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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/32245the item being metallic

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,327,812
- Issue date Jun 10, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for galvanic isolation for inverter for electri...
- Patent number 12,328,083
- Issue date Jun 10, 2025
- BorgWarner US Technologies LLC
- Srikanth Vijaykumar
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 12,327,808
- Issue date Jun 10, 2025
- Hitachi Power Semiconductor Device, Ltd.
- Naoki Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices employing thermal and mechanical enhanced layers and method...
- Patent number 12,327,819
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 12,322,683
- Issue date Jun 3, 2025
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Baffles for electronic circuits immersed in cooling fluid in a tank
- Patent number 12,322,676
- Issue date Jun 3, 2025
- Auradine, Inc.
- Anuya Reddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for data recorder for inverter for electric veh...
- Patent number 12,323,080
- Issue date Jun 3, 2025
- BorgWarner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,316,307
- Issue date May 27, 2025
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor element mounting package and optical semicond...
- Patent number 12,317,657
- Issue date May 27, 2025
- SHENZHEN JUFEI OPTOELECTRONICS CO., LTD.
- Naoyuki Urasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for an interlocking feature on a power module
- Patent number 12,316,257
- Issue date May 27, 2025
- BorgWarner US Technologies LLC
- Edward Choi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power substrate assembly with reduced warpage
- Patent number 12,308,338
- Issue date May 20, 2025
- Littelfuse, Inc.
- Tiburcio A. Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material
- Patent number 12,296,409
- Issue date May 13, 2025
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual cool power module with stress buffer layer
- Patent number 12,300,689
- Issue date May 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a packaged semiconductor device having enhanced w...
- Patent number 12,300,582
- Issue date May 13, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,288,739
- Issue date Apr 29, 2025
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,288,751
- Issue date Apr 29, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,284,791
- Issue date Apr 22, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Manufacturing method for compound semiconductor device
- Patent number 12,283,922
- Issue date Apr 22, 2025
- Fujitsu Limited
- Kozo Makiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of forming the same
- Patent number 12,283,537
- Issue date Apr 22, 2025
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 12,278,160
- Issue date Apr 15, 2025
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for parameter drift correction for inverter for...
- Patent number 12,279,402
- Issue date Apr 15, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Component and method for producing a component
- Patent number 12,278,318
- Issue date Apr 15, 2025
- Osram Opto Semiconductors GmbH
- Thomas Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe spacer for double-sided power module
- Patent number 12,278,158
- Issue date Apr 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tzu-Hsuan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive members atop semiconductor packages
- Patent number 12,272,626
- Issue date Apr 8, 2025
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal structure for semiconductor device and method of forming th...
- Patent number 12,272,613
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device with piezoelectric actuator
- Patent number 12,266,643
- Issue date Apr 1, 2025
- LG Display Co., Ltd.
- Jaeho Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,266,627
- Issue date Apr 1, 2025
- Mitsubishi Electric Corporation
- Shinji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,261,558
- Issue date Mar 25, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method for manufacturing leadless semiconductor package with wettab...
- Patent number 12,255,076
- Issue date Mar 18, 2025
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,255,127
- Issue date Mar 18, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidekazu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ISOLATOR
- Publication number 20250194115
- Publication date Jun 12, 2025
- Kabushiki Kaisha Toshiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER MODULE PACKAGE STRUCTURES
- Publication number 20250192097
- Publication date Jun 12, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING ROUNDED COMPONENTS AND RELATED MANU...
- Publication number 20250192005
- Publication date Jun 12, 2025
- INFINEON TECHNOLOGIES AG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR PRODUCING THE SAME
- Publication number 20250191916
- Publication date Jun 12, 2025
- Mitsubishi Electric Corporation
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICES WITH SIDEWALL RECESSES
- Publication number 20250192090
- Publication date Jun 12, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250183217
- Publication date Jun 5, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER
- Publication number 20250183113
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Kang Gyune Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURIN...
- Publication number 20250183131
- Publication date Jun 5, 2025
- RENESAS ELECTRONICS CORPORATION
- Toshiyuki HATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250183110
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250183126
- Publication date Jun 5, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Hidekazu NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183147
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Hongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A LEADFRAME WITH A METAL-PLATED BOND AREA
- Publication number 20250183221
- Publication date Jun 5, 2025
- Infineon Technologies Austria AG
- Yi Ting Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20250183816
- Publication date Jun 5, 2025
- Mitsubishi Electric Corporation
- Tatsuya FUKASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING EMBEDDED DIE AND METHOD THEREFOR
- Publication number 20250174507
- Publication date May 29, 2025
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT RADIATION STRUCTURE, COOLING S...
- Publication number 20250174521
- Publication date May 29, 2025
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250174505
- Publication date May 29, 2025
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
- Publication number 20250174530
- Publication date May 29, 2025
- DAI NIPPON PRINTING CO., LTD.
- Masahiro NAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR SWITCHING MODULE
- Publication number 20250174514
- Publication date May 29, 2025
- NexFi Technology Inc.
- Satoshi TANIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE
- Publication number 20250174606
- Publication date May 29, 2025
- Nichia Corporation.
- Yoshiyuki KAGEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250174593
- Publication date May 29, 2025
- Kabushiki Kaisha Toshiba
- Satoshi HATTORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250167134
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Huishu MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250167063
- Publication date May 22, 2025
- Mitsubishi Electric Corporation
- Takeshi TOKOROZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULES
- Publication number 20250167066
- Publication date May 22, 2025
- Hyundai Motor Company
- Nam Sik KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIDIE FLIP CHIP PACKAGE WITH HEAT SINK
- Publication number 20250167067
- Publication date May 22, 2025
- STMicroelectronics International N.V.
- Jefferson Sismundo TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
- Publication number 20250167080
- Publication date May 22, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...
- Publication number 20250167065
- Publication date May 22, 2025
- SK HYNIX INC.
- Jun Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157892
- Publication date May 15, 2025
- Fuji Electric Co., Ltd.
- Takahiro KOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250157899
- Publication date May 15, 2025
- Vanguard International Semiconductor Corporation
- Hsiu-Mei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY PROTECTION PACKAGE HAVING CO-PACKED TRANSISTORS AND INTEGRA...
- Publication number 20250157894
- Publication date May 15, 2025
- Alpha and Omega Semiconductor International LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT AND METHOD OF MANUFACTURING A COMPONENT USING AN ULTRATHI...
- Publication number 20250157857
- Publication date May 15, 2025
- INFINEON TECHNOLOGIES AG
- Karl Mayer
- H01 - BASIC ELECTRIC ELEMENTS

the item being metallic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and manufacturing method thereof

Systems and methods for galvanic isolation for inverter for electri...

Semiconductor device

Devices employing thermal and mechanical enhanced layers and method...

Power module semiconductor device and inverter equipment, and fabri...

Baffles for electronic circuits immersed in cooling fluid in a tank

Systems and methods for data recorder for inverter for electric veh...

Switching device and electronic circuit

Optical semiconductor element mounting package and optical semicond...

Systems and methods for an interlocking feature on a power module

Power substrate assembly with reduced warpage

Solder material

Dual cool power module with stress buffer layer

Method of forming a packaged semiconductor device having enhanced w...

Semiconductor device and method for manufacturing the same

Microelectronic assemblies

Systems and methods for cooling system and power module for inverte...

Manufacturing method for compound semiconductor device

Electronic package and method of forming the same

Methods and heat distribution devices for thermal management of chi...

Systems and methods for parameter drift correction for inverter for...

Component and method for producing a component

Leadframe spacer for double-sided power module

Conductive members atop semiconductor packages

Thermal structure for semiconductor device and method of forming th...

Display device with piezoelectric actuator

Semiconductor device and method for manufacturing the same

Systems and methods for cooling system and power module for inverte...

Method for manufacturing leadless semiconductor package with wettab...

Semiconductor device and method for manufacturing the same

Patents Applicationslast 30 patents

ISOLATOR

HIGH POWER MODULE PACKAGE STRUCTURES

SEMICONDUCTOR DEVICES INCLUDING ROUNDED COMPONENTS AND RELATED MANU...

SEMICONDUCTOR APPARATUS AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR DEVICES WITH SIDEWALL RECESSES

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURIN...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE HAVING A LEADFRAME WITH A METAL-PLATED BOND AREA

POWER CONVERSION DEVICE

SEMICONDUCTOR DEVICE HAVING EMBEDDED DIE AND METHOD THEREFOR

SEMICONDUCTOR PACKAGE INCLUDING HEAT RADIATION STRUCTURE, COOLING S...

SEMICONDUCTOR DEVICE

LEAD FRAME AND MANUFACTURING METHOD THEREOF

POWER SEMICONDUCTOR SWITCHING MODULE

LIGHT-EMITTING DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

POWER MODULES

MULTIDIE FLIP CHIP PACKAGE WITH HEAT SINK

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

BATTERY PROTECTION PACKAGE HAVING CO-PACKED TRANSISTORS AND INTEGRA...

COMPONENT AND METHOD OF MANUFACTURING A COMPONENT USING AN ULTRATHI...