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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/1355Shape

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure having copper pillar within solder bump and...
- Patent number 12,334,463
- Issue date Jun 17, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,649
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Yong Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having conductive pillars with inclined surf...
- Patent number 12,272,664
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiang-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,218,092
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Moonyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package unit comprising thermal protection film and assoc...
- Patent number 12,159,792
- Issue date Dec 3, 2024
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with solder on pillar
- Patent number 12,107,062
- Issue date Oct 1, 2024
- Texas Instruments Incorporated
- Rafael Jose Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,057,435
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Hyeonseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and methods for forming the same
- Patent number 12,033,933
- Issue date Jul 9, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kaimin Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having stepped conductive pillars
- Patent number 11,955,447
- Issue date Apr 9, 2024
- Advanced Micro Devices, Inc.
- Suming Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,929,316
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having conductive pillars with inclined surf...
- Patent number 11,901,323
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiang-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device including a joint a...
- Patent number 11,894,330
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,804,464
- Issue date Oct 31, 2023
- Kioxia Corporation
- Keiichi Niwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,646,260
- Issue date May 9, 2023
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 11,600,589
- Issue date Mar 7, 2023
- Lapis Semiconductor Co., Ltd.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 11,551,973
- Issue date Jan 10, 2023
- Kioxia Corporation
- Takanobu Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive external connector structure and method of forming
- Patent number 11,527,504
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having conductive pillars with inclined surf...
- Patent number 11,398,444
- Issue date Jul 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiang-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structure and method for forming the same
- Patent number 11,264,342
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low temperature hybrid bonding structures and manufacturing method...
- Patent number 11,205,635
- Issue date Dec 21, 2021
- Shun-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,127,703
- Issue date Sep 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Yu Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,043,462
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure including a metal post encapsulated by a...
- Patent number 10,971,463
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive external connector structure and method of forming
- Patent number 10,741,513
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metallic interconnect, a method of manufacturing a metallic interco...
- Patent number 10,734,352
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal cored solder decal structure and process
- Patent number 10,658,267
- Issue date May 19, 2020
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming integrated circuit structure for joining wafers...
- Patent number 10,636,759
- Issue date Apr 28, 2020
- GLOBALFOUNDRIES Inc.
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,600,757
- Issue date Mar 24, 2020
- Iou Ming Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structure and method for forming the same
- Patent number 10,559,546
- Issue date Feb 11, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239552
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218995
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218996
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218997
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218994
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURF...
- Publication number 20250201750
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiang-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20250105152
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Hansae Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING COPPER PILLAR WITHIN SOLDER BUMP AND...
- Publication number 20250096174
- Publication date Mar 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SOLDER ON PILLAR
- Publication number 20250015032
- Publication date Jan 9, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240371739
- Publication date Nov 7, 2024
- Advanced Semiconductor Engineering, Inc.
- Pin-Yao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240355779
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Hyeonseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING STEPPED CONDUCTIVE PILLARS
- Publication number 20240250051
- Publication date Jul 25, 2024
- ADVANCED MICRO DEVICES, INC.
- SUMING HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240243086
- Publication date Jul 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Sheng-Hsiang HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING EXPOSED LEADS
- Publication number 20240203919
- Publication date Jun 20, 2024
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo Cruz Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURF...
- Publication number 20240136316
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiang-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCO...
- Publication number 20240105655
- Publication date Mar 28, 2024
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND AS...
- Publication number 20240038704
- Publication date Feb 1, 2024
- Micron Technology, Inc.
- Faxing Che
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240014158
- Publication date Jan 11, 2024
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING COPPER PILLAR WITHIN SOLDER BUMP AND...
- Publication number 20240006360
- Publication date Jan 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230411330
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Masatoshi SHOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP BONDING METHOD AND CHIP USED THEREIN
- Publication number 20230326894
- Publication date Oct 12, 2023
- Chipbond Technology Corporation
- Fei-Jain Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH SENSOR FACE STRESS PROTECTION
- Publication number 20230317662
- Publication date Oct 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Harvested Reconstitution Bumping
- Publication number 20230245988
- Publication date Aug 3, 2023
- Kwan-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME,...
- Publication number 20230178506
- Publication date Jun 8, 2023
- Mitsubishi Electric Corporation
- Tatsushi MORISADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING STEPPED CONDUCTIVE PILLARS
- Publication number 20230154878
- Publication date May 18, 2023
- ADVANCED MICRO DEVICES, INC.
- SUMING HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20230118163
- Publication date Apr 20, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kaimin Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE SHAPES
- Publication number 20230082120
- Publication date Mar 16, 2023
- QUALCOMM Incorporated
- Yujen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230069490
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- Hyeonseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20230039094
- Publication date Feb 9, 2023
- Samsung Electronics Co., Ltd.
- Moonyong JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CHIP CONNECTION STRUCTURE
- Publication number 20230030589
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- BOIN NOH
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure having copper pillar within solder bump and...

Semiconductor package

Semiconductor packages having conductive pillars with inclined surf...

Semiconductor package and method of manufacturing semiconductor pac...

Flip chip package unit comprising thermal protection film and assoc...

Semiconductor device with solder on pillar

Semiconductor package

Semiconductor structures and methods for forming the same

Solderless interconnection structure and method of forming same

Semiconductor chip having stepped conductive pillars

Semiconductor package and method of fabricating the same

Semiconductor packages having conductive pillars with inclined surf...

Methods of manufacturing a semiconductor device including a joint a...

Semiconductor device and manufacturing method thereof

Semiconductor package and method of fabricating the same

Semiconductor device and semiconductor device manufacturing method

Semiconductor device manufacturing method and semiconductor device

Conductive external connector structure and method of forming

Semiconductor packages having conductive pillars with inclined surf...

Package on package structure and method for forming the same

Low temperature hybrid bonding structures and manufacturing method...

Semiconductor devices

Solderless interconnection structure and method of forming same

Interconnection structure including a metal post encapsulated by a...

Conductive external connector structure and method of forming

Metallic interconnect, a method of manufacturing a metallic interco...

Metal cored solder decal structure and process

Methods of forming integrated circuit structure for joining wafers...

Semiconductor package

Package on package structure and method for forming the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURF...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR STRUCTURE HAVING COPPER PILLAR WITHIN SOLDER BUMP AND...

SEMICONDUCTOR DEVICE WITH SOLDER ON PILLAR

ELECTRONIC PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP HAVING STEPPED CONDUCTIVE PILLARS

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT HAVING EXPOSED LEADS

SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURF...

MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCO...

HYBRID SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND AS...

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE HAVING COPPER PILLAR WITHIN SOLDER BUMP AND...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

FLIP CHIP BONDING METHOD AND CHIP USED THEREIN

ELECTRONIC DEVICE WITH SENSOR FACE STRESS PROTECTION

Harvested Reconstitution Bumping

POWER SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME,...

SEMICONDUCTOR CHIP HAVING STEPPED CONDUCTIVE PILLARS

SEMICONDUCTOR STRUCTURES AND METHODS FOR FORMING THE SAME

INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE SHAPES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR PACKAGE INCLUDING CHIP CONNECTION STRUCTURE