Ball grid array [BGA] Bump grid array

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CPC
H05K2201/10734

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10734Ball grid array [BGA] Bump grid array

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Backside recess in motherboard with thermally conductive mold
- Patent number 12,363,831
- Issue date Jul 15, 2025
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna module and electronic device including same
- Patent number 12,349,277
- Issue date Jul 1, 2025
- Samsung Electronics Co., Ltd.
- Kwanghyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional circuit mounting structures
- Patent number 12,342,448
- Issue date Jun 24, 2025
- NVIDIA Corp.
- Joey Cai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array card edge connector
- Patent number 12,341,279
- Issue date Jun 24, 2025
- Xiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for dismantling of double-sided PCBA
- Patent number 12,336,110
- Issue date Jun 17, 2025
- Intelligent Memory Limited
- Ho Wai Phyllis Leung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder pads with concave edges for ball grid arrays
- Patent number 12,328,826
- Issue date Jun 10, 2025
- MOTOROLA SOLUTIONS, INC.
- Edwin L Bradley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for package with interposers
- Patent number 12,322,670
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 12,309,923
- Issue date May 20, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Hoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-pitch ball grid array
- Patent number 12,288,741
- Issue date Apr 29, 2025
- Juniper Networks, Inc.
- Granthana Kattehalli Rangaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a circuit board arrangement
- Patent number 12,279,380
- Issue date Apr 15, 2025
- Continental Automotive GmbH
- Rafael Del Rey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded printed circuit board
- Patent number 12,245,376
- Issue date Mar 4, 2025
- Shinko Electric Industries Co., Ltd.
- Seiji Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heatsink techniques for optical and electrical modules
- Patent number 12,245,359
- Issue date Mar 4, 2025
- Ciena Corporation
- Mitchell O'Leary
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux resin composition, electronic component, method for manufactur...
- Patent number 12,240,061
- Issue date Mar 4, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shohei Sanada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly and electronic device including the same
- Patent number 12,237,561
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jongwon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and power module
- Patent number 12,217,899
- Issue date Feb 4, 2025
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package for improving power integrity characteristics
- Patent number 12,213,256
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Junghwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density interconnects for integrated circuit packages
- Patent number 12,205,902
- Issue date Jan 21, 2025
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device carrier structures including polymer layers as ba...
- Patent number 12,207,398
- Issue date Jan 21, 2025
- Georgia Tech Research Corporation
- Omkar Gupte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 12,193,162
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct wire attachment methods and apparatus for a BGA component
- Patent number 12,177,989
- Issue date Dec 24, 2024
- ATL TECHNOLOGY, LLC
- Donovan M. Finnestad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density 3D interconnect configuration
- Patent number 12,159,835
- Issue date Dec 3, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Providing a lower inductance path in a routing substrate for a capa...
- Patent number 12,160,952
- Issue date Dec 3, 2024
- QUALCOMM Incorporated
- Biancun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with single rank memory configuration using p...
- Patent number 12,154,891
- Issue date Nov 26, 2024
- GM CRUISE HOLDINGS LLC
- Ajith Sreenilayam
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Platforms including microelectronic packages therein coupled to a c...
- Patent number 12,150,271
- Issue date Nov 19, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maintaining the shape of a circuit board
- Patent number 12,127,334
- Issue date Oct 22, 2024
- Dis Tech America, LLC
- Heng-Kit Too
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure and electronic device including the same
- Patent number 12,108,534
- Issue date Oct 1, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Eun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly including cable modules
- Patent number 12,089,357
- Issue date Sep 10, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforcement structures for surface mount packaging components
- Patent number 12,069,807
- Issue date Aug 20, 2024
- Simmonds Precision Products, Inc.
- Jason Graham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic control of heat sink pressure
- Patent number 12,069,794
- Issue date Aug 20, 2024
- Cisco Technology, Inc.
- Rohit Dev Gupta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module comprising antenna and RF element, and base station includin...
- Patent number 12,062,853
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Kwanghyun Baek
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE
- Publication number 20250216614
- Publication date Jul 3, 2025
- IBIDEN CO., LTD.
- Masatoshi KUNIEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250212327
- Publication date Jun 26, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Kyeong Yub Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20250203761
- Publication date Jun 19, 2025
- LG Innotek Co., Ltd.
- Duck Hoon PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250203766
- Publication date Jun 19, 2025
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION
- Publication number 20250203773
- Publication date Jun 19, 2025
- Micron Technology, Inc.
- Kelvin Aik Boo TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE...
- Publication number 20250193997
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Seokbeom Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183186
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Sungoh Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BGA Radio Frequency Module, Substrate for BGA Radio Frequency Modul...
- Publication number 20250185153
- Publication date Jun 5, 2025
- Nippon Telegraph and Telephone Corporation
- Masayuki Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heatsink techniques for optical and electrical modules
- Publication number 20250168963
- Publication date May 22, 2025
- CIENA CORPORATION
- Mitchell O'Leary
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE SLOT CARD EDGE CONNECTOR
- Publication number 20250141134
- Publication date May 1, 2025
- Intel Corporation
- Xiang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD SYSTEM
- Publication number 20250133658
- Publication date Apr 24, 2025
- Harman Becker Automotive Systems GmbH
- Andreas KUSKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIGNAL TRACE TRANSITION FOR HIGH DATA RATE APPLICATIONS
- Publication number 20250120020
- Publication date Apr 10, 2025
- Marvell Asia Pte Ltd.
- Fei Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250120009
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Dongwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD WITH STIFFENER
- Publication number 20250106984
- Publication date Mar 27, 2025
- KYOCCERA CORPORATION
- Suguru KADOWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, ELECTRONIC EQUIPMENT,...
- Publication number 20250106998
- Publication date Mar 27, 2025
- Canon Kabushiki Kaisha
- TAKASHI NUMAGI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL PACKAGING STRUCTURE FOR LIDAR
- Publication number 20250102633
- Publication date Mar 27, 2025
- Lumentum Operations LLC
- Chong Yang QIN
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20250106991
- Publication date Mar 27, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seong Ho Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF POWER MODULE
- Publication number 20250104902
- Publication date Mar 27, 2025
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD
- Publication number 20250089172
- Publication date Mar 13, 2025
- LG Innotek Co., Ltd.
- Eom Ji KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER FOR TROUBLESHOOTING A BALL GRID ARRAY (BGA) DEVICE AND C...
- Publication number 20250081357
- Publication date Mar 6, 2025
- Western Digital Technologies, Inc.
- Nadav Tsur
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT CARRIER
- Publication number 20250081350
- Publication date Mar 6, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco GAVAGNIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BRIDGE PRINTED CIRCUIT BOARD EMBEDDED WITHIN ANOTHER PRINTED CIRCUI...
- Publication number 20250081348
- Publication date Mar 6, 2025
- Intel Corporation
- Arumanayagam RAJASEKAR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROL BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20250071905
- Publication date Feb 27, 2025
- Hitachi, Ltd
- Masako KATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Density 3D Interconnect Configuration
- Publication number 20250046715
- Publication date Feb 6, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD PROGRAMMABLE SOLDER BALL GRID ARRAY WITH EMBEDDED CONTROL SYS...
- Publication number 20250048561
- Publication date Feb 6, 2025
- Tesla, Inc.
- Vijaykumar KRITHIVASAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE DIMENSIONAL CIRCUIT MOUNTING STRUCTURES
- Publication number 20250048532
- Publication date Feb 6, 2025
- NVIDIA Corp.
- Joey Cai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP SYSTEM AND ELECTRONIC DEVICE
- Publication number 20250014976
- Publication date Jan 9, 2025
- Huawei Technologies Co., Ltd
- Yilu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20250016912
- Publication date Jan 9, 2025
- KYOCERA CORPORATION
- Takafumi OYOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cooling Methodology for Package-on-Package Structures
- Publication number 20250006673
- Publication date Jan 2, 2025
- Intel Corporation
- Siva Prasad JANGILI GANGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING BRIDGE PRINTED CIRCUIT BOARD
- Publication number 20240422954
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Bongkyu MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Ball grid array [BGA] Bump grid array

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Backside recess in motherboard with thermally conductive mold

Antenna module and electronic device including same

Three dimensional circuit mounting structures

Ball grid array card edge connector

Systems for dismantling of double-sided PCBA

Solder pads with concave edges for ball grid arrays

Methods and apparatus for package with interposers

Printed circuit board and method for manufacturing the same

Multi-pitch ball grid array

Method for producing a circuit board arrangement

Embedded printed circuit board

Heatsink techniques for optical and electrical modules

Flux resin composition, electronic component, method for manufactur...

Circuit board assembly and electronic device including the same

Apparatus and power module

Semiconductor package for improving power integrity characteristics

High-density interconnects for integrated circuit packages

Electronic device carrier structures including polymer layers as ba...

Module

Direct wire attachment methods and apparatus for a BGA component

High density 3D interconnect configuration

Providing a lower inductance path in a routing substrate for a capa...

Printed circuit board with single rank memory configuration using p...

Platforms including microelectronic packages therein coupled to a c...

Maintaining the shape of a circuit board

Substrate structure and electronic device including the same

Electronic assembly including cable modules

Reinforcement structures for surface mount packaging components

Dynamic control of heat sink pressure

Module comprising antenna and RF element, and base station includin...

Patents Applicationslast 30 patents

WIRING SUBSTRATE

PRINTED CIRCUIT BOARD

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

PRINTED WIRING BOARD

SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION

MULTILAYER WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE...

SEMICONDUCTOR PACKAGE

BGA Radio Frequency Module, Substrate for BGA Radio Frequency Modul...

Heatsink techniques for optical and electrical modules

MULTIPLE SLOT CARD EDGE CONNECTOR

CIRCUIT BOARD SYSTEM

SIGNAL TRACE TRANSITION FOR HIGH DATA RATE APPLICATIONS

SEMICONDUCTOR PACKAGE

WIRING BOARD WITH STIFFENER

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, ELECTRONIC EQUIPMENT,...

OPTICAL PACKAGING STRUCTURE FOR LIDAR

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

MANUFACTURING METHOD OF POWER MODULE

CIRCUIT BOARD

INTERPOSER FOR TROUBLESHOOTING A BALL GRID ARRAY (BGA) DEVICE AND C...

COMPONENT CARRIER

BRIDGE PRINTED CIRCUIT BOARD EMBEDDED WITHIN ANOTHER PRINTED CIRCUI...

CONTROL BOARD AND METHOD FOR MANUFACTURING SAME

High Density 3D Interconnect Configuration

FIELD PROGRAMMABLE SOLDER BALL GRID ARRAY WITH EMBEDDED CONTROL SYS...

THREE DIMENSIONAL CIRCUIT MOUNTING STRUCTURES

CHIP SYSTEM AND ELECTRONIC DEVICE

WIRING BOARD

Cooling Methodology for Package-on-Package Structures

ELECTRONIC DEVICE INCLUDING BRIDGE PRINTED CIRCUIT BOARD