Claims
- 1. A method comprising:forming a plurality of contacts on a first irregular surface to bond said first irregular surface to a second surface; planarizing said contacts to develop a substantially planar surface before contacting said second surface; and surface mounting said substantially planar surface of said first irregular surface to said second surface.
- 2. The method of claim 1 wherein planarizing said contacts includes scraping said contacts to form contact top surfaces substantially in a common plane.
- 3. The method of claim 1 including measuring the irregularity of said first irregular surface.
- 4. The method of claim 1 wherein forming a plurality of contacts includes depositing solder balls on said first irregular surface.
- 5. The method of claim 1 including mechanically planarizing said contacts.
- 6. The method of claim 1 including scraping said contacts to a common height above said first irregular surface.
- 7. The method of claim 1 including forming a plurality of contacts on a first irregular surface made of a ceramic material.
- 8. The method of claim 1 including surface mounting said first irregular surface to a second surface made at least in part of glass.
- 9. The method of claim 1 including forming a light emitting display.
- 10. The method of claim 9 including forming a display including an organic light emitting device.
- 11. A method comprising:depositing a plurality of solder balls on a first surface; selectively removing portions of selected solder balls based on irregularities in said first surface; and surface mounting said first surface to a second surface using said solder balls.
- 12. The method of claim 11 wherein selectively removing portions of selected solder balls includes passing a scraper across said solder balls at a fixed height above said first surface.
- 13. The method of claim 11 including selectively scraping away the top surfaces of said solder balls based on irregularities in said first surface.
- 14. The method of claim 11 further including using heat to selectively remove portions of said solder balls.
- 15. The method of claim 11 wherein depositing a plurality of solder balls includes applying heat to said deposited solder balls to fix them on the first surface.
Parent Case Info
This is a divisional of prior application Ser. No. 09/904,238, filed Jul. 12, 2001 now U.S. Pat. No. 6,512,301.
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