Capacitor integral with wiring layers

Industry

CPC
H01L23/5223

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5223Capacitor integral with wiring layers

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structures and methods of forming the same
- Patent number 12,368,094
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Nan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM structure
- Patent number 12,362,271
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun huan Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,362,272
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and etching method
- Patent number 12,362,098
- Issue date Jul 15, 2025
- Kabushiki Kaisha Toshiba
- Kazuhito Higuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitor structure and method for forming the same
- Patent number 12,356,636
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer features
- Patent number 12,354,959
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for fabricating same
- Patent number 12,347,765
- Issue date Jul 1, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,336,161
- Issue date Jun 17, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co-integrated vertically structured capacitive element and fabricat...
- Patent number 12,334,429
- Issue date Jun 17, 2025
- STMicroelectronics (Rousset) SAS
- Abderrezak Marzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a nanowire-based structure and capacitor ar...
- Patent number 12,336,241
- Issue date Jun 17, 2025
- Murata Manufacturing Co., Ltd.
- Julien El Sabahy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,328,882
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage passive device structure
- Patent number 12,327,785
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitors with back side power rails
- Patent number 12,327,786
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kam-Tou Sio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,324,168
- Issue date Jun 3, 2025
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal device with improved performance
- Patent number 12,322,694
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit
- Patent number 12,322,693
- Issue date Jun 3, 2025
- Samsung Electronics Co., Ltd.
- Shin Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-mode wireless charging device
- Patent number 12,322,696
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layers with rounded corners
- Patent number 12,322,646
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mingni Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor within metallization structure
- Patent number 12,315,791
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Han Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and methods of formation
- Patent number 12,317,517
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal (MIM) capacitor module with outer electrode e...
- Patent number 12,310,041
- Issue date May 20, 2025
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated metal-insulator-metal capacitors
- Patent number 12,308,309
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Zhong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure
- Patent number 12,300,715
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for forming integrated high density MIM capacitor
- Patent number 12,288,802
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated voltage regulator and passive components
- Patent number 12,278,215
- Issue date Apr 15, 2025
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and manufacturing method thereof
- Patent number 12,279,414
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Katherine H Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 12,278,177
- Issue date Apr 15, 2025
- SK keyfoundry Inc.
- Jeong Geun Bak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top hat structure for isolation capacitors
- Patent number 12,272,633
- Issue date Apr 8, 2025
- Skyworks Solutions, Inc.
- Thomas C. Fowler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device having capacitor structure and method of forming the...
- Patent number 12,267,992
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with decoupling unit
- Patent number 12,266,600
- Issue date Apr 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE SUBSTRATE WITH EMBEDDED CAPACITOR PACKAGE HAVING REDISTRIBU...
- Publication number 20250239518
- Publication date Jul 24, 2025
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CAPACITOR ARCHITECTURE USING CHIPPING D...
- Publication number 20250239539
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Minsu JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED POWER MANAGEMENT INTE...
- Publication number 20250239522
- Publication date Jul 24, 2025
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE, METHOD OF MANUFACTURING, AND INTEGRATED CIRCUIT DEVICE
- Publication number 20250239304
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Huai-Ying HUANG
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED CAPACITOR SHEET, INTERPOSER, AND SEMICONDUCTOR ELEMENT
- Publication number 20250233064
- Publication date Jul 17, 2025
- MURATA MANUFACTURING CO., LTD.
- Tomoyuki ASHIMINE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250226278
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR FORMING INTEGRATED HIGH DENSITY MIM CAPACITOR
- Publication number 20250227942
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DEEP TRENCH CAPACITORS IN INTEGRATED CIRCUIT DEVICE PACKAG...
- Publication number 20250218929
- Publication date Jul 3, 2025
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CAPACITOR IN INTERCONNECT REGION
- Publication number 20250218928
- Publication date Jul 3, 2025
- Intel Corporation
- Denzil S. Frost
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT WITH SELECTIVE BACKSIDE POWER AND GROUND DIST...
- Publication number 20250210464
- Publication date Jun 26, 2025
- NXP B.V.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH CAPACITOR AND METHODS FOR MAKING
- Publication number 20250210508
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ke-Jing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF
- Publication number 20250212386
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Katherine H. Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION BOUNDARY DEFECTS FOR REDUCED LEAKAGE CURRENT CAPACITOR...
- Publication number 20250210506
- Publication date Jun 26, 2025
- Intel Corporation
- Kihyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC MEMORY, THREE-DIMENSIONAL INTEGRATED CIRCUIT, AND ELE...
- Publication number 20250212416
- Publication date Jun 26, 2025
- Huawei Technologies Co., Ltd
- Kailiang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20250210516
- Publication date Jun 26, 2025
- SK keyfoundry Inc.
- Jeong Geun BAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TRENCH CAPACITORS AND METHODS OF MAKING THEREOF
- Publication number 20250210507
- Publication date Jun 26, 2025
- GLOBALFOUNDRIES U.S. Inc.
- ANUPAM DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE HAVING CAPACITOR STRUCTURE AND METHOD OF FORMING THE...
- Publication number 20250203842
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL DEVICE STRUCTURES AND METHODS OF FORMING THE...
- Publication number 20250203892
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Po LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITORS INTEGRATED WITH VIA STRUCTURES
- Publication number 20250201670
- Publication date Jun 19, 2025
- Intel Corporation
- Denzil S. Frost
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH NOISE REDUCING CAPACITOR AND METHOD OF MANU...
- Publication number 20250201696
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ko Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE COMPONENT, AND MANUFACTURING METHOD FOR INTEGRAT...
- Publication number 20250201688
- Publication date Jun 19, 2025
- Murata Manufacturing Co., Ltd.
- Jyou KIKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL DEVICE CAPACITANCE ENHANCEMENT
- Publication number 20250194120
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lu-Sheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE
- Publication number 20250191983
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- IN-JAE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER LAYER IN TOP ELECTRODE TO INCREASE BREAK DOWN VOL...
- Publication number 20250194121
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250192025
- Publication date Jun 12, 2025
- RENESAS ELECTRONICS CORPORATION
- Yuki SUGIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH MIM CAPACITOR AND FABRICATING METHOD OF THE SAME
- Publication number 20250194118
- Publication date Jun 12, 2025
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDALONE HIGH VOLTAGE GALVANIC ISOLATION CAPACITORS
- Publication number 20250194119
- Publication date Jun 12, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Thomas Dyer Bonifield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING METAL WIRE PAIRS
- Publication number 20250192024
- Publication date Jun 12, 2025
- ADVANCED MICRO DEVICES, INC.
- Douglas Stirrett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Insulator-Metal Structure
- Publication number 20250192026
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE ISOLATION DEVICE
- Publication number 20250183152
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Kozaburo Sakai
- H01 - BASIC ELECTRIC ELEMENTS

Capacitor integral with wiring layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structures and methods of forming the same

MIM structure

Semiconductor structure and manufacturing method thereof

Capacitor and etching method

Deep trench capacitor structure and method for forming the same

Redistribution layer features

Semiconductor structure and method for fabricating same

Semiconductor structure and manufacturing method thereof

Co-integrated vertically structured capacitive element and fabricat...

Manufacturing method of a nanowire-based structure and capacitor ar...

Semiconductor device

High voltage passive device structure

Decoupling capacitors with back side power rails

Semiconductor device and manufacturing method thereof

Metal-insulator-metal device with improved performance

Integrated circuit

Dual-mode wireless charging device

Passivation layers with rounded corners

Metal-insulator-metal capacitor within metallization structure

Semiconductor die package and methods of formation

Metal-insulator-metal (MIM) capacitor module with outer electrode e...

Semiconductor device with integrated metal-insulator-metal capacitors

Capacitor structure

Structure and method for forming integrated high density MIM capacitor

Integrated voltage regulator and passive components

Integrated circuit and manufacturing method thereof

Semiconductor device manufacturing method

Top hat structure for isolation capacitors

Memory device having capacitor structure and method of forming the...

Semiconductor device with decoupling unit

Patents Applicationslast 30 patents

PACKAGE SUBSTRATE WITH EMBEDDED CAPACITOR PACKAGE HAVING REDISTRIBU...

SEMICONDUCTOR DEVICE HAVING CAPACITOR ARCHITECTURE USING CHIPPING D...

INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED POWER MANAGEMENT INTE...

MEMORY DEVICE, METHOD OF MANUFACTURING, AND INTEGRATED CIRCUIT DEVICE

INTEGRATED CAPACITOR SHEET, INTERPOSER, AND SEMICONDUCTOR ELEMENT

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

STRUCTURE AND METHOD FOR FORMING INTEGRATED HIGH DENSITY MIM CAPACITOR

EMBEDDED DEEP TRENCH CAPACITORS IN INTEGRATED CIRCUIT DEVICE PACKAG...

TRENCH CAPACITOR IN INTERCONNECT REGION

SEMICONDUCTOR CIRCUIT WITH SELECTIVE BACKSIDE POWER AND GROUND DIST...

INTERCONNECT STRUCTURE WITH CAPACITOR AND METHODS FOR MAKING

INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF

PASSIVATION BOUNDARY DEFECTS FOR REDUCED LEAKAGE CURRENT CAPACITOR...

FERROELECTRIC MEMORY, THREE-DIMENSIONAL INTEGRATED CIRCUIT, AND ELE...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

STACKED TRENCH CAPACITORS AND METHODS OF MAKING THEREOF

MEMORY DEVICE HAVING CAPACITOR STRUCTURE AND METHOD OF FORMING THE...

METAL-INSULATOR-METAL DEVICE STRUCTURES AND METHODS OF FORMING THE...

CAPACITORS INTEGRATED WITH VIA STRUCTURES

INTEGRATED CIRCUIT WITH NOISE REDUCING CAPACITOR AND METHOD OF MANU...

INTEGRATED PASSIVE COMPONENT, AND MANUFACTURING METHOD FOR INTEGRAT...

METAL-INSULATOR-METAL DEVICE CAPACITANCE ENHANCEMENT

ELECTRONIC COMPONENT PACKAGE

DIFFUSION BARRIER LAYER IN TOP ELECTRODE TO INCREASE BREAK DOWN VOL...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INTERPOSER WITH MIM CAPACITOR AND FABRICATING METHOD OF THE SAME

STANDALONE HIGH VOLTAGE GALVANIC ISOLATION CAPACITORS

SEMICONDUCTOR DEVICES INCLUDING METAL WIRE PAIRS

Metal-Insulator-Metal Structure

HIGH VOLTAGE ISOLATION DEVICE