Patent Application
20150303162
The present disclosure relates to an integrated circuit (IC) chip and a display apparatus.
In a connection between wires of a liquid crystal display (LCD) panel and an IC chip containing a driving circuit, the anisotropic conductive film (ACF) is usually used. The ACF has a characteristic of being electrically conductive in the Z axis direction but insulated in the XY plane, which can be used to realize connection of wires of fine microelectronic devices. The ACF consists of a polymer substrate and conductive particles uniformly distributed in the polymer substrate. The conductive particles can be polymer micro-balls coated with metal or metal particles. Currently, commonly used conductive particles are metal particles such as gold balls. With the enlarging market demand for the LCD apparatus year by year, the demand for the ACF as a main material for the interconnection between IC chips and LCD panels rapidly grows year by year, and its price is very high.
In recent years, electronic display technologies, such as LCD, electroluminescence technologies, touch screen technologies, and so on develop fast. One of the key technologies of the electronic display technologies is connection between the IC chip comprising a driving circuit and conductive patterns on the LCD panel. When using the ACF for package and connection, the metal particles are easy to accumulate, which causes poor conductive performance in the Z axis direction. In some areas, there are too few metal particles and thus the resistance is too high. However, in some other areas, there are too many metal particles, which extends conductive metal sheets in the IC, causing short circuit between adjacent conductive metal sheets to generate too large current and thus high temperature. It then deforms related electronic devices in the IC chip, thus affecting the quality and reliability of the display apparatus.
A normal bonding manner between the IC chip and the LCD panel is as shown in
At least one embodiment of the present disclosure is to avoid the drawbacks caused by bonding the IC chip and the display apparatus through the ACF in the known technical solutions.
According to one aspect of the present disclosure, there is provided an integrated circuit (IC) chip, wherein the IC chip comprises several conductive metal sheets spaced from each other on one side of the IC chip, and conductive bumps are formed on each of the conductive metal sheets.
Optionally, the shape of the conductive bump is cube, cuboid, frustum of cone, or frustum of pyramid.
Optionally, the height of the conductive bump is 3 μm˜5 μm, its width is 1 μm˜3 μm, and the distance between the conductive bumps is 1.0 μm˜3.0 μm.
Optionally, the surfaces of all the conductive bumps that are distant from the conductive metal sheet are aligned on the same level.
Optionally, the conductive bumps and the conductive metal sheet are molded integrally or respectively.
According to another aspect of the present disclosure, there is provided a display apparatus comprising a display panel and an IC chip as described in the above, and the display panel and the IC chip are electrically connected.
Optionally, the display panel is connected together with the side of the IC chip that has the conductive bumps through a non-conductive bonding layer.
Optionally, the non-conductive bonding layer is a no conductive film (NCF) layer.
Optionally, the NCF layer comprises a substrate film, a polymer bonding layer and a protection film that are arranged layer on layer.
Optionally, the substrate film and the protection film are formed by polyethylene terephthalate (PET), and the polymer bonding layer is formed by thermoplastic or thermosetting resin.
Optionally, a conductive pattern is formed on the edge area of the display panel, and the conductive bumps are electrically connected to the conductive pattern.
At least one embodiment of the present disclosure can achieve the following benefits that the conductive bumps arranged on the conductive metal sheet of the IC chip result in good conductivity in the Z axis direction between the IC chip and the display panel, while sufficient insulation can be ensured in the XY plane direction. Therefore, it is possible to use a non-conductive bonding layer such as NCF instead of ACF to realize bonding process of the IC chip, and thus no metal particles would accumulate. As a result, the problem of short circuit or too large resistance will not occur. In addition, it is possible to reduce the production cost of the display apparatus by using NCF instead of ACF, facilitating industrialized manufacturing.
In order to explain the known solutions or embodiments of the present disclosure more clearly, in the following, the drawings required in the description of the known solutions or the embodiments will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.
a is a schematic partial plan view of an IC chip according to an embodiment of the present disclosure;
b is a schematic side view of
a is a schematic partial plan view of a first variant of the IC chip according to an embodiment of the present disclosure;
b is a schematic side view of
a is a schematic partial plan view of a second variant of the IC chip according to another embodiment of the present disclosure;
b is a schematic side view of
In the following, clear and complete description will be made on technical solutions in embodiments of the present disclosure in connection with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are only part of embodiments of the present disclosure, but not all the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments in the present disclosure without creative work fall in the protection scope of the present disclosure.
The embodiment provides an IC chip. As shown in
Because the conductive bumps are arranged on the conductive metal sheet of the IC chip, when connecting with related electrical elements, good conductivity in the Z axis direction between the IC chip and the display panel can be achieved, while sufficient insulation can be ensured in the XY plane direction. Therefore, it is possible to use a non-conductive bonding layer such as NCF instead of ACF to realize the electrical connection of the IC chip to related electrical elements, and thus no metal particles would accumulate. As a result, the problem of short circuit or too large resistance will not occur. In addition, using NCF instead of ACF would not damage the circuit features of the IC chip, and can accelerate the electronic wire packaging or connection, and improve production efficiency. It is suitable for large scale and pipeline work. It can facilitate industrialized manufacturing and reduce the production cost.
Optionally, one conductive bump is formed on each conductive metal sheet. Further, the height of the conductive bump 111 is 3 μm˜5 μm, its width is 1 μm˜3 μm, the distance between the conductive bumps is 1.0 μm˜3.0 μm, and the surfaces of all the conductive bumps that are distant from the conductive metal sheet are aligned on the same level, so as to ensure good electrical conductivity between the IC chip and a related electrical element after they are bonded.
The conductive bumps and the conductive metal sheet can be molded integrally, i.e., the conductive bumps are directly formed on the conductive metal sheet when manufacturing the IC chip, one-time molded, or the conductive bumps are formed on the conductive metal sheet that have been molded. The conductive bumps and the conductive metal sheet can also be molded respectively, that is, when fabricating the IC chip, no conductive bump is formed on the conductive metal sheet, then the conductive bump structures are fabricated separately, and the conductive bumps are formed on the conductive metal sheet through related process. The conductive bump and the conductive metal sheet can be fabricated by the same or different conductive metal materials, which is not limited herein.
The conductive bump 111 on the conductive metal sheet of the IC chip 109 can designed as cuboid or cube, as shown in
An embodiment of the present disclosure also provides a display apparatus comprising a display panel and an IC chip, wherein the display panel and the IC chip are electrically connected.
The IC chip is used to provide required electrical signals to the display apparatus, and the IC chip is usually connected to related driving wires in the display panel, for example, data lines, gate lines or driving circuits of the gate lines, and so on in the display panel. According to the display apparatus in the embodiment, since conductive bumps are arranged on the conductive metal sheet of the IC chip, when connecting with the display panel, good conductivity in the Z axis direction between the IC chip and the display panel can be achieved, while sufficient insulation can be ensured in the XY plane direction. Therefore, it is possible to use a non-conductive bonding layer such as NCF instead of ACF to realize the electrical connection of the IC chip to display panel, and thus no metal particles would accumulate. As a result, the problem of short circuit or too large resistance will not occur, and thus the quality of the display apparatus can be improved.
Further, as shown in
Optionally, the above non-conductive bonding layer can be a no conductive film (NCF) layer 108. As shown in
In the embodiment, it is possible to realize the electrical connection between the IC chip and the display panel by using NCF instead of currently commonly used ACF, which would not damage the circuit features of the IC chip, and can accelerate the electronic wire packaging or connection, and improve production efficiency. It is suitable for large scale and pipeline work. It can facilitate industrialized manufacturing and reduce the production cost.
Compared with
The above NCF layer 108 can comprise a substrate film, a polymer bonding layer and a protection film that are arranged layer on layer. The polymer bonding layer can be formed by thermoplastic or thermosetting resin, which has the bonding function. The protection film can be formed by transparent polyethylene terephthalate (PET) to protect the NCF from being contaminated. The substrate film can also be formed by transparent PET as a carrier of the polymer bonding layer. With the usage of NCF which does not contain the metal particles inside the ACF, stronger glutinosity can be achieved, and the bonding effect between the IC chip and the display panel can be enhanced. The connection is tight and electrical conductivity can be ensured. It is possible to avoid the short circuit between conductive metal sheets or between wires caused by metal conductive particle accumulation.
Optionally, in order to realize good electrical connection between the IC chip 109 and the display panel 106, as shown in
Refer to
The display apparatus in the embodiment can be a liquid crystal panel, an electronic paper, an OLED panel, a LCD TV, a LCD, a digital photo frame, a cell phone, a Tablet or any other product or part with display function.
The above embodiments are only for illustrating the present disclosure, but not limiting the present disclosure. Although the present disclosure is described in detail with reference to embodiments, those skilled in the art should understand that various combinations, modifications or equivalent replacements to the technical solutions of the present disclosure would not depart from the spirit and scope of the technical solutions of the present disclosure, which should be included in the scope of the claims of the present disclosure.
The present application claims the priority of Chinese Patent Application No. 201410043730.X filed on Jan. 29, 2014, the entire disclosed content of which is incorporated as part of the present invention by reference.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201410043730.X | Jan 2014 | CN | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/CN2014/080460 | 6/20/2014 | WO | 00 |
