Number | Date | Country | Kind |
---|---|---|---|
00555/91 | Feb 1991 | CHX |
Filing Document | Filing Date | Country | Kind | 102e Date | 371c Date |
---|---|---|---|---|---|
PCT/EP92/00363 | 2/20/1992 | 7/26/1993 | 7/26/1993 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO92/15105 | 9/3/1992 |
Number | Name | Date | Kind |
---|---|---|---|
3609741 | Miller | Sep 1971 | |
4001822 | Sterzer | Jan 1977 | |
4017886 | Tomono et al. | Apr 1977 | |
4273859 | Mones et al. | Jun 1981 | |
4507852 | Karulkar | Apr 1985 | |
4805232 | Ma | Feb 1989 | |
4857893 | Carroll | Aug 1989 | |
4984061 | Matsumoto | Jan 1991 | |
4990993 | Tsurumaru | Feb 1991 | |
4992794 | Brouwers | Feb 1991 | |
5025550 | Zirbes et al. | Jun 1991 | |
5050292 | Zirbes et al. | Sep 1991 | |
5136271 | Nishioka et al. | Aug 1992 | |
5142698 | Koga et al. | Aug 1992 | |
5261615 | Cuttelod | Nov 1993 | |
5281855 | Hadden et al. | Jan 1994 |
Number | Date | Country |
---|---|---|
0252429 | Jan 1988 | EPX |
0301127 | Feb 1989 | EPX |
405671 | Jan 1991 | EPX |
51-150914 | Dec 1976 | JPX |
WO8704900 | Aug 1987 | WOX |
WO9222827 | Dec 1992 | WOX |
Entry |
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"The reliability of Integrated Circuits protected with Ti-W/Au Bumps", Thin Solid Films, No. 160 (1988) pp. 113-120. |
"Chambers Science and Technology Dictionary", W. R. Chambers Ltd. & Cambridge University Press, 1988. |