1. Field of the Invention
The present invention relates to an appearance checking operation of products or components in the course of manufacture, and more particularly, to an inspection assistance system, data processing equipment, and a data processing method for assisting to determine the best inspection conditions and observation conditions of an inspection tool which detects particles and pattern defects on the surface of a semiconductor wafer, a photomask, a magnetic disk, a liquid crystal display which observes defects such as particles, and for assisting to analyze particles and pattern defects.
2. Background Art
In the semiconductor manufacturing process, particles and pattern defects on the wafer surface cause defective products. Therefore, particles and pattern defects (hereinafter, “appearance defects”) need to be quantified and to always monitor if there is any problem in manufacturing devices or manufacturing environments. Furthermore, the shapes of the appearance defects have to be observed to check if the appearance defects are the ones that have crucial impacts on the products.
Conventionally, such observations are visually performed by operators in the manufacturing lines. Thus, there have been problems that the defect positions of observed objects or the types of defects may vary depending on who is observing, or the defects to be observed are not constant. Recently, in order to solve these problems, techniques of ADR (Automatic Defect Review) and ADC (Automatic Defect Classification) have begun to be introduced in which a device automatically determines the sizes, shapes, types, and the like of defects by using an image processing technique. For example, a system is proposed (for example, see JP Patent Publication (Kokai) No. 10-135288A (1998), U.S. Pat. No. 6,259,960) for efficiently performing a work while lowering the load imposed on the operator when observing inspected components (for example, patterns formed on a wafer) using a review tool with an optical microscope or an SEM (Scanning Electron Microscopy).
In recent years, the defects are miniaturized along with the shrinkage of the design size of the semiconductor devices. There is a growing need for changing the inspection conditions for inspection tools that detect defects and then outputting a plurality of defects all together that are detected according to the conditions. The noise of the defect detection of the inspection tools has also become large as the inspection tools have become highly sensitive, and the number of defects detected in one inspection exceeds several tens of thousands at times. A technique has been developed for removing the noise in which the noise is eliminated by classifying the defects under inspection using an RDC (Real-Time Defect Classification) function on the inspection tools so that false detection pseudo defects such as signal noise are not transmitted to the review tools. Furthermore, in order to accurately detect defects with an inspection tool, the conditions of defect detection of the inspection tool are determined using observation results of defects in the review tool. A technology for facilitating the defect analysis is proposed in which a large amount of information outputted from inspection tools, defect IDs (identification numbers) and coordinate information outputted from observation tools, and ADR information and ADC information outputted from observation tools are organized to determine the defect detection conditions (for example, see JP Patent Publication (Kokai) No. 2001-156141A,
Meanwhile, in a semiconductor manufacturing process, a plurality of highly sensitive inspection tools are included, managed, and operated. A plurality of inspection tools inspect in the same process, and thus, some devices, even among the same type of devices, exhibit different detectivity of defects. Therefore, the management of the tools is difficult as the numbers of defects or the sizes of defects vary upon inspections. At present, the data processing is conducted by matching the data one by one, and complicated analysis is performed manually.
Under the circumstances, a system for automatically matching the coordinates and organizing the defect coordinates, images, and feature data outputted from inspection tools and review tools is proposed (for example, see JP Patent Publication (Kokai) No. 2006-173589A, US 2006/0111879).
Any desired defect information subject to coordinate matching needs to be particularly selected from a plurality of defect information imported from inspection tools when manually processing the data outputted and transmitted from these various devices using a data processing system. However, only with lot numbers, wafer IDs, dates, device names, and the numbers of detected defects, it took time to select desired defection information, or mistakes were made. At times, wrong data were read out, and unnecessary time was spent.
In view of the foregoing problems, an object of the present invention is to provide a data processing method, data processing equipment, and an inspection work assistance system as a device that analyzes matching data upon determining conditions for the inspection using data processing equipment and that analyzes differences between inspection tools, in which the operability of data importing is significantly improved and upgraded, and the usability is improved.
In order to accomplish the above object, the present invention comprises data processing equipment connected through a communication line to a plurality of appearance inspection tools for detecting defects in a plurality of samples and to a plurality of review tools for acquiring images of the defects to acquire features of the defects, wherein inspection data related to the defects in the plurality of samples from the plurality of appearance inspection tools and review data acquired by the plurality of review tools with respect to the defects are displayed on a display of the data processing equipment, and, in response to an instruction for acquiring inspection data or review data other than the inspection data or the review data displayed on the display, the data processing equipment acquires inspection data of the plurality of appearance inspection tools or review data of the plurality of review tools and displays the data on the display.
The present invention provides a device that analyzes the matching data upon determining conditions for the inspection using data processing equipment and that analyzes differences between inspection tools, thereby significantly improving and upgrading the operability of data importing and improving the usability.
The defect information 21, which is the result of the appearance inspection, is managed by the data processing equipment 3 using the lot number, wafer number, inspection process, and inspection date and time. The defect information 21 is constituted by lot numbers, wafer IDs, die layouts, defect IDs detected during inspection, coordinate information thereof, and the like. Although not shown, examples of other defect information 21 include defect ADR images and defect attribute information (RDC information). A possible example of the defect attribute information includes the one shown in
The maximum grey level difference is an absolute value of the signal of a defective part when a difference image is obtained by processing an image of the place determined as a defect and an image of its reference part. The reference image average grey level is an average value of the brightness on the reference image of the pixels determined to be the defective part, and the defective image average grey level is an average value of the brightness on the defective image of the pixels determined to be the defective part. The polarity indicates whether the defective part is brighter or darker than the reference image, and “+” indicates a bright defect while “−” indicates a dark defect. The inspection mode denotes an image comparison method used when the defect is detected, and examples include die comparison, cell comparison, and their mixed comparison. The defect size, the number of defective pixels, and the defect size ratio (width/height) denote the dimensions of the detected defect, and the unit of the width and the height is micrometer or the like, while the unit of the number of defective pixels is pixel. The defect size ratio is a parameter indicating the width/height ratio of the defect size, and for example, 1 is shown if the width and the height are the same, while 2 is shown if the width is twice as large as the height. The defective part pixel derivative value indicates a derivative value of the pixels determined to be a defect on the defective image or the reference image and indicates a degree of change in the gradation in the pixels. The value of the defective image part is referred to as a defective part pixel derivative value in defective image, while the value of the reference image part is referred to as a defective part pixel derivative value in reference image.
The wafers finished with the appearance inspection are carried to the review tool 2 for observing appearance defects, and predetermined wafers are extracted from the lots and reviewed. When reviewing, the defect information 21, i.e., lot numbers, wafer numbers, and inspection processes, of the wafers to be reviewed is acquired as key information from the data processing equipment 3. This information includes not only the defect IDs and the coordinate data, but also the ADR images obtained during inspection.
The defect information 21 outputted by the appearance inspection tool 1 is massive data, and thus, defect information 22b or 23b extracted by the data processing equipment 3 with a plurality of filter functions is transmitted through the communication line 4 to an optical review tool 24 or an SEM review tool 25. The format of the defect information 22b and 23b is generally the same as that of the defect information 21.
Images of defect detection parts are acquired by the optical review tool 24 or the SEM review tool 25 based on the extracted defect information 22b or 23b, and the images are utilized to classify the defects with the ADC function installed in each review tool. The information is transmitted through the communication line 4 to the data processing equipment 3 as ADR/ADC information 22a and 23a.
How the inspections, defect features, and image data outputted from the inspection tools are displayed and processed on the data processing equipment will now be described. An input method of the defect information of the present invention will be described with reference to
When an icon displayed on the display of the data processing equipment 3 is double clicked to activate the data processing equipment 3, the screen 30 shown in
In
The inspection data displayed on the inspection map 33 is data already imported into the data processing equipment 3. When importing new data that is not imported yet, as the cursor is placed on the inspection map 33 or the defect information list 34 in
An inspection tool name section 71, a product name section 72, and a defect coordinate comparison radius section 73 in relation to the inspection data that the operator wants to import are displayed blank on the screen 70 shown in
After inputting in each input item this way, the inspection data, i.e., coordinate data, image data, and feature data, that the operator wants to import is specified by using Drag and Drop on the screen 70 or pressing a Select button 77, 80, or 83, and the inspection data is imported into the data processing equipment by pressing a Go button 88. Each data may be specified one by one, or a plurality of files may be dragged and dropped or selected all at once. In the present embodiment, the processor of the data processing equipment automatically judges the type of the files based on extensions or inside information of the files and determines whether the files are coordinate data, image data, or feature data.
A method of importing new data into the data processing equipment and then performing the coordinate matching with the already inputted inspection data will now be described. In
The operator checks over the foregoing and modifies if any modification is needed. The operator then specifies the inspection data, i.e., coordinate data, image data, and feature data that the operator wants to import by using Drag and Drop on the screen 70 or pressing the Select button 77, 80, or 83, and the inspection data is imported into the data processing equipment by pressing the Go button 88. The result is displayed on the defect information list 34 of the screen 30 in
Before the above operations, when the operator notices a device-induced abnormality or a judgment error in the coordinate matching process, the operator can correct the coordinates of the inspection data with following operations.
A map 92 of the inspection data to be inputted and a map 91 of the inspection data already imported into the data processing equipment and subject to be matched with the inspection data to be inputted are displayed side by side on the screen 90 of
As described, according to the present embodiment of the present invention, the defect information can be selected while looking at a defect map, a list, or the like, and the coordinate correction calculation can be performed with a manual. Therefore, the errors are reduced, and importing of inspection data is facilitated. Furthermore, the time to attain desired defect information can be reduced. As a result, the time it takes to detect desired defects and to optimize the inspection conditions can be significantly reduced.
Number | Date | Country | Kind |
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2007-083247 | Mar 2007 | JP | national |