Ion implantation system having variable screen aperture and ion implantation method using the same

Abstract

An ion implantation system includes a source portion, a beam line portion, a target chamber having a platen, and a Faraday portion having a dose cup and a first variable screen aperture, wherein the platen is capable of moving in a second direction and supporting a semiconductor substrate, and the first variable screen aperture includes a first opening having a first adjustable width along a first direction.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features and advantages of the present invention will become more apparent to those of ordinary skill in the art by describing in detail exemplary embodiments thereof with reference to the attached drawings, in which:

FIG. 1 illustrates a schematic diagram of an ion implantation system according to an exemplary embodiment of the present invention;

FIG. 2 illustrates a top plan view of a target chamber of the ion implantation system illustrated in FIG. 1;

FIG. 3 illustrates a cross-sectional view of the target chamber illustrated in FIG. 2;

FIG. 4 illustrates a front elevation view of the target chamber illustrated in FIG. 2;

FIG. 5 illustrates a top plan view of a target chamber of an ion implantation according to another embodiment of the present invention;

FIG. 6 illustrates a cross-sectional view of the target chamber illustrated in FIG. 5;

FIG. 7 illustrates a front elevation view of the target chamber illustrated in FIG. 5;

FIG. 8 illustrates a top plan view of the target chamber of the ion implantation system illustrated in FIG. 1 during an ion implantation process according to an embodiment of the present invention;

FIGS. 9-10 illustrate top plan views of semiconductor substrates treated according to the method illustrated in FIG. 8;

FIG. 11 illustrates a top plan view of the target chamber of the ion implantation system illustrated in FIG. 1 during an ion implantation process according to another embodiment of the present invention;

FIG. 12 illustrates a top plan view of a semiconductor substrate treated according to the method illustrated in FIG. 11; and

FIGS. 13 and 14 illustrate top plan views of semiconductor substrates treated by the ion implantation system illustrated in FIG. 5.

Claims

1. An ion implantation system, comprising: a source portion;a beam line portion;a target chamber having a platen, the platen capable of moving in a second direction and of supporting a semiconductor substrate; anda Faraday portion having a dose cup and a first variable screen aperture, wherein the first variable screen aperture includes a first opening having a first adjustable width along a first direction.

2. The ion implantation system as claimed in claim 1, wherein the first variable screen aperture includes first and second screen members having the first opening therebetween, each of the first and second screen members is independently movable along the first direction.

3. The ion implantation system as claimed in claim 2, wherein the first variable screen aperture includes graphite.

4. The ion implantation system as claimed in claim 1, wherein the Faraday portion is disposed inside the target chamber.

5. The ion implantation system as claimed in claim 1, wherein the beam line portion includes an accelerator, a scanner, and a focusing unit.

6. The ion implantation system as claimed in claim 1, wherein the Faraday portion further comprises a second variable screen aperture having a second opening with a second adjustable width along the second direction.

7. The ion implantation system as claimed in claim 1, wherein the first direction is perpendicular to the second direction.

8. The ion implantation system as claimed in claim 7, wherein the second variable screen aperture includes third and fourth screen members having the second opening therebetween, each of the third and fourth screen members being independently movable along the second direction.

9. An ion implantation method, comprising: generating an ion beam;accelerating the ion beam toward a scanner;scanning the accelerated ion beam in a first direction;adjusting the scanned ion beam in the first direction by varying a first variable screen aperture in the first direction;implanting the adjusted ion beam into a semiconductor substrate attached to a platen; andmoving the platen in a second direction.

10. The ion implantation method as claimed in claim 9, wherein adjusting the scanned ion beam in the first direction includes setting a width and a position thereof with respect to the semiconductor substrate.

11. The ion implantation method as claimed in claim 10, wherein setting a width and a position of the ion beam includes independently moving first and second screen members of the first variable screen aperture along the first direction.

12. The ion implantation method as claimed in claim 11, wherein setting the width and the position of the ion beam further comprises positioning the first and second screen members to correspond to a half of the semiconductor substrate.

13. The ion implantation method as claimed in claim 11, wherein setting the width and the position of the ion beam further comprises positioning the first and second screen members to correspond to a column die of the semiconductor substrate.

14. The ion implantation method as claimed in claim 11, wherein setting the width and the position of the ion beam further comprises positioning the first and second screen members at a first speed and moving the platen at a second speed.

15. The ion implantation method as claimed in claim 9, further comprising adjusting the scanned ion beam in the second direction by varying a second variable screen aperture in the second direction.

16. The ion implantation method as claimed in claim 15, wherein adjusting the scanned ion beam in the second direction includes setting a height and a position thereof with respect to the semiconductor substrate.

17. The ion implantation method as claimed in claim 16, wherein setting a height and a position of the ion beam includes independently moving third and fourth screen members of the second variable screen aperture along the second direction.

18. The ion implantation method as claimed in claim 9, wherein the first direction is perpendicular to the second direction.