The present invention relates to an inductance component used in a power supply circuit of a cellular phone, for example.
Conventionally, the inductance component of this kind is configured as a chip coil in which coil 2 is formed in sheet-shaped element 1, terminal 3 is electrically connected to coil 2, and magnetic layers 4 are formed on upper and lower surfaces of element 1, as shown in
By providing insulating covering 20 so as to cover magnetic layer 4 and entire element 1, electric connection with other components is prevented.
As the conventional art document information regarding the present application, Patent Document 1 is known, for example.
However, such a conventional inductance component has a problem that reliability thereof is low.
That is to say, in the above-described conventional configuration, a stress is locally applied to the magnetic layer 4 by heat when implementing soldering or the like, from a difference in thermal expansion and contraction rate between element 1 and insulating body 5, and as a result, the reliability is low.
[Patent Document 1] Unexamined Japanese Patent Publication No. 2006-32587
An object of the present invention is to improve the reliability of the inductance component having the magnetic layer.
In order to achieve the object, the present invention includes an element, a coil formed in the element, and a terminal electrically connected to the coil, wherein a plurality of magnetic layers arranged substantially in parallel to a winding surface of the coil in the element are formed in the element, thereby constituting an inductance component.
Since the inductance component according to the present invention is configured to form the magnetic layer in the element, the entire magnetic layer is covered with a material of which thermal expansion and contraction rates are constant, so that a stress is not locally applied to the magnetic body even in the condition where heat is applied over the entire component, such as when implementing soldering or the like, thereby achieving the high reliability.
According to another aspect of the present invention, the inductance component is preferably provided with a plurality of magnetic layers, and a portion of the element is interposed between the plurality of magnetic layers. According to the aspect of the invention, it becomes possible to increase a saturation magnetic flux, and at the same time, even when the thermal expansion rate between the element and the magnetic layers, as well as between the magnetic layers, is different, the magnetic layers are not detached from the element, and high reliability is realized.
According to still another aspect of the present invention, the inductance component is preferably formed such that at least a portion of the terminal is formed of the magnetic body. With this configuration, it becomes possible to improve magnetic permeability without increasing an area of the inductance component itself, or to decrease an occupation area of the coil, and as a result, an inductance value may be improved.
According to yet another aspect of the present invention, the inductance component is preferably formed such that a slit is formed on the magnetic layer and the slit is filled with a portion of the element. With this configuration, a stress is not locally applied to the magnetic body even in the condition where heat is applied to the entire component, such as when implementing soldering, and high reliability can be realized.
According to yet another aspect of the present invention, the inductance component is preferably formed such that a plurality of substantially V-shaped slits, spreading from a bending portion thereof in an outer peripheral direction of the magnetic layer, are arranged in parallel on the magnetic layer. With this configuration, generation of an eddy current may be greatly prevented at an outer peripheral portion of the magnetic layer.
According to yet another aspect of the present invention, the inductance component is preferably formed such that a plurality of substantially V-shaped slits, spreading from a bending portion thereof in an outer peripheral direction of the magnetic layer, are arranged in parallel at least on an inner square portion of the magnetic layer, and a radial slit extending from a central direction to an outer peripheral direction of the magnetic layer are formed on an outer square portion of the magnetic layer. According to the aspect of the invention, it becomes possible to make a space between the slits on the inner square portion of the magnetic layer through which a magnetic flux passes the most may be made uniform, thereby greatly preventing the generation of the eddy current.
According to yet another aspect of the present invention, the inductance component is preferably formed such that a through-hole portion is provided on the element in an inner peripheral direction of the coil, a center core magnetic layer is provided within the through-hole portion, and an insulating wall substantially perpendicular to the winding surface of the coil is provided on the center core magnetic layer. With this configuration, it becomes possible to reduce the generation of the eddy current without lowering the magnetic permeability of the center core magnetic layer itself, so that the inductance value can be improved.
Hereinafter, an inductance component according to a first embodiment of the present invention is described with reference to
In
Here, magnetic layers 9A and 9B are arranged so as to be substantially parallel to a winding surface of coil 6. This is in order to arrange magnetic layers 9A and 9B having high magnetic permeability in the path of a magnetic flux generated from coil 6.
Here, although coil 6 may be of one layer, in the present embodiment, the coil 6 is composed of two layers of planar coils 6A and GB. Upper planar coil 6A is wound from terminal 7 in an inner peripheral direction so as to form a spiral, an innermost peripheral portion of this planar coil 6A and an innermost peripheral portion of lower planer coil 6B are connected by means of via 6D, and this planar coil 6B is wound in a direction toward terminal 8 (outer peripheral direction) so as to form a spiral, thereby forming coil 6.
Here, it is preferable that planar coils 6A and GB are wound in the same direction. This is in order to realize a large inductance value without causing the magnetic flux generated in planar coil 6A and the magnetic flux generated in planar coil 6B to negate each other.
Here, a thickness of each magnetic layer 9A and 9B is made less than twice the skin depth (skin effect thickness) in order to prevent generation of an eddy current.
Meanwhile, in order to improve an inductance value, outer core 11 formed of a magnetic body is provided on the outer side of coil 6 to thicken magnetic coupling between upper magnetic layer 9A and lower magnetic layer 9B.
In this manner, by configuring such that each of magnetic layers 9A and 9B is formed in element 5, that is, by configuring such that each of entire magnetic layers 9A and 9B is covered with element 5 of which thermal expansion and contraction rates are constant, stress is not locally applied to magnetic layers 9A and 9B, even in the situation where heat is applied to the entire component, such as when implementing soldering, so that high reliability can be obtained.
Additionally, by providing magnetic layers 9A and 9B, the inductance component of which the inductance value is high can be realized.
In the present embodiment, although it is configured such that one magnetic layer 9A and one magnetic layer 9B are arranged on the upper side and on the lower side of coil 6, respectively, by constituting with one or more layers, it is possible to improve a saturation magnetic flux density, and at the same time, it is possible to obtain a high inductance value. Also, the number of magnetic layers to be formed may be different on the upper and lower sides of coil 6. However, the inductance value lowers when there exists a portion through which the magnetic flux hardly flows on either of the upper and lower sides of coil 6, so that it is preferred that the same number of layers are arranged on the upper and lower sides of coil 6 when the magnetic layers of the same thickness are used, and that the layers are arranged such that a total thickness of the layers are the same on the upper and lower sides of coil 6 when the magnetic layers having different thicknesses are used.
Although a cross section of coil 6 may be a circle and not a square, the square is preferred because this allows a coil sectional area to be taken larger than that of the circle, and it is possible to reduce a copper loss.
It is preferred that the thickness of each planar coil 6A and 6B be not less than 10 μm to cope with a high current.
It is preferred to use a metal magnetic material containing Fe or Fe alloy as magnetic layers 9A and 9B, from the viewpoint of a magnetic flux density and a magnetic loss. When the Fe alloy is used for magnetic layers 9A and 9B, it is preferred that a composition ratio of Fe is not less than 30 percent by mass. This is because improvement of a magnetic characteristic of having a high saturation magnetic flux density and having a low coercivity may be realized by making a content of Fe contained in magnetic layers 9A and 9B not less than 30 percent by mass. Also, by making a content of nickel about 80%, high magnetic permeability is obtained, and it becomes possible to obtain a large inductance value.
As the Fe alloy used for magnetic layers 9A and 9B, the metal magnetic material containing either of FeNi, FeNiCo and FeCo is more preferable from the viewpoint of a high magnetic flux density and a low magnetic loss.
For fabricating magnetic layers 9A and 9B, an electroplating method may be used, for example.
At this time, a plating bath used in the electroplating process is prepared to contain an Fe ion or other metal ion.
Meanwhile, as additives in the plating bath, it is preferred to put a stress-relaxing agent, a pit preventative and a complexing agent. The stress-relaxing agent includes saccharin, for example. The saccharin is a substance containing sulfonate, so that this may exert its effect. By putting such a stress-relaxing agent, it becomes possible to form magnetic layers 9A and 9B having excellent uniformity in which a crack will hardly occur even when magnetic layers 9A and 9B are formed thick. For example, when the saccharin is used as the stress-relaxing agent, the effect thereof is produced by preparing the plating bath to contain 0.1 to 5 g/L of saccharin; however, a volume with which a stress-relaxing effect is exerted varies depending on a plating condition such as a current density, so that this is controllable by appropriately setting conditions.
By preparing the plating bath to contain, as the complexing agent, an organic molecule such as an amino acid, a monocarboxylic acid, a dicarboxylic acid and a tricarboxylic acid, and an inorganic molecule, for stabilizing a variety of metal ions, a complex stabilized with the metal ion may be formed.
Although an Fe-alloy film is formed by a general electrolytic plating method by using such a plating bath, by devising a method in which the plating is performed in a plating device in which a positive electrode is separated or in a magnetic field, it becomes possible to form the Fe-alloy film having excellent magnetic characteristics.
A cross sectional view of an example in which the magnetic layer is increased is shown in
A plurality of magnetic layers 9A, 9B, 9C and 9D are arranged so as to be substantially parallel to the winding surface of coil 6. This is in order to arrange magnetic layers 9A, 9B, 9C and 9D having high magnetic permeability in the path of the magnetic flux.
The thickness of each of magnetic layers 9A, 9B, 9C and 9D is made less than twice the skin depth, in order to prevent the generation of the eddy current.
In this manner, since it is configured such that each of the plurality of magnetic layers 9A, 9B, 9C and 9D is formed in element 5, that is, such that each of entire magnetic layers 9A, 9B, 9C and 9D is covered with element 5, even though the thermal expansion and contraction rates are different between magnetic layers 9A, 9B, 9C and 9D, or between element 5 and magnetic layers 9A, 9B, 9C and 9D, magnetic layers 9A, 9B, 9C and 9D are not detached from element 5, so that it is possible to obtain high reliability.
Further, by forming element 5 abutting on each magnetic layer 9A, 9B, 9C and 9D of a material of which thermal expansion and contraction rates are constant, the stress generated by a difference in the thermal expansion and contraction rates between magnetic layers 9A, 9B, 9C and 9D and element 5 is uniformly applied to each of entire magnetic layers 9A, 9B, 9C and 9D, so that deterioration in reliability by force locally applied between magnetic layers 9A, 9B, 9C and 9D and element 5 may be prevented.
Further, since it is configured such that a portion of element 5 is interposed between each of magnetic layers 9A, 9B, 9C and 9D, the eddy current in each of magnetic layers 9A, 9B, 9C and 9D may be prevented.
Further, since a plurality of magnetic layers 9A, 9B, 9C and 9D are provided, a saturation magnetic flux increases in proportion to the number of layers, and it becomes possible to realize an excellent DC current superimpose characteristic, and at the same time, realize a high inductance value.
Meanwhile, in the present embodiment, although it is configured such that two magnetic layers 9A and 9B are arranged on the upper side of coil 6 and two magnetic layers 9C and 9D are arranged on the lower side of coil 6, respectively, a higher magnetic flux saturation density and inductance value may be obtained by arranging two or more layers. Although the number of the magnetic layers to be arranged may be different between the upper and lower sides of coil 6, it is preferable that the same number of layers are arranged on the upper and lower sides of coil 6 when using the magnetic layers having the same thickness, and that the total thickness of the magnetic layers are the same on the upper and lower sides of coil 6 when using the magnetic layers having different thicknesses, since the inductance value deteriorates when there exists a portion through which the magnetic flux hardly flows on either of the upper and lower sides.
Next, an inductance component according to a second embodiment of the present invention is described with reference to the drawings.
In
Here, it is preferred that a metal magnetic material containing Fe or an Fe-alloy is used as a material of magnetic terminals 7A and 8A from the viewpoint of the magnetic flux density and the magnetic loss. In a case where the Fe-alloy is used as magnetic terminals 7A and 8A, it is preferred to make the composition ratio of Fe not less than 30 percent by mass. This is because the magnetic characteristic of high saturation magnetic flux density as well as low coercivity may be realized by making Fe content in magnetic terminals 7A and 8A not less than 30 percent by mass. By making a content of nickel about 80%, a high magnetic permeability may be obtained, and a large inductance value may thus be obtained, which is preferable.
As the Fe-alloy used for magnetic terminals 7A and 8A, it is more preferable that the metal magnetic material containing either of FeNi, FeNiCo and FeCo is used, from the view of the high magnetic flux density and the low magnetic loss.
For fabricating these magnetic terminals 7A and 8A, an electroplating method may be used, for example.
Here, although coil 6 may be of one layer, in the second embodiment, coil 6 is composed of two layers of planar coils 6A and 6B. Upper planar coil 6A is wound from terminal 7 in the inner peripheral direction so as to form a spiral, the innermost portion of this planar coil 6A and the innermost portion of lower planar coil 6B are connected by means of via 6D, and this planar coil 6B is wound in the direction toward terminal 8 (outer peripheral direction) so as to make a spiral, thereby forming coil 6.
In this manner, since at least portions of terminals 7 and 8 are formed of magnetic terminals 7A and 8A, the magnetic permeability thereof may be improved, and as a result, the inductance value may be improved.
Further, since magnetic terminals 7A and 8A are provided within areas originally occupied by terminals 7 and 8, it is not necessary to increase the area of the inductance component itself, or to decrease the occupying area of coil 6.
Meanwhile, by forming magnetic center core 10 made of a magnetic body on an inner portion of coil 6 in element 5, a higher inductance value may be obtained.
Herein, magnetic center core 10 is formed at least of a mixture of magnetic powder and a resin. As the magnetic powder, ferrite powder or metal magnetic powder mainly containing Fe, Ni or Co may be used.
Meanwhile, although it is possible to form magnetic center core 10 using the metal magnetic body and an oxide magnetic body, when forming the same of the mixture of the magnetic powder and the resin, a resistance value within magnetic center core 10 can be increased, and the generation of the eddy current can be prevented, which is preferable.
Specifically, although the magnetic power having soft magnetic properties, such as MnZn ferrite powder, NiZn ferrite powder, MgZn ferrite powder, hexagonal ferrite powder, garnet-type ferrite powder, Fe powder, Fe—Si-based alloy powder, Fe—Si—Al-based alloy powder, Fe—Ni-based alloy powder, Fe—Co-based alloy powder, Fe—Mo—Ni-based alloy powder, Fe—Cr—Si-based alloy powder, and Fe—Si—B-based alloy powder, may be used, it is more preferable to use particularly a magnetic powder of which saturation magnetic flux density is high, such as Fe—Ni-based alloy powder, Fe—Co-based alloy powder and Fe—Mo—Ni-based alloy powder.
In a case in which the metal magnetic powder is used as the magnetic powder, a particle diameter thereof is preferably not less than 0.5 μm and not more than 100 μm, and more preferably not less than 2 μm and not more than 30 μm. When the particle diameter is too large, an eddy-current loss becomes too large at higher frequencies, on the other hand, when the particle diameter is too small, required amount of resin becomes large and the magnetic permeability deteriorates.
Although the resin having a binding property may be used as the resin to form magnetic center core 10, it is preferable that a thermosetting resin such as an epoxy resin, a phenol resin, a silicon resin, a polyimide resin or the like, from the viewpoint of strength after binding and heat resistance when using. In order to improve dispersibility with the magnetic body powder and resin performance, a minute amount of dispersant and plasticizer or the like may be added. Further, in order to adjust viscosity of the paste before hardening, or in order to improve an insulation property when using the metal magnetic powder, it is preferred to add a third component. Such a third component includes a silane coupling agent, a titanium coupling agent, a titanium alkoxide, water, glass, boron nitride, talc, mica, barium sulfate, tetrafluoroethylene, and the like.
Hereinafter, an inductance component according to a third embodiment of the present invention is described with reference to the drawings.
In
Magnetic layers 30A and 30B, and 30C and 30D are formed on upper and lower sides of coil 27 in element 26, respectively.
Portions of terminals 28 and 29 are formed of magnetic terminals 28A and 29A formed of a magnetic body.
Further, in the present embodiment, magnetic terminals 28A and 29A in terminals 28 and 29 are formed also on the upper and lower surfaces of element 26.
On an inner portion of coil 27 in element 26, magnetic center core 31 formed of a magnetic body is formed.
In this manner, since at least portions of terminals 28 and 29 are formed of magnetic terminals 28A and 29A, the magnetic permeability thereof can be improved, and as a result, the inductance value may be improved.
By arranging magnetic terminals 28A and 29A and magnetic layers 30A and 30B, and 30C and 30D on the upper and lower sides of coil 27, respectively, most of a pathway through which the magnetic flux emitted from magnetic center core 31 enters magnetic center core 31 again may be composed only of a material having high magnetic permeability, so that the inductance value may be further improved.
Further, since magnetic layers 28A and 29A are provided within an area originally occupied by terminals 28 and 29, it is not necessary to increase the area of the inductance component itself, or to reduce an occupying area of coil 27.
Further, by forming a magnetic outer core (not shown) formed of a magnetic body on an outer portion of coil 27 in element 26, a higher inductance value may be obtained.
Slits 12A and 12B are formed on magnetic layers 9A and 9B as shown in
Here, it is preferred that magnetic layers 9A and 9B are arranged so as to be substantially parallel to the winding surface of coil 6. This is in order to arrange magnetic layers 9A and 9B having high magnetic permeability in the path of the magnetic flux generated from coil 6.
In this manner, since it is configured such that each of magnetic layers 9A and 9B is formed in element 6 and slits 12A and 12B provided on magnetic layers 9A and 9B are filled with a portion of element 5, each of entire magnetic layers 9A and 9B may be covered with element 5 of which thermal expansion and contraction rates are constant, so that the stress is not locally applied to magnetic layers 9A and 9B even in the condition where heat is applied to the entire component, such as when implementing soldering, and it becomes possible to obtain the high reliability.
By providing slits 12A and 12B, it becomes possible to prevent the generation of the eddy current in magnetic layers 9A and 9B.
A form of slits 12A and 12B includes a cross shape as shown in
Further, by providing slits 12A and 12B and by filling slits 12A and 12B with a portion of element 5, a contact area between magnetic layers 9A and 9B and element 5 may be increased, thereby making adhesiveness thereof higher.
By configuring such that planar coils GA and 6B are wound on the same surface, a short inductance component can be realized.
Meanwhile, in the present embodiment, although one magnetic layer 9A and one magnetic layer 9A are arranged on the upper and lower sides of coil 6, respectively, a higher inductance value may be obtained by arranging one or more layers.
In a fifth embodiment, the embodiment of an inductance component provided with a slit form effective to prevent the eddy current in the magnetic layer is shown.
On magnetic layers 9A and 9B, a plurality of substantially V-shaped slits 12A, spreading from a bent portion thereof in an outer peripheral direction of magnetic layers 9A and 9B, are formed in parallel to one another, as shown in
A space between substantially V-shaped slits 12A as shown in
In this manner, since it is configured such that the plurality of substantially V-shaped slits 12A, spreading from the bending portion thereof in the outer peripheral direction of magnetic layers 9A and 9B, are formed in parallel to one another on magnetic layers 9A and 9B, as shown in
Further, by configuring such that substantially V-shaped slits 12A spreads from the bending portion in the outer peripheral direction thereof, divergence of the magnetic flux, which is generated from the central portion of coil 6, from the bending portion in the outer peripheral direction through magnetic layers 9A and 9B is hardly prevented by the existence of slits 12A shown in
Further, by a configuration as shown in
Further, by configuring as shown in
Meanwhile, the form and the arrangement of the slits in magnetic layers 9A and 9B is preferably the same. This is because, if there is a portion through which the magnetic flux hardly passes, the inductance value is limited by the portion.
Although it is possible to configure such that magnetic layers 9A and 9B are formed not in element 5 but on the upper or lower surface thereof, it is possible to configure such that an entirety of each magnetic layer 9A and 9B is covered with element 5 of which thermal expansion and contraction rates are constant, by forming magnetic layers 9A and 9B in element 5 and by filling slits 12A and 12B provided on these magnetic layers 9A and 9B with a portion of element 5. With this configuration, the stress is not locally applied to magnetic layers 9A and 9B even in the condition where heat is applied to the entire coil component, such as when implementing soldering, thereby obtaining the high reliability.
Further, by providing slits 12A and 12B and by filling slits 12A and 12B with a portion of element 5, a contact area between magnetic layers 9A and 9B and element 5 increases, thereby increasing adhesiveness therebetween.
It is preferred, in
In a sixth embodiment, an inductance component provided with a slit form, which is effective to further prevent the eddy current in the magnetic layer, is shown.
As shown in
Here, in a case where outer core 11 made of a magnetic material is formed in the outer peripheral direction of coil 6 in element 5, it is preferable that one end of substantially V-shaped slit 12A is formed so as to face and extend up to outer core 11. This is in order not to prevent the magnetic flux generated from the central portion of coil 6 from flowing from inner square portion 13A to outer core 11 of magnetic layer 9 by substantially V-shaped slits 12A. As a result, the high inductance value may be obtained.
Radial slit 12B is formed so as to extend from the central portion in the outer peripheral direction of magnetic layer 9 on outer square portion 13B of magnetic layer 9.
Here, the term “inner square portion 13A in magnetic layer 9” refers to a region on which the magnetic flux especially concentrates, and which includes at least an inner portion of the innermost periphery of coil 6. The term “outer square portion 13B in magnetic layer 9” refers to an outer portion of the inner square portion.
Here, it is preferable that one end of substantially V-shaped slit 12A and one end of radial slit 12B are connected in a boundary portion of inner square portion 13A and outer square potion 13B. By configuring such that the magnetic flux flowing between substantially V-shaped slits 12A directly flows between radial slits 12B, it becomes possible to reduce the interruption of the magnetic flux flow by radial slits 12B, and the inductance value may be improved as a result.
Although a plurality of substantially V-shaped slits 12A, which spread from bending portion 12AA in the outer peripheral direction of magnetic layer 9, may be formed over entire magnetic layer 9 so as to be parallel to one another, since the volume of the magnetic flux flowing per unit area is smaller in magnetic layer outer square portion 13B, a need to consider the eddy current is less than that in inner square portion 13A. Therefore, it is preferred that radial slit 12B is formed so as to extend from the central direction to the outer peripheral direction of magnetic layer 9, instead of substantially V-shaped slits 12A, on outer square portion 13B. This is because the inductance value may be improved without preventing the magnetic flux flow, by daringly to sparsely arrange the space between the slits on outer square portion 13B of magnetic layer 9.
In this manner, since it is configured such that a plurality of substantially V-shaped slits 12A, spreading from bending portion 12AA in the outer peripheral direction of magnetic layer 9, are formed in parallel to one another as shown in
Further, by configuring such that substantially V-shaped slits 12A are formed so as to spread from bending portion 12AA in the outer peripheral direction, divergence of the magnetic flux, generated from the central portion of coil 6, from bending portion 12AA in the outer peripheral direction through magnetic layer 9 shown in
Meanwhile, it is preferred that the space between substantially V-shaped slits 12A shown in
Meanwhile, although it is possible to configure such that magnetic layer 9 is formed not in element 5 but on the upper or lower surface thereof, by configuring such that magnetic layer 9 is formed in element 5 and that slit 12 provided on magnetic layer 9 is filled with a portion of element 5, it becomes possible to configure such that the entirety of each magnetic layer 9 is covered with element 5 of which thermal expansion and contraction rates are constant, so that even in the condition where heat is applied on the entire coil component, such as when implementing soldering, the stress is not applied locally to magnetic layer 9, and it becomes possible to obtain the high reliability.
Further, by configuring such that slit 12 is filled with a portion of element 5, the contact area between the magnetic layer 9 and element 5 increases, thereby increasing the adhesiveness therebetween.
Meanwhile, it is preferred that bending portion 12AA of the plurality of substantially V-shaped slits 12A is formed at the position corresponding to the central portion of coil 6 in magnetic layer 9, in
In a seventh embodiment, an embodiment (chip coil) obtained by improving an inductance component having a center core is described with reference to
In
Between center core magnetic layers 16, a plurality of insulating walls 15 are provided so as to be substantially perpendicular to the winding surface of coil 6. As for an arrangement of walls 15, they are arranged so as to be parallel to one another, when seen from a direction perpendicular to the winding surface of coil 6, as shown in
By such a configuration, the generation of the eddy current may be efficiently reduced by insulating walls 15, which are substantially perpendicular to the winding surface of coil 6 (that is to say, substantially perpendicular to a surface on which the eddy current generates), and it is not necessary to lower the magnetic permeability of center core magnetic layer 16 itself by adding a material having low magnetic permeability, such as an oxide, so that a preventing effect on circulation of magnetic flux 17 passing through through-hole portion 14 can be reduced, as shown in
Meanwhile, as for the arrangement of insulating walls 15, by configuring as shown in
However, as shown in
Further, as shown in
Moreover, by configuring as shown in
Further, by configuring as shown in
Further, by configuring as shown in
Additionally, by configuring as shown in
However, when walls 15 are arranged so as to emanate from the central portion when seen from a direction perpendicular to the winding surface of coil 6, as shown in
Meanwhile, in the present embodiment, it is configured that through-hole portion 14 is formed inside element 5 and through-hole portion 14 is filled with magnetic layer 16. However, when it is configured such that through-hole portion 14 is a through-hole and magnetic layer 16 is continuously formed from the upper and lower surfaces of element 5, leaking magnetic flux may be reduced.
An inductance component according to the present invention is characteristic in that this is highly reliable and an inductance value thereof is high, and is applicable in various electrical instruments such as a cellular phone.
Number | Date | Country | Kind |
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2006-082278 | Mar 2006 | JP | national |
2006-113151 | Apr 2006 | JP | national |
2006-113152 | Apr 2006 | JP | national |
2006-131329 | May 2006 | JP | national |
2006-133305 | May 2006 | JP | national |
2006-180661 | Jun 2006 | JP | national |
2006-180663 | Jun 2006 | JP | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/JP2007/055535 | 3/19/2007 | WO | 00 | 9/26/2007 |