This application claims the priority benefit of Taiwan application serial no. 96118291, filed on May 23, 2007. The entirety the above-mentioned patent application is hereby incorporated by reference herein and made a part of specification.
1. Field of the Invention
The present invention generally relates to a light emitting diode (LED) package, in particular, to an LED package with a two-phase flow heat-conducting medium as a heat dissipation base.
2. Description of Related Art
As the luminous efficiency of light emitting diodes (LEDs) is increasingly improved, LEDs have replaced fluorescent lamps and incandescent lamps in some fields, for example, lamp sources of scanners requiring for quick response, backlight sources or front light sources of liquid crystal displays (LCDs), illumination for dashboards of automobiles, traffic lights, and common illumination devices. Compared with conventional lamps, the LEDs have absolute advantages, for example, small volume, long lifespan, low driving voltage/current, non-fragile, mercury free (no pollution), and good luminous efficiency (power saving). However, with the improvement of the luminous efficiency of LEDs, heat dissipation efficiency has become the major factor that influences the reliability of the LEDs.
Therefore, it is actually a major problem in need of solution how to improve the current package mode of LEDs to achieve better heat dissipation efficiency and longer service life.
Accordingly, the present invention is directed to an LED package for solving the problem of poor heat dissipation efficiency in prior art caused by the LED directly fixed on a printed circuit board (PCB).
The present invention provides an LED package, which includes a heat dissipation base, an electrical insulating layer, a circuit layer, and an LED chip. The electrical insulating layer is disposed on the heat dissipation base. The circuit layer is disposed on the electrical insulating layer. The circuit layer has a receiving hole extending and passing through the electrical insulating layer for exposing a portion of the heat dissipation base. The LED chip is disposed on the heat dissipation base exposed by the receiving hole and is electrically connected to the circuit layer.
In an embodiment of the present invention, the heat dissipation base includes a heat pipe, a heat column, or a vapor chamber.
In an embodiment of the present invention, the LED package further includes a plurality of cooling fins disposed at the bottom of the heat dissipation base.
In an embodiment of the present invention, the electrical insulating layer and the circuit layer are comprised of an electrical insulating layer and a circuit layer of a printed circuit board (PCB).
In an embodiment of the present invention, the electrical insulating layer is comprised of a polymer organic material, and the circuit layer is comprised of a metal coating layer, a metal sintered layer, or a metal foil.
In an embodiment of the present invention, the electrical insulating layer is comprised of a ceramic material, and the circuit layer is comprised of a metal coating layer, a metal sintered layer, or a metal foil.
In an embodiment of the present invention, the electrical insulating layer is comprised of a composite material of a polymer organic and a ceramic powder, and the circuit layer is comprised of a metal coating layer, a metal sintered layer, or a metal foil.
In an embodiment of the present invention, the LED package further includes an adhesive layer, and the LED chip is fixed on the heat dissipation base by the adhesive layer.
In an embodiment of the present invention, the LED package further includes a plurality of bonding wires connected between the LED chip and the circuit layer.
In an embodiment of the present invention, the LED package further includes a molding compound disposed on the heat dissipation base and encapsulating the LED chip and the bonding wires.
The LED package of the present invention directly disposes an LED chip on the heat dissipation base with a two-phase flow as the heat-conducting medium, for example, a heat pipe, a heat column, or a vapor chamber. Thus, the heat energy generated during the operation of the LED chip can be directly dissipated from the bottom of the heat dissipation base, so as to effectively solve the heat dissipation problem in the current LED packaging. Further, a plurality of cooling fins may be optionally disposed at the bottom of the heat dissipation base, so as to further improve the heat dissipation effect of the heat dissipation base.
In order to make the features and advantages of the present invention clearer and more understandable, the following embodiments are illustrated in detail with reference to the appended drawings.
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
Reference will now be made in detail to the present embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
The heat dissipation base 210 carries the LED chip 240. The present invention mainly utilizes a high heat-conducting device with two-phase flow as the heat-conducting medium, such as a heat pipe, a heat column, or a vapor chamber, so as to carry the LED chip 240. Thus, the heat energy generated by the LED chip 240 during operation can be directly carried away by the heat dissipation base 210, thereby improving the heat dissipation efficiency. In this embodiment, the heat dissipation base 210 is, for example, a flat heat pipe 210a.
The electrical insulating layer 220 is disposed on the heat dissipation base 210. The circuit layer 230 is disposed on the electrical insulating layer 220. The circuit layer 230 has a receiving hole H extending and passing through the electrical insulating layer 220 for exposing a portion of the heat dissipation base 210. In an embodiment of the present invention, the electrical insulating layer 220 and the circuit layer 230 are comprised of an insulting layer and a circuit layer of a PCB. Further, the electrical insulating layer 220 may also be comprised of a polymer organic material or a ceramic material, and the circuit layer 230 may be comprised of a metal coating layer, a metal sintered layer, or a metal foil. The materials of the electrical insulating layer 220 and the circuit layer 230 are not limited in the present invention.
The LED chip 240 is disposed on the heat dissipation base 210 exposed by the receiving hole H and is electrically connected to the circuit layer 230. In this embodiment, the LED package 200 further includes an adhesive layer 250, such that the LED chip 240 is fixed on the heat dissipation base 210 by the adhesive layer 250. However, in the present invention, the LED chip 240 may also be fixed on the heat dissipation base 210 by other means, which should not be limited thereby. Further, a plurality of bonding wires 260 may be formed between the LED chip 240 and the circuit layer 230 by a wire bonding technique, so as to electrically connect the LED chip 240 and the circuit layer 230. Further, in order to prevent damaging and humidity getting into the LED chip 240 and the bonding wires 260, a molding compound 270 may be optionally applied on the heat dissipation base 210. The molding compound 270 encapsulates the circuit layer 230 and covers the receiving hole H, particularly the LED chip 240 and the bonding wires 260, so as to prevent damaging and humidity getting therein.
In view of the above, the LED package of the present invention mainly includes directly disposing the LED chip on the heat dissipation base with a two-phase flow as the heat-conducting medium, for example, a heat pipe, a heat column, or a vapor chamber, such that the heat energy generated by the LED chip during operation can be directly discharged from the bottom of the heat dissipation base, so as to effectively solve the heat dissipation problem in the current LED packaging. Further, a plurality of cooling fins may be optionally disposed at the bottom of the heat dissipation base, so as to further improve the heat dissipation effect of the heat dissipation base.
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
Number | Date | Country | Kind |
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96118291 | May 2007 | TW | national |