Ball grid array [BGA] Bump grid array

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CPC
H05K2201/10734

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10734Ball grid array [BGA] Bump grid array

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board assembly and electronic device including the same
- Patent number 12,237,561
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and power module
- Patent number 12,217,899
- Issue date Feb 4, 2025
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package for improving power integrity characteristics
- Patent number 12,213,256
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Junghwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density interconnects for integrated circuit packages
- Patent number 12,205,902
- Issue date Jan 21, 2025
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device carrier structures including polymer layers as ba...
- Patent number 12,207,398
- Issue date Jan 21, 2025
- Georgia Tech Research Corporation
- Omkar Gupte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 12,193,162
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct wire attachment methods and apparatus for a BGA component
- Patent number 12,177,989
- Issue date Dec 24, 2024
- ATL TECHNOLOGY, LLC
- Donovan M. Finnestad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density 3D interconnect configuration
- Patent number 12,159,835
- Issue date Dec 3, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Providing a lower inductance path in a routing substrate for a capa...
- Patent number 12,160,952
- Issue date Dec 3, 2024
- QUALCOMM Incorporated
- Biancun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with single rank memory configuration using p...
- Patent number 12,154,891
- Issue date Nov 26, 2024
- GM CRUISE HOLDINGS LLC
- Ajith Sreenilayam
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Platforms including microelectronic packages therein coupled to a c...
- Patent number 12,150,271
- Issue date Nov 19, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maintaining the shape of a circuit board
- Patent number 12,127,334
- Issue date Oct 22, 2024
- Dis Tech America, LLC
- Heng-Kit Too
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure and electronic device including the same
- Patent number 12,108,534
- Issue date Oct 1, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Eun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly including cable modules
- Patent number 12,089,357
- Issue date Sep 10, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforcement structures for surface mount packaging components
- Patent number 12,069,807
- Issue date Aug 20, 2024
- Simmonds Precision Products, Inc.
- Jason Graham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic control of heat sink pressure
- Patent number 12,069,794
- Issue date Aug 20, 2024
- Cisco Technology, Inc.
- Rohit Dev Gupta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module comprising antenna and RF element, and base station includin...
- Patent number 12,062,853
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Kwanghyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of circuit board
- Patent number 12,052,815
- Issue date Jul 30, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module and manufacturing method thereof
- Patent number 12,047,662
- Issue date Jul 23, 2024
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Kuei-Feng Peng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic device comprising surface-mount device type dipoles, and...
- Patent number 12,048,099
- Issue date Jul 23, 2024
- STMicroelectronics (Grenoble 2) SAS
- Pierino Calascibetta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite solder balls metallised on the surface and calibrated for...
- Patent number 12,030,138
- Issue date Jul 9, 2024
- LIPCO INDUSTRIE
- Constantin Iacob
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with stress reduction design and method for f...
- Patent number 12,035,475
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure electronic circuit and corresponding assembly process
- Patent number 12,028,981
- Issue date Jul 2, 2024
- BANKS AND ACQUIRERS INTERNATIONAL HOLDING
- Michel Rossignol
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip module
- Patent number 12,022,619
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Jong-Hyun Seok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrating system in package (SiP) with input/output (IO) board fo...
- Patent number 12,002,793
- Issue date Jun 4, 2024
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,974,398
- Issue date Apr 30, 2024
- Denso Corporation
- Hiroyoshi Kunieda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board structure including a closed cavity
- Patent number 11,967,758
- Issue date Apr 23, 2024
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient wave guide transition between package and PCB using solde...
- Patent number 11,963,291
- Issue date Apr 16, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
- Patent number 11,961,805
- Issue date Apr 16, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,963,311
- Issue date Apr 16, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Woong Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
High Density 3D Interconnect Configuration
- Publication number 20250046715
- Publication date Feb 6, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL CIRCUIT MOUNTING STRUCTURES
- Publication number 20250048532
- Publication date Feb 6, 2025
- NVIDIA Corp.
- Joey Cai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIELD PROGRAMMABLE SOLDER BALL GRID ARRAY WITH EMBEDDED CONTROL SYS...
- Publication number 20250048561
- Publication date Feb 6, 2025
- Tesla, Inc.
- Vijaykumar KRITHIVASAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP SYSTEM AND ELECTRONIC DEVICE
- Publication number 20250014976
- Publication date Jan 9, 2025
- Huawei Technologies Co., Ltd
- Yilu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20250016912
- Publication date Jan 9, 2025
- KYOCERA CORPORATION
- Takafumi OYOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cooling Methodology for Package-on-Package Structures
- Publication number 20250006673
- Publication date Jan 2, 2025
- Intel Corporation
- Siva Prasad JANGILI GANGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING BRIDGE PRINTED CIRCUIT BOARD
- Publication number 20240422954
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Bongkyu MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE COMPRISING ANTENNA AND RF ELEMENT, AND BASE STATION INCLUDIN...
- Publication number 20240405449
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Kwanghyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED BALL GRID ARRAY PAD CAPACITANCE
- Publication number 20240389220
- Publication date Nov 21, 2024
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE
- Publication number 20240389235
- Publication date Nov 21, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240389240
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRACE ARRANGEMENT FOR PRINTED CIRCUIT BOARD
- Publication number 20240381526
- Publication date Nov 14, 2024
- Cisco Technology, Inc.
- Shadi Ebrahimi Asl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC ASSEMBLY COMPRISING TWO PRINTED CIRCUIT BOARDS
- Publication number 20240381534
- Publication date Nov 14, 2024
- Endress+Hauser SE+Co. KG
- Romuald Girardey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDING OF A CIRCUIT OF ELECTRONIC COMPONENTS IN A BENDABLE SECTI...
- Publication number 20240373555
- Publication date Nov 7, 2024
- Magnisity Ltd.
- Benjamin GREENBURG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...
- Publication number 20240347476
- Publication date Oct 17, 2024
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING SURFACE-MOUNT DEVICE TYPE DIPOLES, AND...
- Publication number 20240341037
- Publication date Oct 10, 2024
- STMicroelectronics (Grenoble 2) SAS
- Pierino CALASCIBETTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DE...
- Publication number 20240334608
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Kuei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC CONTROL OF HEAT SINK PRESSURE
- Publication number 20240334589
- Publication date Oct 3, 2024
- Cisco Technology, Inc.
- Rohit Dev Gupta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321662
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Yutaka ONOZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BARRIER CONTACT FOR AN INTEGRATED CIRCUIT
- Publication number 20240324109
- Publication date Sep 26, 2024
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20240314929
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Kiyokazu ISHIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM
- Publication number 20240314920
- Publication date Sep 19, 2024
- MEDIATEK INC.
- Tso-Ju YI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR DISMANTLING OF DOUBLE-SIDED PCBA
- Publication number 20240314994
- Publication date Sep 19, 2024
- Intelligent Memory Limited
- Ho Wai Phyllis Leung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20240292529
- Publication date Aug 29, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Inhwan Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REMOVABLE LID FOR FLIP CHIP-BALL GRID ARRAY (FC-BGA) PACKAGES
- Publication number 20240284603
- Publication date Aug 22, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Eitan Ariel Caplan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION COMPONENTS FOR CONNECTING A SEMICONDUCTOR PACKAGE WITH A...
- Publication number 20240266301
- Publication date Aug 8, 2024
- Juniper Networks, Inc.
- Gautam GANGULY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240266271
- Publication date Aug 8, 2024
- Samsung Electronics Co., Ltd.
- Eun Ho CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION
- Publication number 20240260237
- Publication date Aug 1, 2024
- Western Digital Technologies, Inc.
- Wei Hong Tew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED POWER DESIGN IN A CARD-BASED COMPUTING DEVICE
- Publication number 20240260191
- Publication date Aug 1, 2024
- NVIDIA Corporation
- Sien CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR, CONNECTOR PREPARATION METHOD, INTERCONNECTION SYSTEM, AN...
- Publication number 20240222888
- Publication date Jul 4, 2024
- Huawei Technologies Co., Ltd
- Shuzhao Cao
- H01 - BASIC ELECTRIC ELEMENTS

Ball grid array [BGA] Bump grid array

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board assembly and electronic device including the same

Apparatus and power module

Semiconductor package for improving power integrity characteristics

High-density interconnects for integrated circuit packages

Electronic device carrier structures including polymer layers as ba...

Module

Direct wire attachment methods and apparatus for a BGA component

High density 3D interconnect configuration

Providing a lower inductance path in a routing substrate for a capa...

Printed circuit board with single rank memory configuration using p...

Platforms including microelectronic packages therein coupled to a c...

Maintaining the shape of a circuit board

Substrate structure and electronic device including the same

Electronic assembly including cable modules

Reinforcement structures for surface mount packaging components

Dynamic control of heat sink pressure

Module comprising antenna and RF element, and base station includin...

Manufacturing method of circuit board

Camera module and manufacturing method thereof

Electronic device comprising surface-mount device type dipoles, and...

Composite solder balls metallised on the surface and calibrated for...

Semiconductor package with stress reduction design and method for f...

Secure electronic circuit and corresponding assembly process

Semiconductor chip module

Integrating system in package (SiP) with input/output (IO) board fo...

Electronic device

Printed circuit board structure including a closed cavity

Efficient wave guide transition between package and PCB using solde...

Devices and methods related to dual-sided radio-frequency package w...

Printed circuit board and method of manufacturing the same

Patents Applicationslast 30 patents

High Density 3D Interconnect Configuration

THREE DIMENSIONAL CIRCUIT MOUNTING STRUCTURES

FIELD PROGRAMMABLE SOLDER BALL GRID ARRAY WITH EMBEDDED CONTROL SYS...

CHIP SYSTEM AND ELECTRONIC DEVICE

WIRING BOARD

Cooling Methodology for Package-on-Package Structures

ELECTRONIC DEVICE INCLUDING BRIDGE PRINTED CIRCUIT BOARD

MODULE COMPRISING ANTENNA AND RF ELEMENT, AND BASE STATION INCLUDIN...

REDUCED BALL GRID ARRAY PAD CAPACITANCE

CIRCUIT MODULE

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

TRACE ARRANGEMENT FOR PRINTED CIRCUIT BOARD

ELECTRIC ASSEMBLY COMPRISING TWO PRINTED CIRCUIT BOARDS

EMBEDDING OF A CIRCUIT OF ELECTRONIC COMPONENTS IN A BENDABLE SECTI...

METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...

ELECTRONIC DEVICE COMPRISING SURFACE-MOUNT DEVICE TYPE DIPOLES, AND...

METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DE...

DYNAMIC CONTROL OF HEAT SINK PRESSURE

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

SOLDER BARRIER CONTACT FOR AN INTEGRATED CIRCUIT

SEMICONDUCTOR STORAGE DEVICE

ELECTRONIC SYSTEM

SYSTEMS AND METHODS FOR DISMANTLING OF DOUBLE-SIDED PCBA

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

REMOVABLE LID FOR FLIP CHIP-BALL GRID ARRAY (FC-BGA) PACKAGES

CONNECTION COMPONENTS FOR CONNECTING A SEMICONDUCTOR PACKAGE WITH A...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION

STACKED POWER DESIGN IN A CARD-BASED COMPUTING DEVICE

CONNECTOR, CONNECTOR PREPARATION METHOD, INTERCONNECTION SYSTEM, AN...