Capacitor integral with wiring layers

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H01L23/5223

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5223Capacitor integral with wiring layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Embedded metal insulator metal structure
- Patent number 12,170,241
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,166,010
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 12,159,826
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Myungsam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle end of line decoupling capacitors for semiconductor devices...
- Patent number 12,159,827
- Issue date Dec 3, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMANY, LTD.
- Chung-Ting Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor formed with high resistance layer and method of manufactu...
- Patent number 12,154,849
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mingni Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated structure and manufacturing method the...
- Patent number 12,148,691
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for protecting data stored in a memory, and corresponding in...
- Patent number 12,125,808
- Issue date Oct 22, 2024
- STMicroelectronics (Rousset) SAS
- Pascal Fornara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 12,125,782
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Kuang Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal plate corner structure on metal insulator metal
- Patent number 12,107,041
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal insulator metal (MIM) capacitor
- Patent number 12,107,040
- Issue date Oct 1, 2024
- Intel Corporation
- Aaron J. Welsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming on-chip capacitor structures in semiconductor d...
- Patent number 12,108,603
- Issue date Oct 1, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Electronic module, manufacturing method thereof and electronic pack...
- Patent number 12,100,648
- Issue date Sep 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits having signal lines formed with double patterning
- Patent number 12,100,655
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitors with thick intermediate electrode...
- Patent number 12,100,730
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for analog floating gate memory cell
- Patent number 12,100,453
- Issue date Sep 24, 2024
- Nuvoton Technology Corporation
- Bal S. Sandhu
- G11 - INFORMATION STORAGE
Information Patent Grant
Metal-insulator-metal capacitor (MIMCAP) and methods of forming the...
- Patent number 12,094,763
- Issue date Sep 17, 2024
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Kwang Sing Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride-based semiconductor device and method for manufacturing the...
- Patent number 12,094,875
- Issue date Sep 17, 2024
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Xin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-dispersion component in an electronic chip
- Patent number 12,087,683
- Issue date Sep 10, 2024
- STMicroelectronics (Rousset) SAS
- François Tailliet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical passive elements of an ESD power clamp in a backside bac...
- Patent number 12,087,761
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an integrated circuit device
- Patent number 12,087,712
- Issue date Sep 10, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure of capacitive device
- Patent number 12,087,684
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tai-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage isolation barrier with electric overstress integrity
- Patent number 12,087,710
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Jeffrey A West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method for the same
- Patent number 12,080,752
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures having differentiated interconnect li...
- Patent number 12,080,643
- Issue date Sep 3, 2024
- Intel Corporation
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit assembly
- Patent number 12,074,103
- Issue date Aug 27, 2024
- AP Memory Technology Corp.
- Wenliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive isolation structure insert for reversed signals
- Patent number 12,073,162
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheok-Kei Lei
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Trench power rail in cell circuits to reduce resistance and related...
- Patent number 12,074,109
- Issue date Aug 27, 2024
- QUALCOMM Incorporated
- Mustafa Badaroglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end-of-line (BEOL) high resistance (Hi-R) conductor layer in a...
- Patent number 12,068,238
- Issue date Aug 20, 2024
- QUALCOMM Incorporated
- John Jianhong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode structure having improved shape, and electronic device in...
- Patent number 12,068,362
- Issue date Aug 20, 2024
- STMicroelectronics S.r.l.
- Fabrizio Cerini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with conductive plug and capacitor array
- Patent number 12,068,239
- Issue date Aug 20, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)
- Publication number 20240421064
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL STRUCTURE AND METHODS THEREOF
- Publication number 20240421065
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yueh CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)
- Publication number 20240421067
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240421066
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CAPACITOR STRUCTURES AND SEMICONDUCTOR...
- Publication number 20240421068
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Myoungsoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH ELECTRODE LAYER AND METHOD FOR...
- Publication number 20240413193
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Tzu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH FISHBONE CAPACITOR STRUCTURES
- Publication number 20240404943
- Publication date Dec 5, 2024
- Intel Corporation
- Denzil Frost
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY BACKSIDE MIM CAPACITOR
- Publication number 20240404942
- Publication date Dec 5, 2024
- International Business Machines Corporation
- HUIMEI ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-SILICIDE CAPACITORS
- Publication number 20240395694
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kaochao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL (MIM) CAPACITOR
- Publication number 20240395696
- Publication date Nov 28, 2024
- Intel Corporation
- Aaron J. WELSH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL (MIM) CAPACITOR
- Publication number 20240395695
- Publication date Nov 28, 2024
- Intel Corporation
- Aaron J. WELSH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS HAVING SIGNAL LINES FORMED WITH DOUBLE PATTERNING
- Publication number 20240395704
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Chieh YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240395690
- Publication date Nov 28, 2024
- Mitsubishi Electric Corporation
- Kenta NAKAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITORS WITH THICK INTERMEDIATE ELECTRODE...
- Publication number 20240387609
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING
- Publication number 20240387354
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wan-Yu Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR IMPLEMENTING CAPACITORS IN SEMICONDUCTOR...
- Publication number 20240387353
- Publication date Nov 21, 2024
- Intel Corporation
- Michael Langenbuch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH INTEGRATED PASSIVE DEVICES AND METHODS O...
- Publication number 20240387378
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER FEATURES
- Publication number 20240387380
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION LAYERS WITH ROUNDED CORNERS
- Publication number 20240387244
- Publication date Nov 21, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Mingni CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR FORMED WITH HIGH RESISTANCE LAYER AND METHOD OF MANUFACTU...
- Publication number 20240387355
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mingni Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CAPACITOR STRUCTURE
- Publication number 20240387606
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Qinghui ZHENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL PLATE CORNER STRUCTURE ON METAL INSULATOR METAL
- Publication number 20240379529
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL MIM STRUCTURE
- Publication number 20240379532
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-huan WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240379595
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILTER AND MANUFACTURING METHOD THEREFOR
- Publication number 20240379650
- Publication date Nov 14, 2024
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Qichang AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379530
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jen TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING RC DELAY IN SEMICONDUCTOR DEVICES
- Publication number 20240379563
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240379734
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240379572
- Publication date Nov 14, 2024
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yuji MORINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL DEVICE WITH IMPROVED PERFORMANCE
- Publication number 20240379528
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS

Capacitor integral with wiring layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embedded metal insulator metal structure

Semiconductor package and method of manufacturing the same

Semiconductor package and method of manufacturing the semiconductor...

Middle end of line decoupling capacitors for semiconductor devices...

Capacitor formed with high resistance layer and method of manufactu...

Three-dimensional integrated structure and manufacturing method the...

Method for protecting data stored in a memory, and corresponding in...

Semiconductor structure and method of forming the same

Metal plate corner structure on metal insulator metal

Metal insulator metal (MIM) capacitor

Methods for forming on-chip capacitor structures in semiconductor d...

Electronic module, manufacturing method thereof and electronic pack...

Integrated circuits having signal lines formed with double patterning

Metal-insulator-metal capacitors with thick intermediate electrode...

Method and apparatus for analog floating gate memory cell

Metal-insulator-metal capacitor (MIMCAP) and methods of forming the...

Nitride-based semiconductor device and method for manufacturing the...

Low-dispersion component in an electronic chip

Electrical passive elements of an ESD power clamp in a backside bac...

Method for fabricating an integrated circuit device

Integrated circuit structure of capacitive device

High voltage isolation barrier with electric overstress integrity

Semiconductor structure and manufacturing method for the same

Integrated circuit structures having differentiated interconnect li...

Circuit assembly

Capacitive isolation structure insert for reversed signals

Trench power rail in cell circuits to reduce resistance and related...

Back-end-of-line (BEOL) high resistance (Hi-R) conductor layer in a...

Electrode structure having improved shape, and electronic device in...

Semiconductor structure with conductive plug and capacitor array

Patents Applicationslast 30 patents

METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)

METAL-INSULATOR-METAL STRUCTURE AND METHODS THEREOF

METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)

METAL-INSULATOR-METAL STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICES HAVING CAPACITOR STRUCTURES AND SEMICONDUCTOR...

SEMICONDUCTOR DEVICE STRUCTURE WITH ELECTRODE LAYER AND METHOD FOR...

INTEGRATED CIRCUIT DEVICES WITH FISHBONE CAPACITOR STRUCTURES

HIGH DENSITY BACKSIDE MIM CAPACITOR

METAL-INSULATOR-SILICIDE CAPACITORS

METAL INSULATOR METAL (MIM) CAPACITOR

METAL INSULATOR METAL (MIM) CAPACITOR

INTEGRATED CIRCUITS HAVING SIGNAL LINES FORMED WITH DOUBLE PATTERNING

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METAL-INSULATOR-METAL CAPACITORS WITH THICK INTERMEDIATE ELECTRODE...

SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING

METHODS AND APPARATUS FOR IMPLEMENTING CAPACITORS IN SEMICONDUCTOR...

SEMICONDUCTOR DEVICES WITH INTEGRATED PASSIVE DEVICES AND METHODS O...

REDISTRIBUTION LAYER FEATURES

PASSIVATION LAYERS WITH ROUNDED CORNERS

CAPACITOR FORMED WITH HIGH RESISTANCE LAYER AND METHOD OF MANUFACTU...

METHOD FOR MANUFACTURING CAPACITOR STRUCTURE

METAL PLATE CORNER STRUCTURE ON METAL INSULATOR METAL

NOVEL MIM STRUCTURE

SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME

FILTER AND MANUFACTURING METHOD THEREFOR

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

REDUCING RC DELAY IN SEMICONDUCTOR DEVICES

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

METAL-INSULATOR-METAL DEVICE WITH IMPROVED PERFORMANCE