Patent Application
20240105583
The present disclosure generally relates to electrical devices, and more particularly, to an interconnect structure with increased decoupling capacitance.
Current applications using computing chips can vary widely in their needs for operational reliability. Some consumer products, for example, mobile phones, can operate satisfactorily using chips whose reliability requirements are not so stringent. However, there are many applications that involve high performance computing that seek to avoid chip failures. For example, banking networks, airport control systems, and government agency servers need to be up and running without interrupt as much as possible. For applications where 99.9% reliability is desired, spikes from a power supply cannot be tolerated because noise from spikes can corrupt processing output. A power surge may cause a spike in current which sometimes damages the device so that a localized failure occurs, if not a total device failure.
According to an embodiment of the present disclosure, a semiconductor chip device is provided. The semiconductor device includes a substrate. The substrate includes a first dielectric material of a first permittivity value. A first power input line is positioned in the substrate. A first ground line is positioned adjacent the first power line and is arranged to form a first decoupling capacitor in cooperation with the first power input line. A region of the substrate in between the first power input line and the first ground line is doped with a second dielectric material of a second permittivity value. The second permittivity material value is higher than the first permittivity value. The region lacks a signal body. By incorporating a region with higher permittivity, in what is generally for example, unused space for power delivery (because of the lack of a signal body), the region becomes a decoupling capacitor for nearby power delivery elements. By adding decoupling capacitance to the previously unused space, noise in a circuit is more easily controlled and the chip device becomes more reliable.
In an embodiment, which may be combined with the preceding embodiments, the region of the substrate doped with the second dielectric material includes a disconnected metallic fill body. The metallic fill body is typically a passive element used to control the metallic density in the chip device and usually does not play a part in power delivery. However, some embodiments may connect the metallic fill body to the power input line (or the ground line). By connecting the metallic fill body to one of the adjacent power delivery elements, the amount of decoupling capacitance can be controlled for an application, thus making the previously dormant region of the device more useful for power delivery designs.
According to an embodiment of the present disclosure, a computer processor implemented method of designing a power delivery network in a semiconductor substrate is provided. The method includes identifying positions for power input lines, ground lines, signaling lines, and metallic fill bodies in the semiconductor substrate. The semiconductor substrate includes a first dielectric material of a first permittivity value. Areas of the substrate positioned between power input lines and ground lines that include one or more metallic fill bodies are identified. A desired decoupling capacitance is determined for selected regions between the identified areas. An amount of a second dielectric material of a second permittivity value is determined to provide the desired decoupling capacitance in the selected regions. The second permittivity value is greater than the first permittivity value and the amount of the second dielectric material needed is based partly on an amount of metal material present in the one or more metallic fill bodies present in the selected regions. A volume for the selected regions for deposition of the determined amount of the second dielectric material is determined. Lithography and/or etching pattern masks are generated for the power delivery network. The masks include the positions for the power input lines, the ground lines, the signaling lines, the metallic fill bodies, and the selected regions including the second dielectric material.
In an embodiment, which may be combined with the preceding embodiments, the method includes identifying a selected pair of a power input line and a ground line that have a selected region in between the selected pair. The method further positions a second power input line in a layer above or below the selected region. The second power input line spans across the selected region and is orthogonal to the selected pair. The method further includes patterning a first via in the second power input line connecting the second power input line to the power input line of the selected pair. The embodiment adds further flexibility to creating decoupling capacitance in the previously unused region. By connecting the original power input line to another power input line, additional connections in the power delivery network can be made, including for example, connecting to a metallic fill body in the high dielectric region. The second power input line allows power delivery designs increased options in designing the decoupling capacitance because the spacing between the elements defining a capacitor can be decreased by jumping the power input to a metallic fill body closer to the ground line (or vice versa). A jump may be necessary when other metallic fill bodies are present in the high-k dielectric region.
According to an embodiment of the present disclosure, method of manufacturing for forming interconnections in a semiconductor substrate is provided. The method includes depositing a first layer of a first dielectric material. An area of the first layer of the first dielectric material is selectively removed for placement of a first metallic fill body. A second dielectric material is deposited in the area of selectively removed first dielectric material. The second dielectric material has a higher permittivity value than the first dielectric material. The first metallic fill body is placed in the second dielectric material. A first power input line is placed in the first layer of first dielectric material, adjacent to the second dielectric material on a first side of the second dielectric material. A first ground line is placed in the layer of first dielectric material, adjacent to the second dielectric material, and on a second side of the second dielectric material. The first power input line, the second dielectric material, and the first ground line are disposed to form a decoupling capacitor.
In an embodiment, which may be combined with the preceding embodiments, the method includes determining a desired decoupling capacitance for the decoupling capacitor. A position of the metallic fill body in the area of selectively removed first dielectric material is determined relative to either the first power input line or the first ground line, to provide the determined desired decoupling capacitance. As will be appreciated, the metallic fill in semiconductor devices can be used as an active element whose position in the device serves a dual role of providing material density and actively providing a capacitive relationship with one of the power delivery lines. The position of the metallic fill body becomes adjustable so that decoupling capacitance in an area of the device can be controlled.
The techniques described herein may be implemented in a number of ways. Example implementations are provided below with reference to the following figures.
The drawings are of illustrative embodiments. They do not illustrate all embodiments.
Other embodiments may be used in addition or instead. Details that may be apparent or unnecessary may be omitted to save space or for more effective illustration. Some embodiments may be practiced with additional components or steps and/or without all of the components or steps that are illustrated. When the same numeral appears in different drawings, it refers to the same or like components or steps.
In the following detailed description, numerous specific details are set forth by way of examples in order to provide a thorough understanding of the relevant teachings. However, it should be apparent that the present teachings may be practiced without such details. In other instances, well-known methods, procedures, components, and/or circuitry have been described at a relatively high-level, without detail, in order to avoid unnecessarily obscuring aspects of the present teachings.
In one aspect, spatially related terminology such as “front,” “back,” “top,” “bottom,” “beneath,” “below,” “lower,” above,” “upper,” “side,” “left,” “right,” and the like, is used with reference to the direction of the Figures being described. Since components of embodiments of the disclosure can be positioned in a number of different directions, the directional terminology is used for purposes of illustration and is in no way limiting. Thus, it will be understood that the spatially relative terminology is intended to encompass different directions of the device in use or operation in addition to the direction depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, for example, the term “below” can encompass both an orientation that is above, as well as, below. The device may be otherwise oriented (rotated 90 degrees or viewed or referenced at other directions) and the spatially relative descriptors used herein should be interpreted accordingly.
As used herein, the terms “lateral”, “planar”, and “horizontal” describe an orientation parallel to a first surface of a chip or substrate.
As used herein, the term “vertical” describes an orientation that is arranged perpendicular to the first surface of a chip, chip carrier, chip substrate, or semiconductor body.
As used herein, the terms “coupled” and/or “electrically coupled” are not meant to mean that the elements must be directly coupled together-intervening elements may be provided between the “coupled” or “electrically coupled” elements. In contrast, if an element is referred to as being “directly connected” or “directly coupled” to another element, there are no intervening elements present. The term “electrically connected” refers to a low-ohmic electric connection between the elements electrically connected together.
Although the terms first, second, etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of example embodiments. Nor does describing an element as “first” or “second”, etc. necessarily mean that there is an order or priority to any of the elements. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
Example embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized or simplified embodiments (and intermediate structures). As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, may be expected. Thus, the regions illustrated in the figures are schematic in nature and their shapes do not necessarily illustrate the actual shape of a region of a device and do not limit the scope. It should be appreciated that the figures and/or drawings accompanying this disclosure are exemplary, non-limiting, and not necessarily drawn to scale.
It is to be understood that other embodiments may be used, and structural or logical changes may be made without departing from the spirit and scope defined by the claims. The description of the embodiments is not limiting. In particular, elements of the embodiments described hereinafter may be combined with elements of different embodiments.
Power delivery structures in computing chips generally suffer from noise in the circuits and reliability in power delivery. The power supply bus is a common source of noise since the input voltage can fluctuate. If a system detects that a logic block is not producing a proper output, the system may invoke a failsafe mechanism to avoid using the damaged device. However, the device remains unusable and must be replaced. One common approach to reducing noise includes using decoupling capacitors to stabilize voltage signals provided into the circuit elements.
Traditional decoupling capacitors may be too large to use in newer semiconductor chip devices. While some arrangements place a ground signal line in close proximity to a power signal line in the die substrate to form a decoupling capacitor, the useable area for routing signals in a device is at a premium. There are constraints involved in positioning certain circuits elements in proximity to other elements on a chip die that limit the use of the chip substrate. The placement of decoupling capacitors within the normally used areas of power delivery limits the area useable for signaling.
Reference is now made to
Referring back to
As may be appreciated, by incorporating a high-k value dielectric into the region 250, the device 200 is provided a decoupling capacitor 205 structure (when operating in cooperation with the power input line 220 and the ground line 230) effective to provide decoupling capacitance to nearby signal line bodies 280. In some embodiments, the volume of dielectric material 260 in the region 250 may be selectively controlled to provide a desired magnitude of capacitance. While the region 260 is shown as extending from the power input line 220 to the ground line 230, in some embodiments, the volume of dielectric material 260 may occupy less than the entire region 250. In addition, while
In some embodiments, the region 250 with high-k value dielectric material may include one or more floating metallic fill bodies 270. When “floating”, the metallic fill bodies 270 may generally be disconnected from any other signal line 280 or power feature and generally do not include vias or any other interconnect element. As a passive element in the region 250, the metallic fill bodies 270 may not affect the decoupling capacitance to any notable degree. However, some embodiments may include a conductive line 275 that connects a metallic fill body 270 to either the power input line 220 or to the ground line 230.
It will be understood that while not shown in this manner, the conductive element used to connect to the power input line 220 may instead be used to connect to the ground line 230 in another embodiment. The via 425 may connect the jumper to one of the metallic fill bodies 270 which in effect, changes the ground side conductor element to the metallic fill body 270 in the decoupling capacitor.
As may be appreciated, by using a jumper type conductive line, the decoupling capacitance for an area may be controlled based partly on connecting metallic fill bodies 270 of different distances to either the power input line 220 or the ground line 230 while simultaneously being able to avoid metallic fill bodies 270 (if necessary) that may intervene between any of the capacitor elements. The effective distance between capacitor conductor elements may be controlled so that the range of capacitance is based on the breadth of the region 250, the distance of a metallic fill body 270 to either the power input line 220 or groundline 230, or the distance between any two metallic fill bodies 270 connected to its respective power input line 220 and ground line 230. As shown, the decoupling capacitance field may be based on a narrow spacing between two metallic fill bodies 270. Also, the position of the decoupling capacitance field output may be shifted depending on which two features are used for the decoupling capacitor; for example, using a metallic fill body 270 and the power input line 220 shifts the field up; using the ground line 230 and a metallic field body shifts the field down, and using two metallic fill bodies may shift the field up or down depending on the positions of respective fill bodies).
The descriptions of the various embodiments of the present teachings have been presented for purposes of illustration, but are not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein was chosen to best explain the principles of the embodiments, the practical application or technical improvement over technologies found in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
While the foregoing has described what are considered to be the best state and/or other examples, it is understood that various modifications may be made therein and that the subject matter disclosed herein may be implemented in various forms and examples, and that the teachings may be applied in numerous applications, only some of which have been described herein. It is intended by the following claims to claim any and all applications, modifications and variations that fall within the true scope of the present teachings.
The components, steps, features, objects, benefits and advantages that have been discussed herein are merely illustrative. None of them, nor the discussions relating to them, are intended to limit the scope of protection. While various advantages have been discussed herein, it will be understood that not all embodiments necessarily include all advantages. Unless otherwise stated, all measurements, values, ratings, positions, magnitudes, sizes, and other specifications that are set forth in this specification, including in the claims that follow, are approximate, not exact. They are intended to have a reasonable range that is consistent with the functions to which they relate and with what is customary in the art to which they pertain.
Numerous other embodiments are also contemplated. These include embodiments that have fewer, additional, and/or different components, steps, features, objects, benefits, and advantages. These also include embodiments in which the components and/or steps are arranged and/or ordered differently.
While the foregoing has been described in conjunction with exemplary embodiments, it is understood that the term “exemplary” is merely meant as an example, rather than the best or optimal. Except as stated immediately above, nothing that has been stated or illustrated is intended or should be interpreted to cause a dedication of any component, step, feature, object, benefit, advantage, or equivalent to the public, regardless of whether it is or is not recited in the claims.
It will be understood that the terms and expressions used herein have the ordinary meaning as is accorded to such terms and expressions with respect to their corresponding respective areas of inquiry and study except where specific meanings have otherwise been set forth herein. Relational terms such as first and second and the like may be used solely to distinguish one entity or action from another without necessarily requiring or implying any actual such relationship or order between such entities or actions. The terms “comprises,” “comprising,” or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by “a” or “an” does not, without further constraints, preclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.
The Abstract of the Disclosure is provided to allow the reader to quickly ascertain the nature of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. In addition, in the foregoing Detailed Description, it can be seen that various features are grouped together in various embodiments for the purpose of streamlining the disclosure. This method of disclosure is not to be interpreted as reflecting an intention that the claimed embodiments have more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive subject matter lies in less than all features of a single disclosed embodiment. Thus, the following claims are hereby incorporated into the Detailed Description, with each claim standing on its own as a separately claimed subject matter.
