Capacitor integral with wiring layers

Industry

CPC
H01L23/5223

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5223Capacitor integral with wiring layers

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring
- Patent number 12,205,885
- Issue date Jan 21, 2025
- Microchip Technology Incorporated
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to create MIMcap designs across changing MIMcap structures
- Patent number 12,205,884
- Issue date Jan 21, 2025
- Advanced Micro Devices, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-oxide-metal cell semiconductor device and method
- Patent number 12,205,898
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
MIM capacitor with a symmetrical capacitor insulator structure
- Patent number 12,199,029
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including decoupling capacitors
- Patent number 12,199,030
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Xuan Huang
- G11 - INFORMATION STORAGE
Information Patent Grant
Method and apparatus for use in digitally tuning a capacitor in an...
- Patent number 12,199,599
- Issue date Jan 14, 2025
- pSemi Corporation
- Tero Tapio Ranta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method of making
- Patent number 12,191,248
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wan-Yu Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable graduated capacitor structure and methods for forming the...
- Patent number 12,191,247
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density metal insulator metal capacitor
- Patent number 12,191,347
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei Kai Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film transistors and MIM capacitors in exclusion zones
- Patent number 12,183,668
- Issue date Dec 31, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of forming the same
- Patent number 12,183,779
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configurable metal—insulator—metal capacitor and devices
- Patent number 12,183,669
- Issue date Dec 31, 2024
- MACOM Technology Solutions Holdings, Inc.
- Jeremy Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through plate interconnect for a vertical MIM capacitor
- Patent number 12,176,284
- Issue date Dec 24, 2024
- Intel Corporation
- Travis Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded metal insulator metal structure
- Patent number 12,170,241
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,166,010
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 12,159,826
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Myungsam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle end of line decoupling capacitors for semiconductor devices...
- Patent number 12,159,827
- Issue date Dec 3, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMANY, LTD.
- Chung-Ting Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor formed with high resistance layer and method of manufactu...
- Patent number 12,154,849
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mingni Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated structure and manufacturing method the...
- Patent number 12,148,691
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for protecting data stored in a memory, and corresponding in...
- Patent number 12,125,808
- Issue date Oct 22, 2024
- STMicroelectronics (Rousset) SAS
- Pascal Fornara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 12,125,782
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Kuang Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal plate corner structure on metal insulator metal
- Patent number 12,107,041
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal insulator metal (MIM) capacitor
- Patent number 12,107,040
- Issue date Oct 1, 2024
- Intel Corporation
- Aaron J. Welsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming on-chip capacitor structures in semiconductor d...
- Patent number 12,108,603
- Issue date Oct 1, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Electronic module, manufacturing method thereof and electronic pack...
- Patent number 12,100,648
- Issue date Sep 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits having signal lines formed with double patterning
- Patent number 12,100,655
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitors with thick intermediate electrode...
- Patent number 12,100,730
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for analog floating gate memory cell
- Patent number 12,100,453
- Issue date Sep 24, 2024
- Nuvoton Technology Corporation
- Bal S. Sandhu
- G11 - INFORMATION STORAGE
Information Patent Grant
Metal-insulator-metal capacitor (MIMCAP) and methods of forming the...
- Patent number 12,094,763
- Issue date Sep 17, 2024
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Kwang Sing Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride-based semiconductor device and method for manufacturing the...
- Patent number 12,094,875
- Issue date Sep 17, 2024
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Xin Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250022793
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-I Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250022844
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INTEGRATED STACK CAPACITOR (ISC) IN SUBSTRATE BUILD-UP LAYER
- Publication number 20250014986
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Rui ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CHARGE CONTROL SYSTEM
- Publication number 20250015611
- Publication date Jan 9, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Tatsuya ONUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTU...
- Publication number 20250015123
- Publication date Jan 9, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE INCLUDING WORK FUNCTION METAL LAYERS AND METHOD...
- Publication number 20250014984
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bi-Shen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING INTERCONNECT PACKAGE WITH CAPACITOR...
- Publication number 20250014985
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND CIRCUIT DEVICE
- Publication number 20250015001
- Publication date Jan 9, 2025
- Murata Manufacturing Co., Ltd.
- Shota ANDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROTECTING DATA STORED IN A MEMORY, AND CORRESPONDING IN...
- Publication number 20250015016
- Publication date Jan 9, 2025
- STMicroelectronics (Rousset) SAS
- Pascal Fornara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH DAMAGE SENSOR
- Publication number 20250006629
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DECOUPLING UNIT
- Publication number 20250006627
- Publication date Jan 2, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Feature Through Heterogeneous Stacked Film and Methods of M...
- Publication number 20240429090
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jhen Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedding Metal-Insulator-Metal Structure In Silicon Oxide In A Cop...
- Publication number 20240429156
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yueh Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Decoupling Capacitor Structures And Assemblies
- Publication number 20240429157
- Publication date Dec 26, 2024
- KYOCERA AVX Components Corporation
- Laurent Desclos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CAPACITOR
- Publication number 20240429155
- Publication date Dec 26, 2024
- Intel Corporation
- Mamatha YAKKEGONDI VIRUPAKSHAPPA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)
- Publication number 20240421064
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL STRUCTURE AND METHODS THEREOF
- Publication number 20240421065
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yueh CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)
- Publication number 20240421067
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240421066
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CAPACITOR STRUCTURES AND SEMICONDUCTOR...
- Publication number 20240421068
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Myoungsoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH ELECTRODE LAYER AND METHOD FOR...
- Publication number 20240413193
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Tzu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH FISHBONE CAPACITOR STRUCTURES
- Publication number 20240404943
- Publication date Dec 5, 2024
- Intel Corporation
- Denzil Frost
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY BACKSIDE MIM CAPACITOR
- Publication number 20240404942
- Publication date Dec 5, 2024
- International Business Machines Corporation
- HUIMEI ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-SILICIDE CAPACITORS
- Publication number 20240395694
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kaochao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL (MIM) CAPACITOR
- Publication number 20240395696
- Publication date Nov 28, 2024
- Intel Corporation
- Aaron J. WELSH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL (MIM) CAPACITOR
- Publication number 20240395695
- Publication date Nov 28, 2024
- Intel Corporation
- Aaron J. WELSH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS HAVING SIGNAL LINES FORMED WITH DOUBLE PATTERNING
- Publication number 20240395704
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Chieh YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240395690
- Publication date Nov 28, 2024
- Mitsubishi Electric Corporation
- Kenta NAKAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITORS WITH THICK INTERMEDIATE ELECTRODE...
- Publication number 20240387609
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING
- Publication number 20240387354
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wan-Yu Lo
- H01 - BASIC ELECTRIC ELEMENTS

Capacitor integral with wiring layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring

Method to create MIMcap designs across changing MIMcap structures

Metal-oxide-metal cell semiconductor device and method

MIM capacitor with a symmetrical capacitor insulator structure

Semiconductor devices including decoupling capacitors

Method and apparatus for use in digitally tuning a capacitor in an...

Semiconductor arrangement and method of making

Variable graduated capacitor structure and methods for forming the...

High density metal insulator metal capacitor

Thin-film transistors and MIM capacitors in exclusion zones

Integrated circuit and method of forming the same

Configurable metal—insulator—metal capacitor and devices

Through plate interconnect for a vertical MIM capacitor

Embedded metal insulator metal structure

Semiconductor package and method of manufacturing the same

Semiconductor package and method of manufacturing the semiconductor...

Middle end of line decoupling capacitors for semiconductor devices...

Capacitor formed with high resistance layer and method of manufactu...

Three-dimensional integrated structure and manufacturing method the...

Method for protecting data stored in a memory, and corresponding in...

Semiconductor structure and method of forming the same

Metal plate corner structure on metal insulator metal

Metal insulator metal (MIM) capacitor

Methods for forming on-chip capacitor structures in semiconductor d...

Electronic module, manufacturing method thereof and electronic pack...

Integrated circuits having signal lines formed with double patterning

Metal-insulator-metal capacitors with thick intermediate electrode...

Method and apparatus for analog floating gate memory cell

Metal-insulator-metal capacitor (MIMCAP) and methods of forming the...

Nitride-based semiconductor device and method for manufacturing the...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

EMBEDDED INTEGRATED STACK CAPACITOR (ISC) IN SUBSTRATE BUILD-UP LAYER

SEMICONDUCTOR DEVICE AND CHARGE CONTROL SYSTEM

ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTU...

CAPACITOR STRUCTURE INCLUDING WORK FUNCTION METAL LAYERS AND METHOD...

SEMICONDUCTOR DEVICE INCLUDING INTERCONNECT PACKAGE WITH CAPACITOR...

ELECTRONIC COMPONENT AND CIRCUIT DEVICE

METHOD FOR PROTECTING DATA STORED IN A MEMORY, AND CORRESPONDING IN...

DOUBLE-SIDED INTEGRATED CIRCUIT WITH DAMAGE SENSOR

SEMICONDUCTOR DEVICE WITH DECOUPLING UNIT

Contact Feature Through Heterogeneous Stacked Film and Methods of M...

Embedding Metal-Insulator-Metal Structure In Silicon Oxide In A Cop...

Decoupling Capacitor Structures And Assemblies

INTEGRATED CAPACITOR

METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)

METAL-INSULATOR-METAL STRUCTURE AND METHODS THEREOF

METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)

METAL-INSULATOR-METAL STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICES HAVING CAPACITOR STRUCTURES AND SEMICONDUCTOR...

SEMICONDUCTOR DEVICE STRUCTURE WITH ELECTRODE LAYER AND METHOD FOR...

INTEGRATED CIRCUIT DEVICES WITH FISHBONE CAPACITOR STRUCTURES

HIGH DENSITY BACKSIDE MIM CAPACITOR

METAL-INSULATOR-SILICIDE CAPACITORS

METAL INSULATOR METAL (MIM) CAPACITOR

METAL INSULATOR METAL (MIM) CAPACITOR

INTEGRATED CIRCUITS HAVING SIGNAL LINES FORMED WITH DOUBLE PATTERNING

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METAL-INSULATOR-METAL CAPACITORS WITH THICK INTERMEDIATE ELECTRODE...

SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING