Light source and liquid crystal display device using the same

Abstract

A widely applicable and low cost module substrate with a high accuracy, reliability and heat-radiation structure. A light source includes: a heat radiation substrate; an insulating layer formed in some regions in an upper surface of the substrate; a wiring layer having wiring patterns, the wiring layer being arranged on the insulating layer; and a plurality of LED elements connected to the wiring layer. Moreover, the light source includes: a heat radiation substrate; an insulating layer arranged in some regions in an upper surface of the substrate; a wiring layer having wiring patterns, the wiring layer being arranged on the insulating layer; and LED elements connected to the wiring layer, wherein the insulating layer has two layers of a resin layer arranged in the wiring layer side and an adhesive layer arranged in the heat radiation substrate side.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an embodiment of the present invention and shows a top view.

FIG. 2 shows a cross sectional view along the A-A line of FIG. 1.

FIG. 3 shows a top view of a light source carrier 6.

FIG. 4 shows a cross sectional view along the B-B line of FIG. 3.

FIG. 5A-a shows a cross sectional view of a manufacturing process 1 of a light source carrier 6 and a light source module substrate 8.

FIG. 5A-b shows a top view of the manufacturing process 1 of the light source carrier 6 and the light source module substrate 8.

FIG. 5B-a shows a cross sectional view of a manufacturing process 2 of the light source carrier 6 and the light source module substrate 8.

FIG. 5B-b shows a top view of the manufacturing process 2 of the light source carrier 6 and the light source module substrate 8.

FIG. 5C-a shows a cross sectional view of a manufacturing process 3 of the light source carrier 6 and the light source module substrate 8.

FIG. 5C-b shows a top view of the manufacturing process 3 of the light source carrier 6 and the light source module substrate 8.

FIG. 5D-a shows a cross sectional view of a manufacturing process 4 of the light source carrier 6 and the light source module substrate 8.

FIG. 5D-b shows a top view of the manufacturing process 4 of the light source carrier 6 and the light source module substrate 8.

FIG. 5E-a shows a cross sectional view of a manufacturing process 5 of the light source carrier 6 and the light source module substrate 8.

FIG. 5E-b shows a top view of the manufacturing process 5 of the light source carrier 6 and the light source module substrate 8.

FIG. 5F-a shows a cross sectional view of a manufacturing process 6 of the light source carrier 6 and the light source module substrate 8.

FIG. 5F-b shows a top view of the manufacturing process 6 of the light source carrier 6 and the light source module substrate 8.

FIG. 6 is an embodiment of the present invention and shows a cross sectional view of a modified example of FIG. 2.

FIG. 7 is another modified example of FIG. 2 and shows a cross sectional view.

FIG. 8 is another modified example of FIG. 2 and shows a cross sectional view.

FIG. 9 is another modified example of FIG. 2 and shows a cross sectional view.

FIG. 10 is an embodiment of the present invention and shows a cross sectional view of a modified example of FIG. 4.

FIG. 11A-a shows a cross sectional view of a manufacturing process 1 of a light source carrier 44 for providing FIG. 10 and a light source module substrate 47 using the same.

FIG. 11A-b shows a top view of the manufacturing process 1 of the light source carrier 44 for providing FIG. 10 and the light source module substrate 47 using the same.

FIG. 11B-a shows a cross sectional view of a manufacturing process 2 of the light source carrier 44 for providing FIG. 10 and the light source module substrate 47 using the same.

FIG. 11B-b shows a top view of the manufacturing process 2 of the light source carrier 44 for providing FIG. 10 and the light source module substrate 47 using the same.

FIG. 11C-a shows a cross sectional view of a manufacturing process 3 of the light source carrier 44 for providing FIG. 10 and the light source module substrate 47 using the same.

FIG. 11C-b shows a top view of the manufacturing process 3 of the light source carrier 44 for providing FIG. 10 and the light source module substrate 47 using the same.

FIG. 11D-a shows a cross sectional view of a manufacturing process 4 of the light source carrier 44 for providing FIG. 10 and the light source module substrate 47 using the same.

FIG. 11D-b shows a top view of the manufacturing process 4 of the light source carrier 44 for providing FIG. 10 and the light source module substrate 47 using the same.

FIG. 11E-a shows a cross sectional view of a manufacturing process 5 of the light source carrier 44 for providing FIG. 10 and the light source module substrate 47 using the same.

FIG. 11E-b shows a top view of the manufacturing process 5 of the light source carrier 44 for providing FIG. 10 and the light source module substrate 47 using the same.

FIG. 11F-a shows a cross sectional view of a manufacturing process 6 of the light source carrier 44 for providing FIG. 10 and the light source module substrate 47 using the same.

FIG. 11F-b shows a top view of the manufacturing process 6 of the light source carrier 44 for providing FIG. 10 and the light source module substrate 47 using the same.

Claims

1. A light source comprising: a heat radiation substrate;an insulating layer formed in some regions in an upper surface of the heat radiation substrate;a wiring layer in which a plurality of wiring patterns are formed, the wiring layer being arranged on the insulating layer; anda plurality of LED elements connected to the wiring layer.

2. The light source according to claim 1, wherein the insulating layer is a thermosetting resin layer.

3. The light source according to claim 1, wherein the insulating layer is separately formed in two or more regions in the upper surface of the heat radiation substrate.

4. The light source according to claim 1, wherein the insulating layer is formed in the upper surface of the heat radiation substrate along a wiring pattern of the wiring layer.

5. The light source according to claim 1, wherein the insulating layer is formed in a tape form along the wiring pattern of the wiring layer, and wherein a plurality of the insulating layers of a tape form are formed in a part of the upper surface of the heat radiation substrate.

6. The light source according to claim 1, wherein the wiring layer and the heat radiation substrate are adheres to the insulating layer, respectively, under different heat-curing conditions.

7. The light source according to claim 1, further comprising: a first heat-curing step of adhering the wiring layer to the insulating layer; anda second heat-curing step of adhering the heat radiation substrate to the insulating layer.

8. The light source according to claim 7, wherein the first heat-curing step is a step of heating the insulating layer from the wiring layer side and cooling from the heat radiation substrate side.

9. The light source according to claim 1, wherein a radiation fin is disposed in the opposite side surface of the upper surface of the heat radiation substrate.

10. The light source according to claim 1, wherein the heat radiation substrate has regions of different substrate thicknesses, wherein the insulating layer is formed in a region of the same substrate thickness in the upper surface of the heat radiation substrate.

11. The light source according to claim 1, wherein the heat radiation substrate has a heat pipe inside the substrate.

12. The light source according to claim 11, wherein the heat pipe is provided corresponding to a region in which the insulating layer is formed.

13. A light source, comprising: a heat radiation substrate;an insulating layer arranged in some regions in an upper surface of the heat radiation substrate;a wiring layer in which a plurality of wiring patterns are formed, the wiring layer being arranged on the insulating layer; anda plurality of LED elements connected to the wiring layer, whereinthe insulating layer is composed of two layers of a resin layer arranged in the wiring layer side and an adhesive layer arranged in the heat radiation substrate side.

14. The light source according to claim 13, wherein the resin layer is made of a thermosetting epoxy resin, andthe adhesive layer is made of an acrylic pressure sensitive adhesive.

15. A liquid crystal display device, comprising: a liquid crystal display panel comprising a pair of substrates, a pair of polarizing plates, and a liquid crystal layer sandwiched by the pair of substrates; andthe light source according to claim 1 for providing light to the liquid crystal display panel.

16. A liquid crystal display device, comprising: a liquid crystal display panel comprising a pair of substrates, a pair of polarizing plates, and a liquid crystal layer sandwiched by the pair of substrates; andthe light source according to claim 13 for providing light to the liquid crystal display panel.

17. A method of manufacturing a light source, comprising: a first heat-curing step of adhering an insulating layer to a metal foil layer;a step of forming a wiring layer by processing the metal foil layer;a second heat-curing step for adhering the insulating layer to a heat radiation substrate; anda step of mounting an LED chip on the wiring layer, whereinthe first heat-curing step is a step of heating the insulating layer from the wiring layer side and cooling from the heat radiation substrate side.