BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is an explanatory drawing of a magnetic disk apparatus in which a magnetic head of the present invention is used;
FIG. 2 is a cross sectional view showing an embodiment of the magnetic head according to the present invention;
FIG. 3 is an explanatory drawing of a protruding state caused by thermal expansion when power is distributed to heater coil;
FIG. 4 is a perspective view showing the present embodiment without insulating layer;
FIG. 5 is a cross sectional view showing FIG. 4 cut at the center position;
FIG. 6 is a perspective view showing disposition of the heater coil with the write coil of FIG. 4 removed;
FIG. 7 is a cross sectional view showing another embodiment of the magnetic head according to the present invention wherein merely the low thermal conducting layer is disposed;
FIG. 8 is a cross sectional view showing a magnetic head of a basic shape not having the low thermal conducting layer and the low thermal expansion layer as a comparative example;
FIG. 9 is an explanatory drawing showing protruding positions of the present embodiment with respect to the position of the medium facing surface in a high-temperature power-distributed state in comparison with a comparative example;
FIG. 10 is an explanatory drawing showing protruding positions of the present embodiment when the heater coil is fed with power and heated in the high-temperature power-distributed state of FIG. 9 in comparison with a comparative example;
FIG. 11 is an explanatory drawing in which a piezoelectric sensor structure using aluminium nitride in the low thermal expansion layer is disposed and used as a collision sensor;
FIG. 12 is a cross sectional view of another embodiment according to the present invention in which a low young's modulus layer is disposed;
FIG. 13 is an explanatory drawing of a protruding state caused by thermal expansion when power is distributed to the heater coil of the embodiment of FIG. 12;
FIG. 14 is a cross sectional view of another embodiment according to the present invention wherein a low thermal expansion layer is disposed subsequent to the low young's modulus layer;
FIG. 15 is an explanatory drawing showing protruding positions of the embodiments of FIG. 12 and FIG. 14 with respect to the position of the medium facing surface in a high-temperature power-distributed state in comparison with a comparative example; and
FIG. 16 is an explanatory drawing showing protruding positions of the embodiments of FIG. 12 and FIG. 14 when the heater coil is fed with power and heated in a high-temperature power-distributed state of FIG. 14 in comparison with a comparative example.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
FIG. 1 is an explanatory drawing of a magnetic disk apparatus in which a magnetic head of the present invention is used. In FIG. 1, in the magnetic disk apparatus 10, the internal structure of a chassis base 12 from which a chassis cover is removed is shown. In the chassis base 12, a magnetic disk 14 which is rotated by a spindle motor at a constant speed is provided, and, for the magnetic disk 14, a rotary actuator 16 is rotatably disposed by a shaft unit 15. The rotary actuator 16 supports the magnetic head according to the present invention by the distal end thereof, and a coil 22 is disposed in a rear part thereof. The coil 22 is rotatable along a magnet 26 on a lower yoke 24 which is fixed to the chassis base 12 side. Although an upper yoke which is not shown and has the same shape as the lower yoke 24 is disposed above the coil 22, the state in which the upper yoke is removed is shown in the present embodiment. A magnetic circuit unit is formed by the lower yoke 24, the magnet 26, and the upper yoke (not shown). When the coil 22 is disposed in the magnetic circuit unit, a voice coil motor which drives the rotary actuator 16 is formed. In the state shown in the drawing, the rotary actuator 16 is in a latched state wherein the magnetic head 18 is put aside from the magnetic disk 14 to a ramp load mechanism 20.
FIG. 2 is a cross sectional view showing an embodiment of the magnetic head according to the present invention. In FIG. 2, the magnetic head 18 of the present embodiment is provided in the distal end side of a slider, and a read head 36 and a write head 38 are sequentially disposed subsequent to a substrate 34. The magnetic head 18 has a medium facing surface 40 which faces a medium surface of the magnetic disk 14, and the medium facing surface 40 constitutes a part of an air bearing which floats when receiving an air flow generated by the movement of the magnetic disk 14 in a disk rotation direction 32 shown by an arrow. In the read head 36 provided in the substrate 34 side, shield layers 42 and 44 are formed in an insulating layer 45 using aluminium oxide Al2O3 which is known as alumina, a read element 46 is disposed at a position between the shield layer 42 and 44 which serves as a read gap of the medium facing surface 40, and a GMR element (Giant Magneto Resistance) or a TMR element (Tunneling Magneto Resistance) is used as the read element 46. Subsequent to the read head 36, the write head 38 is provided. The write head 38 has a magnetic pole unit 48, and the magnetic pole unit 48 has an inner magnetic pole 50 in the read head 36 side and an outer magnetic pole 52 in the distal end side. As the magnetic pole unit 48, Permalloy or an iron-cobalt-alloy-based magnetic material is used. The outer magnetic pole 52 is positioned in the medium facing surface 40 side, protrudes toward the front, and forms a write gap 56 between the outer magnetic pole 52 and the inner magnetic pole 50 at the part of the medium facing surface 40. A coil through unit is formed below the connecting part of the inner magnetic pole 50 and the outer magnetic pole 52, and a write coil 54 is spirally disposed around the connecting part of the inner magnetic pole 50 and the outer magnetic pole 52. The write coil 54 of the present embodiment has a double-wound structure. The write coil 54 generates magnetic flux for recording by causing a write current to flow therethrough. The magnetic flux is released to the magnetic disk 14 side from the write gap 56 and magnetically records information on the magnetic disk 14. Furthermore, in the magnetic head 18 of the present embodiment, when viewed from the write coil 54 in the write head 38, a heater coil 60 is disposed in the inner magnetic pole 50 side. The heater coil 60 is formed of a high-resistance heating material such as tungsten (W) or titanium tungsten (TiW). When heat is generated by distributing electric power to the heater coil 60, the heat is transmitted to the write coil 54 which is facing the coil via the insulating layer 45, and the write coil 54 is caused to thermally expand, thereby causing the part of the medium facing surface 40 including the read element 46 and the write gap 56 which functions as a write element to protrude toward the magnetic disk 14 side. In addition to such basic shape in the magnetic head 18, in the present embodiment, a low thermal conducting layer 62 is disposed subsequent to the shield layer 42 in the read head 36, and a low thermal expansion layer 64 is further disposed subsequent to the low thermal conducting layer 62. The heat generated by electric power distribution to and heating of the heater coil 60 is transmitted to the substrate 34 side and then conducted and dissipated toward the medium facing surface 40; therefore, the low thermal conducting layer 62 is disposed behind the shield layer 42 so as to block the transmission path of the heat from the heater coil 60 and suppresses transmission of the heat to the substrate 34 side. As a forming material of the low thermal conducting layer 62 which suppresses transmission of the heat in this manner, a material having a low thermal expansion coefficient such as silicon oxide SiO2 or a resin material is used. The low thermal conducting layer 62 of the present embodiment has a thermal conductivity of 0.1 W/m to 1.5 W/m. The low thermal expansion layer 64 which is formed subsequent to the low thermal conducting layer 62 contains any one of silicon carbide SiC, silicon nitride Si3N4, silicon oxide SiO2, aluminium nitride AlN, tungsten (W), molybdenum (M), and an invar material. In the present embodiment, the thermal expansion coefficient of the low thermal expansion layer 64 is 0.0/K to 7.5E-6/K (=0.0/K to 7.5×10−6 K). The low thermal expansion layer 64 functions as a fixed layer in terms of thermal expansion coefficient even when it receives transmission of heat and heated by the heater coil 60 since it has a low thermal expansion coefficient. When the low thermal expansion layer 64 which functions as a fixed layer is positioned in the substrate 34 side, it acts to suppress protrusion of the medium facing surface 40 caused by thermal expansion of the part in the distal end side having a high thermal expansion coefficient including the read head 36 and the write head 38. In other words, the low thermal conducting layer 62 suppresses transmission of the heat generated by heating of and electric power distribution to the heater coil 60 to the substrate 34 side, and seals the heat in the write coil 54 side which determines the protruding distance of the medium facing surface 40, thereby performing an action of increasing the heater efficiency wherein the protruding distance can be increased by a little amount of the electric power of the heater coil 60. Meanwhile, the low thermal expansion layer 64 acts as a fixed unit when receiving the heat generated by heating of and electric power distribution to the heater coil 60 since the thermal expansion thereof is small, and suppresses the protruding distance of the medium facing surface 40 in the side of the read head 36 and the write head 38; therefore, the low thermal expansion layer 64 acts in the direction wherein the heater efficiency is lowered. However, the low thermal expansion layer 64 performs an action of suppressing protrusion of the medium facing surface 40 caused by heat generation when the electric power of the write coil 54 is large in a high-temperature state, thereby performing an action of suppressing the designed value of the clearance for avoiding collision due to irregularities of the magnetic disk 14 of the magnetic head 18 to a requisite minimum. More specifically, in the design stage of the magnetic head 18, with respect to the upper-limit temperature, for example 60° C., of usage temperature range of the magnetic disk apparatus, the temperature of the magnetic head 18 in the chassis is in a high temperature state of 70° C. which is higher than that by 10° C. In this high temperature state, worst conditions under which a AC current is caused to flow through the write coil 54 are set. From the protruding distance of the medium facing surface 40 under the worst conditions, the designed value of the clearance having a value at which collision does not occur in the clearance between the surface and the magnetic disk 14 is determined. However, in the present embodiment, as a result of disposing the low thermal conducting layer 62, the heater efficiency, i.e., the degree of the protruding distance with respect to heat in the side of the read head 36 and the write head 38 is increased; and, when the worst conditions in which recording power is the maximum at a high temperature are set, since diffusion of heat is suppressed by the low thermal conducting layer 62, the medium facing surface 40 in the side of the read head 36 and the write head 38 largely protrude. Therefore, a large designed value of the clearance has to be set in consideration of the protruding distance of the medium facing surface 40 under the worst conditions. However, when a large clearance designed value is set, the protruding distance in the case in which the medium facing surface 40 is caused to protrude by electric power distribution to and heating of the heater coil 60 in a normal usage state has to be also increased along with the increase in the clearance designed value. As a result, the electric power which flows through the heater coil 60 is increased, and the magnetic head 18 is locally caused to be at a high temperature, thereby causing bad influence on migration of the heater coil 60, the read element 46 of the read head 36, or the write gap 56 which functions as a write element in the write head 38. Therefore, in the present embodiment, as a result of disposing the low thermal expansion layer 64 subsequent to the low thermal conducting layer 62, the thermal expansion coefficient is reduced, the protruding distance of the medium facing surface 40 under the worst conditions in which the temperature is high and the recording power is large is suppressed by the presence of the low thermal expansion layer 64. Thus, increasing the clearance designed value can be avoided, and the heater efficiency can be enhanced as a result. In the present embodiment, the low thermal conducting layer 62 has a thickness of about, for example, 0.5 μm to 4.0 μm, and the low thermal expansion layer 64 has a thickness of, for example, 0.5 μm to 4.0 μm.
FIG. 3 is an explanatory drawing of a protruding state caused by thermal expansion when electric power is distributed to the heater coil 60. In FIG. 3, when electric power is distributed to the heater coil 60, the heat caused by heating of the heater coil 60 is transmitted to the write coil 54, and the write coil 54 is heated and expanded. The transmission of the heat transmitted from the heater coil 60 to the substrate 34 side via the shield layers 44 and 42 is suppressed by the low heat conducting layer 62, and the heat generated by the heater coil 60 is sealed in a head region in the distal end side when viewed from the low thermal conducting layer 62. As a result, the medium facing surface 40 of the magnetic head 18 forms a protruding unit 66 which protrudes toward the magnetic disk 14 side centrally from a write gap position 70 facing the write coil 54, a read gap position 68 where the read element 46 is disposed is similarly protruded, and the clearances from the write gap 56 and the read element 46 to the magnetic disk 14 can be controlled by the protruding distance of the protruding unit 66.
FIG. 4 is a perspective view showing an internal structure of the magnetic head 18 of the present embodiment, wherein the insulating layer is removed. In FIG. 4, in the front side of the substrate 34, the inner magnetic pole 50 which constitutes the magnetic pole unit of the write head 38 is disposed via the read head 36 composed of the two shield layers 42 and 44, and the outer magnetic pole 52 is disposed in the part which protrudes toward the front from the inner magnetic pole 50. The outer magnetic pole 52 forms a distal end unit 55 in the medium facing surface for the magnetic disk, and the width of the distal end unit 55 determines the recording width in the magnetic disk. The write coil 54 is formed to be spirally double-wound between the outer magnetic pole 52 and the inner magnetic pole 50. More specifically, the write coil 54 is led in from a front upper right part, spirally wound at the outer magnetic pole 52, then bent at the center to the side of the substrate 34, spirally wound in the same direction, and then led out to the right side. In addition to such basic shape of the magnetic head 18, a low thermal conducting layer 62 is disposed subsequent to the shield layer 42 in the substrate side of the read head 36, thereby suppressing transmission of the heat caused by electric power distribution to and heating of the heater coil 60 to the substrate 34 side. Subsequent to the low thermal conducting layer 62, the low thermal expansion layer 64 is provided, functions as a fixed side since thermal expansion is low, and suppresses protrusion of the medium facing surface in the side of the read head 36 and the write head 38 under the worst conditions in which the temperature is high and the recording power is the maximum.
FIG. 5 is a cross sectional view showing FIG. 4 cut at a center position. As is clear from the cross sectional view of FIG. 5, it can be understood that the write coil 54 is disposed so that it is spirally double wound around the connecting unit which connects the outer magnetic pole 52 with the inner magnetic pole 50. In addition, the write gap 56 is formed inside the distal end unit 55 of the outer magnetic pole 52. Furthermore, the read element 46 is disposed between the shield layers 42 and 44 which are in the substrate 34 side, thereby forming the read head 36. Furthermore, in the basic shape of the magnetic head 18 composed of the read head 36 and the write head 38, the low thermal conducting layer 62 and the low thermal expansion layer 64 are stacked and disposed.
FIG. 6 is an explanatory drawing showing the internal structure without the write coil 54 of FIG. 4. When the write coil 54 is removed, the heater coil 60 is disposed behind it. The heater coil 60 forms a coil pattern having a certain width at a position facing the write coil 54 shown in FIG. 4, and terminal patterns having wide widths are connected to and led from both ends of the coil pattern.
FIG. 7 is a cross sectional view showing another embodiment of the magnetic head according to the present embodiment in which merely the low thermal conducting layer is disposed in the basic shape of the magnetic head. In the embodiment of FIG. 7, the configuration of the read head 36 and the write head 38 disposed in the distal end side of the substrate 34 is same as the embodiment of FIG. 2, the heater coil 60 is similarly disposed in the substrate 34 side of the write coil 54, and the medium facing surface 40 is arranged such that it can be protruded to toward the magnetic disk 14 side by electric power distribution to and heating of the heater coil 60. Subsequent to the shield layer 42 in the substrate 34 side of the read head 36, merely the low thermal conducting layer 62 is disposed. Therefore, the embodiment of FIG. 7 in which merely the low thermal conducting layer 62 is disposed in the basic shape can be referred to as an embodiment which is mainly intended to improve the heater efficiency which increases the protruding distance of the medium facing surface 40 with a small electric power amount of the heater coil 60.
FIG. 8 is a cross sectional view showing, as a comparative example, a magnetic head of the basic shape not having the low thermal conducting layer and the low thermal expansion layer. In this magnetic head 18-2 of FIG. 8 shown as a comparative example, the read head 36 and the write head 38 are provided subsequent to the substrate 34, and this structure is same as the embodiment of FIG. 2.
FIG. 9 is an explanatory drawing showing, in comparison with a comparative example, measurement results of protruding positions in the present embodiment in the high-temperature electric-power-distributed state which is the worst conditions. When the usage temperature range of the magnetic disk apparatus is, for example, 0° C. to 60° C., the temperature of the magnetic head is 10° C. to 70° C. which is higher than that by about 10° C.; therefore, the high-temperature electric-power-distributed state in FIG. 9 is the state in which the highest environmental temperature of the magnetic head is 70° C., and a AC current which provides maximum power as a recording current which flows through the write coil is caused to flow therethrough; and, the measurement results are those at the protruding positions when electric power is not distributed to the heater coil. In FIG. 9, the horizontal axis represents positions of the medium facing surface 40 of the magnetic head; wherein the read gap position 68 is assumed to be 0 μm, the distal end side in which the write gap position 70 of the write head is positioned is shown as positive, and the substrate side is shown as negative. Also, the vertical axis represents protruding positions, wherein positions of the medium facing surface in a room-temperature state is assumed to be 0 nm, and protruding positions in the high-temperature electric-power-distributed state are shown. A protruding position profile 72 is that of the case in which the low thermal conducting layer 62 and the low thermal expansion layer 64 shown in FIG. 2 are disposed. In negative positions in the substrate side the protruding distances are 1 nm or less which are very small. However, the protruding distance is rapidly increased when the position approaches the read gap position 68, the distance is increased to near 4.0 nm as a peak protruding distance before the write gap position 70, the protruding position is then lowered toward the head distal end side in the positive side, and a protruding distance of about 3.5 nm is obtained at the write gap position 70. A protruding position profile 74 shown by a chain line is that of the case of the embodiment in which merely the low thermal conducting layer 62 shown in FIG. 7 is provided, and the low thermal expansion layer is not. In this case, as a result of providing the low thermal conducting layer 62, diffusion of heat to the substrate side is suppressed, and the heat is sealed in the distal end side. As a result, the peak protruding distance is increased to 4.6 nm, wherein the ratio of the protruding distance with respect to the heat is large even though electric power is not distributed to the heater coil. On the other hand, a protruding position profile 76 shown by a dotted line is a comparative example of merely the basic shape not having the low thermal conducting layer and the low thermal expansion layer of FIG. 8, and the protruding positions thereof are approximately between the protruding position profile 72 of the embodiment in which the low thermal conducting layer and the low thermal expansion layer are provided and the protruding position profile 74 of merely the low thermal conducting layer. According to comparison with such protruding position profile 76 serving as a comparative example, it can be understood that, when the low thermal conducting layer is provided, the degree of the protruding distance with respect to the heat is large like the protruding position profile 74. Regarding the protruding position profile 72 in which the low thermal expansion layer is added in addition to the low thermal conducting layer, it can be understood that the protruding distance is suppressed overall since the low thermal expansion layer is provided. Therefore, according to the protruding position profile 72 of the embodiment in which both the low thermal conducting layer and the low thermal expansion layer of FIG. 2 are provided, the protruding distances of the medium facing surface of the head under the worst conditions which is the high-temperature electric-power-distributed state are suppressed to low values compared with the protruding position profile 74 of the embodiment of the low thermal conducting layer and the protruding position profile 76 serving as a comparative example. Therefore, when the designed value of the clearance under the worst conditions is to be determined, a minimum designed value of the clearance can be set.
FIG. 10 is an explanatory drawing showing, in comparison with a comparative example, protruding positions in the present embodiment when the heater coil is in an electric power distributed state of 100 mW in the high-temperature electric-power-distributed state of FIG. 9. In FIG. 10, a protruding position profile 78 shown by a slid line is in the case in which both the low thermal conducting layer and the low thermal expansion layer of FIG. 2 are provided, a protruding position profile 80 is in the case of FIG. 7 in which merely the low thermal conducting layer is provided, and a protruding position profile 82 of a broken line is a comparative example of FIG. 8. Regarding the protruding positions upon heater electric power distribution, in both the protruding position profile 78 of the embodiment of FIG. 2 and the protruding position profile 80 of the embodiment of FIG. 7, conduction of heat to the substrate side is suppressed as a result of disposing the low thermal conducting layer, and the protruding distances of about 17 nm is ensured at the read gap position 68, and the protruding distances of about 22 nm corresponding to approximately peak values are ensured at the write gap position 70. On the other hand, in the protruding position protruding position profile 82 according to the comparative example having merely the basic shape and not having the low thermal conducting layer and the low thermal expansion layer, it is about 18 nm at the read gap position 68, and about 17.5 nm at the write gap position 70. In comparison to the protruding position profile 82 serving as the comparative example, in both the embodiment of FIG. 2 and the embodiment of FIG. 7, sufficiently large head protruding distances with respect to the same heater electric power distribution amount are obtained.
FIG. 11 is an explanatory drawing of an embodiment in which a piezoelectric sensor structure using aluminium nitride AlN in the low thermal expansion layer in the embodiment of FIG. 2 is disposed and used as a collision sensor. FIG. 11 focuses on and shows the low thermal expansion layer 64 of FIG. 2, the low thermal expansion layer 64 of the present embodiment realizes the piezoelectric sensor structure by interposing aluminium nitride layers 102 and 104 between electrodes 96, 98, and 100. The electrodes 96 and 100 are connected to earth by a ground terminal 108, and the electrode 98 at the center is connected to a signal output terminal 106 and led to outside. The piezoelectric sensor which comprises the stacked structure of the aluminium nitride layers 102 and 104 and the electrodes 96, 98, and 100 performs C-axis orientation of thin films of aluminium nitride for the aluminium nitride layers 102 and 104 so as to retain the piezoelectric property thereof, and they are formed on the electrodes 96 and 98 serving as metal foil. Such low thermal expansion layer 64 is caused to have the piezoelectric sensor structure. As a result, when clearance control is performed by protruding the medium facing surface 40 like the protruding unit 66 by electric power distribution to the heater coil as shown in FIG. 3, and when collision with the protruding unit 66 occurs due to irregularities on the medium surface of the magnetic disk 14, the impact due to this collision is applied to the piezoelectric sensor structure which constitutes the low thermal expansion layer 64, and an impact-corresponding voltage according to the collision caused by a piezoelectric action can be output to outside from the signal output terminal 106.
FIG. 12 is a cross sectional view of another embodiment according to the present invention in which a low Young's modulus layer is disposed. In FIG. 12, in a magnetic head 18-4 of the present embodiment, the read head 36 and the write head 38 are disposed in the front side relative to the substrate 34, the structure of the read head 36 and the write head 38 is same as the embodiment of FIG. 2, and the heater coil 60 for controlling the protruding distance of the medium facing surface 40 by thermal expansion is similarly disposed. In the basic shape which comprises the read head 36 and the write head 38, in the present embodiment, the low Young's modulus layer 84 is disposed subsequent to the shield layer 42 in the substrate 34 side in the read head 36, and it is connected to the substrate 34 via the low Young's modulus layer 84. The low Young's modulus layer 84 is made of a material having a low Young's modulus which can be readily deformed with respect to thermal expansion when receiving the heat caused by electric power distribution to and heating of the heater coil 60. As the low Young's modulus layer 84, a material having a Young's modulus which is lower than the Young's moduli of the layers constituting the read head 36 and the write head 38 by one figure or two figures or more such as resist, polyimide, or amorphous fluorocarbon polymer is used. The low Young's modulus layer 84 of the present embodiment has a Young's modulus of 1 GPa to 50 GPa. The low Young's modulus layer 84 has a thickness of, for example, 0.4 μm to 4.0 μm.
FIG. 13 is an explanatory drawing of a protruding state caused by thermal expansion when electric power is distributed to the heater coil 60 of the embodiment of FIG. 12. The magnetic head 18-4 of the present embodiment is for a contact-type magnetic head which performs write and read in the state in which the medium facing surface 40 is always in contact with the medium surface of the magnetic disk 14. This contact-type magnetic head 18-4 is characterized in that the medium facing surface 40 is locally protruded as shown in a protruding unit 94 by thermal expansion caused by electric power distribution to and heating of the heater coil 60. More specifically, the protruding distance reaches a peak value at the read gap position 68, and the protruding unit 94 is brought into contact with the magnetic disk 14 and is protruded to a very close position, although it is not brought into contact, at the write gap position 70 positioned in the front side. When contact with the magnetic disk 14 is to be maintained by protruding it by thermal expansion caused by such electric power distribution control of the heater coil 60, in the rotary actuator 16 shown in FIG. 1 which supports the magnetic head 18-4, the protruding unit 94 is desired to be in contact with the medium surface in the state in which little pressing load is generated, and such contact state is maintained by the balance of the rotary actuator. However, in the flying-type magnetic head, for example as shown in FIG. 3, the entire part including the write gap position 70 and the read gap position 68 of the medium facing surface 40 is protruded by electric power distribution to and heating of the heater coil 60. When, in the thermal expansion state same as this, the head is brought into contact with the medium surface of the magnetic disk 14, the relative area of the protruding unit adjacent to the medium surface is increased.
In the magnetic head 18-4 as shown in FIG. 12, the distance between the head side and the magnetic disk 14 side is in a contact state, and this contact state is in the dimension in which the atomic force which is so-called Coulomb's force acts between atoms thereof. Therefore, when the medium facing surface 40 is entirely protruded by expansion like the conventional flying-type head of FIG. 8, the area facing the disk surface which is caused by protrusion is increased, the balance of the rotary actuator in which the contact force is caused to be approximately zero is broken due to increase in the Coulomb's force accompanying increase in the area, and the head is pressed against the disk surface by a strong force by protrusion contact caused by the heater coil; thus, failure like head wear, wear of the disk surface, or the like is generated, and durability is deteriorated. On the other hand, in the embodiment of FIG. 12, the low Young's modulus layer 84 is provided; therefore, as shown in the heating electric-power-distributed state of FIG. 13, the local protruding unit 94 in which the substrate 34 side serves as a fixed side and the distal end side divided from the low Young's modulus layer 84 is largely protruded can be formed, and the relative area with respect to the magnetic disk 14 is reduced to suppress increase in the Coulomb's force, thereby maintaining the balance of the rotary actuator which maintains the medium contact of the magnetic head.
FIG. 14 is a cross sectional view of another embodiment according to the present invention, wherein a low thermal expansion layer is disposed subsequent to the low Young's modulus layer. In FIG. 14, in a magnetic head 18-5 of the present embodiment, although the point that the low Young's modulus layer 84 is disposed subsequent to the shield layer 42 is same as the embodiment of FIG. 12, the low thermal expansion layer 94 is further disposed subsequent to the low Young's modulus layer 84 and between the layer and the substrate 34. The low thermal expansion layer 94 has a low expansion coefficient when receiving conduction of heat caused by electric power distribution to the heater coil 60; therefore, the low thermal expansion layer functions as a fixed unit which is not largely deformed with respect to the low Young's modulus layer 84, thereby relatively increasing local protrusion in the side of the read head 36 and the write head 38. The structure other than that is same as the embodiment of FIG. 12.
FIG. 15 is an explanatory drawing showing, in comparison with the comparative example of FIG. 8, protruding positions in the embodiments of FIG. 12 and FIG. 14 in the high-temperature electric-power-distributed state which is the worst conditions. In FIG. 15, a protruding position profile 88 is in the case of FIG. 12 in which the low Young's modulus layer is disposed in the basic shape, a protruding position profile 87 is in the case of FIG. 14 in which the low Young's modulus layer and the low thermal expansion layer are provided, and a protruding position profile 86 is the case of the comparative example of FIG. 7 in which the low Yong's modulus layer is not provided. As is clear from the protruding position profiles of FIG. 15 in the high-temperature electric-power-distributed state, the head position is entirely protruded in the protruding position profile 88 of merely the basic shape not having the low Young's modulus layer; however, in the protruding position profile 86 of the embodiment of FIG. 12 in which the low Young's modulus layer is provided, the protruding distance rises approximately linearly and reaches the vicinity of a peak protruding distance 6.8 nm before the read gap position 68, and then, the distance is gradually reduced as it reaches the head distal end. Furthermore, in the protruding position profile 87 of the embodiment of FIG. 14 in which the low Young's modulus layer and the low thermal expansion layer are provided, the protruding distance is changed to the negative side before the read gap position 68, then approximately linearly rises to reach the vicinity of a peak protruding distance of 6.3 nm, and is then gradually reduced as it approaches the head distal end; thus, the effect of increasing local deformation caused by providing the low thermal expansion layer.
FIG. 16 shows, in comparison with the comparative example of FIG. 7, protruding positions in the embodiments of FIG. 12 and FIG. 14 when the heater coil is heated by distributing 100 mW of electric power in the high-temperature electric-power-distributed state of FIG. 15. In FIG. 16, a protruding position profile 90 is in the case of FIG. 12 in which the low Young's modulus layer is provided, a protruding position profile 91 is in the case of FIG. 14 in which the low Young's modulus layer and the low thermal expansion layer are provided, and a protruding position profile 92 is in the case of the comparative example of FIG. 7 in which the low Young's modulus layer is not provided. As is clear from the measurement results of the protruding positions of FIG. 16, when the low Young's modulus layer 84 is provided, the distance is approximately linearly increased before the read gap position 68 as shown in the protruding position profile 90 by heating of the heater coil caused by electric power distribution thereto, and it is then gradually increased and reduced. When the low Young's modulus layer and the low thermal expansion layer are provided, the distance is approximately linearly increased before the read gap position 68 as shown in the protruding position profile 91 by heating of the heater coil caused by electric power distribution thereto, wherein deformation is suppressed since the low thermal expansion layer is provided, and the protruding distance is comparatively lower than the protruding position profile 90 in which the low Young's modulus layer 84 is provided. By virtue of such local protruding position profiles, the relative area accompanying contact with the disk medium wherein the Coulomb's force of the read gap position 68 and the write gap position 70 is a problem can be significantly reduced, and the contact balance achieved by the balance of the rotary actuator in the contact-type magnetic head can be maintained.
The embodiments of FIG. 12 and FIG. 14 employ utilization in a contact-type magnetic head as examples; however, since the local protruding profiles can be applied, the head structure in which the low Young's modulus layer 84 is similarly disposed may be employed also in a flying-type magnetic head and a near contact-type magnetic head. The present invention is not limited to the above described embodiments and includes arbitrary modifications that do not impair the objects and advantages thereof. Furthermore, the present invention is not limited by the numerical values shown in the above described embodiments.
Patent Application
20080023468
