Capacitor integral with wiring layers

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H01L23/5223

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5223Capacitor integral with wiring layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Reducing RC delay in semiconductor devices
- Patent number 12,230,574
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method to increase effective capacitance with layout...
- Patent number 12,230,569
- Issue date Feb 18, 2025
- Intel Corporation
- Kushal Sreedhar
- G11 - INFORMATION STORAGE
Information Patent Grant
Metal-insulator-metal structure
- Patent number 12,230,566
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standalone high voltage galvanic isolation capacitors
- Patent number 12,230,669
- Issue date Feb 18, 2025
- Texas Instruments Incorporated
- Thomas Dyer Bonifield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for delivering power
- Patent number 12,232,246
- Issue date Feb 18, 2025
- RAMBUS INC.
- Kyung Suk Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated filler capacitor cell device and corresponding manufactu...
- Patent number 12,230,565
- Issue date Feb 18, 2025
- STMicroelectronics (Rousset) SAS
- Abderrezak Marzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitors with built-in electric fields
- Patent number 12,224,309
- Issue date Feb 11, 2025
- Intel Corporation
- Sou-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked planar capacitors based multi-function linear threshold gat...
- Patent number 12,218,045
- Issue date Feb 4, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,218,184
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jui-Lin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact capacitor structure
- Patent number 12,218,257
- Issue date Feb 4, 2025
- Realtek Semiconductor Corporation
- Jian Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier layer for metal insulator metal capacitors
- Patent number 12,218,181
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end-of-line passive device structure having common connection...
- Patent number 12,218,186
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Chiung Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transferring information across a high voltage gap using capacitive...
- Patent number 12,211,785
- Issue date Jan 28, 2025
- Infineon Technologies Austria AG
- Lars Mueller-Meskamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier layer for metal insulator metal capacitors
- Patent number 12,211,890
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring
- Patent number 12,205,885
- Issue date Jan 21, 2025
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to create MIMcap designs across changing MIMcap structures
- Patent number 12,205,884
- Issue date Jan 21, 2025
- Advanced Micro Devices, Inc.
- Regina Tien Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-oxide-metal cell semiconductor device and method
- Patent number 12,205,898
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Chieh Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
MIM capacitor with a symmetrical capacitor insulator structure
- Patent number 12,199,029
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including decoupling capacitors
- Patent number 12,199,030
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Xuan Huang
- G11 - INFORMATION STORAGE
Information Patent Grant
Method and apparatus for use in digitally tuning a capacitor in an...
- Patent number 12,199,599
- Issue date Jan 14, 2025
- pSemi Corporation
- Tero Tapio Ranta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method of making
- Patent number 12,191,248
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wan-Yu Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable graduated capacitor structure and methods for forming the...
- Patent number 12,191,247
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density metal insulator metal capacitor
- Patent number 12,191,347
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei Kai Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film transistors and MIM capacitors in exclusion zones
- Patent number 12,183,668
- Issue date Dec 31, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of forming the same
- Patent number 12,183,779
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configurable metal—insulator—metal capacitor and devices
- Patent number 12,183,669
- Issue date Dec 31, 2024
- MACOM Technology Solutions Holdings, Inc.
- Jeremy Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through plate interconnect for a vertical MIM capacitor
- Patent number 12,176,284
- Issue date Dec 24, 2024
- Intel Corporation
- Travis Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded metal insulator metal structure
- Patent number 12,170,241
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,166,010
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 12,159,826
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Myungsam Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)
- Publication number 20250062219
- Publication date Feb 20, 2025
- International Business Machines Corporation
- ATSUSHI OGINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL TRANSMISSION DEVICE
- Publication number 20250062256
- Publication date Feb 20, 2025
- DENSO CORPORATION
- Shuji ASANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250062209
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Sheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertically Stacked Capacitors
- Publication number 20250062220
- Publication date Feb 20, 2025
- Ampleon Netherlands B.V.
- Daniel Maassen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250062221
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)
- Publication number 20250062218
- Publication date Feb 20, 2025
- International Business Machines Corporation
- ATSUSHI OGINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250054917
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Eunseok Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR FORMED WITH HIGH RESISTANCE LAYER AND METHOD OF MANUFACTU...
- Publication number 20250054855
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mingni Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR ARRAY FORMATION USING SINGLE ETCH PROCESS
- Publication number 20250048658
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING CRACK DETECTOR AND MANUFACTURING...
- Publication number 20250046702
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-YU CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Insulator-Metal Capacitor Within Metallization Structure
- Publication number 20250038102
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Chi-Han Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH CAPACITORS
- Publication number 20250038104
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR STRUCTURE AND METHOD FORM FORMING SAME
- Publication number 20250040159
- Publication date Jan 30, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF MIM CAPACITOR AND HEAT SINK
- Publication number 20250038103
- Publication date Jan 30, 2025
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THREE-DIMENSIONAL INTEGRATED STRUCTURE
- Publication number 20250029918
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR VIA STRUCTURES
- Publication number 20250029917
- Publication date Jan 23, 2025
- International Business Machines Corporation
- Huimei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR HAVING A BOTTOM CAPACITOR PLATE WITH A ROUGH UPPER SURFAC...
- Publication number 20250031388
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- I-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250022793
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-I Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250022844
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INTEGRATED STACK CAPACITOR (ISC) IN SUBSTRATE BUILD-UP LAYER
- Publication number 20250014986
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Rui ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTU...
- Publication number 20250015123
- Publication date Jan 9, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CHARGE CONTROL SYSTEM
- Publication number 20250015611
- Publication date Jan 9, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Tatsuya ONUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE INCLUDING WORK FUNCTION METAL LAYERS AND METHOD...
- Publication number 20250014984
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bi-Shen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING INTERCONNECT PACKAGE WITH CAPACITOR...
- Publication number 20250014985
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND CIRCUIT DEVICE
- Publication number 20250015001
- Publication date Jan 9, 2025
- Murata Manufacturing Co., Ltd.
- Shota ANDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROTECTING DATA STORED IN A MEMORY, AND CORRESPONDING IN...
- Publication number 20250015016
- Publication date Jan 9, 2025
- STMicroelectronics (Rousset) SAS
- Pascal Fornara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT WITH DAMAGE SENSOR
- Publication number 20250006629
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DECOUPLING UNIT
- Publication number 20250006627
- Publication date Jan 2, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Feature Through Heterogeneous Stacked Film and Methods of M...
- Publication number 20240429090
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jhen Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedding Metal-Insulator-Metal Structure In Silicon Oxide In A Cop...
- Publication number 20240429156
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yueh Chou
- H01 - BASIC ELECTRIC ELEMENTS

Capacitor integral with wiring layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Reducing RC delay in semiconductor devices

Apparatus and method to increase effective capacitance with layout...

Metal-insulator-metal structure

Standalone high voltage galvanic isolation capacitors

Structure for delivering power

Integrated filler capacitor cell device and corresponding manufactu...

Capacitors with built-in electric fields

Stacked planar capacitors based multi-function linear threshold gat...

Semiconductor structure and method for forming the same

Compact capacitor structure

Barrier layer for metal insulator metal capacitors

Back-end-of-line passive device structure having common connection...

Transferring information across a high voltage gap using capacitive...

Barrier layer for metal insulator metal capacitors

Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring

Method to create MIMcap designs across changing MIMcap structures

Metal-oxide-metal cell semiconductor device and method

MIM capacitor with a symmetrical capacitor insulator structure

Semiconductor devices including decoupling capacitors

Method and apparatus for use in digitally tuning a capacitor in an...

Semiconductor arrangement and method of making

Variable graduated capacitor structure and methods for forming the...

High density metal insulator metal capacitor

Thin-film transistors and MIM capacitors in exclusion zones

Integrated circuit and method of forming the same

Configurable metal—insulator—metal capacitor and devices

Through plate interconnect for a vertical MIM capacitor

Embedded metal insulator metal structure

Semiconductor package and method of manufacturing the same

Semiconductor package and method of manufacturing the semiconductor...

Patents Applicationslast 30 patents

METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)

SIGNAL TRANSMISSION DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE

Vertically Stacked Capacitors

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

CAPACITOR FORMED WITH HIGH RESISTANCE LAYER AND METHOD OF MANUFACTU...

CAPACITOR ARRAY FORMATION USING SINGLE ETCH PROCESS

SEMICONDUCTOR STRUCTURE INCLUDING CRACK DETECTOR AND MANUFACTURING...

Metal-Insulator-Metal Capacitor Within Metallization Structure

INTEGRATED CIRCUITS WITH CAPACITORS

METAL-INSULATOR-METAL CAPACITOR STRUCTURE AND METHOD FORM FORMING SAME

STRUCTURE OF MIM CAPACITOR AND HEAT SINK

METHOD FOR FORMING THREE-DIMENSIONAL INTEGRATED STRUCTURE

METAL-INSULATOR-METAL CAPACITOR VIA STRUCTURES

CAPACITOR HAVING A BOTTOM CAPACITOR PLATE WITH A ROUGH UPPER SURFAC...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

EMBEDDED INTEGRATED STACK CAPACITOR (ISC) IN SUBSTRATE BUILD-UP LAYER

ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTU...

SEMICONDUCTOR DEVICE AND CHARGE CONTROL SYSTEM

CAPACITOR STRUCTURE INCLUDING WORK FUNCTION METAL LAYERS AND METHOD...

SEMICONDUCTOR DEVICE INCLUDING INTERCONNECT PACKAGE WITH CAPACITOR...

ELECTRONIC COMPONENT AND CIRCUIT DEVICE

METHOD FOR PROTECTING DATA STORED IN A MEMORY, AND CORRESPONDING IN...

DOUBLE-SIDED INTEGRATED CIRCUIT WITH DAMAGE SENSOR

SEMICONDUCTOR DEVICE WITH DECOUPLING UNIT

Contact Feature Through Heterogeneous Stacked Film and Methods of M...

Embedding Metal-Insulator-Metal Structure In Silicon Oxide In A Cop...