycle
40 Cycles
|
Thermal Shock
1011-COND A
0° C. ˜ 100° C.
0/100
|
40 Cycles
|
Impact Resistance
2002-COND B
1500 G, 0.5 M,
0/100
|
5 Times
|
High Temp Storage
1008-COND C
160° C./1000 H
0/100
|
Low Temp Storage
−85° C./1000 H
0/100
|
High Temp &
85° C., 85% RH,
0/100
|
Humidity
1000 H
|
Pressure Cooker
121° C., 0.21 MPa,
0/100
|
50 H
|
|
Note
|
Ceramic Curing (.709 inch SQ: Sealing Width .040 inch)
|
Claims
- 1. A method of attaching an image sensor to a circuit board, the method comprising:applying a color filter array (CFA) material to a die; bonding the die to a package; attaching the package to a circuit board via a mass reflow process.
- 2. The method of claim 1, wherein the applying comprises:applying a pigmented CFA material to the die.
- 3. The method of claim 1, wherein the attaching comprises:heating the package to over 200 degrees C.
- 4. The method of claim 1, wherein the attaching comprises:heating the package to approximately 215 degrees C.
- 5. The method of claim 1 further comprising:baking the package for an extended time prior to the attaching.
- 6. The method of claim 5, wherein the baking is performed at over 125 degrees C. for over 24 hours.
- 7. The method of claim 6, where in the baking allows the package to meet IPC level 4 surface mount requirements.
US Referenced Citations (20)