Ball grid array [BGA] Bump grid array

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CPC
H05K2201/10734

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10734Ball grid array [BGA] Bump grid array

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Embedded printed circuit board
- Patent number 12,245,376
- Issue date Mar 4, 2025
- Shinko Electric Industries Co., Ltd.
- Seiji Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heatsink techniques for optical and electrical modules
- Patent number 12,245,359
- Issue date Mar 4, 2025
- Ciena Corporation
- Mitchell O'Leary
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux resin composition, electronic component, method for manufactur...
- Patent number 12,240,061
- Issue date Mar 4, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shohei Sanada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly and electronic device including the same
- Patent number 12,237,561
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jongwon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and power module
- Patent number 12,217,899
- Issue date Feb 4, 2025
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package for improving power integrity characteristics
- Patent number 12,213,256
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Junghwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density interconnects for integrated circuit packages
- Patent number 12,205,902
- Issue date Jan 21, 2025
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device carrier structures including polymer layers as ba...
- Patent number 12,207,398
- Issue date Jan 21, 2025
- Georgia Tech Research Corporation
- Omkar Gupte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 12,193,162
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct wire attachment methods and apparatus for a BGA component
- Patent number 12,177,989
- Issue date Dec 24, 2024
- ATL TECHNOLOGY, LLC
- Donovan M. Finnestad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density 3D interconnect configuration
- Patent number 12,159,835
- Issue date Dec 3, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Providing a lower inductance path in a routing substrate for a capa...
- Patent number 12,160,952
- Issue date Dec 3, 2024
- QUALCOMM Incorporated
- Biancun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with single rank memory configuration using p...
- Patent number 12,154,891
- Issue date Nov 26, 2024
- GM CRUISE HOLDINGS LLC
- Ajith Sreenilayam
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Platforms including microelectronic packages therein coupled to a c...
- Patent number 12,150,271
- Issue date Nov 19, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maintaining the shape of a circuit board
- Patent number 12,127,334
- Issue date Oct 22, 2024
- Dis Tech America, LLC
- Heng-Kit Too
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure and electronic device including the same
- Patent number 12,108,534
- Issue date Oct 1, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Eun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly including cable modules
- Patent number 12,089,357
- Issue date Sep 10, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforcement structures for surface mount packaging components
- Patent number 12,069,807
- Issue date Aug 20, 2024
- Simmonds Precision Products, Inc.
- Jason Graham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic control of heat sink pressure
- Patent number 12,069,794
- Issue date Aug 20, 2024
- Cisco Technology, Inc.
- Rohit Dev Gupta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module comprising antenna and RF element, and base station includin...
- Patent number 12,062,853
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Kwanghyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of circuit board
- Patent number 12,052,815
- Issue date Jul 30, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module and manufacturing method thereof
- Patent number 12,047,662
- Issue date Jul 23, 2024
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Kuei-Feng Peng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic device comprising surface-mount device type dipoles, and...
- Patent number 12,048,099
- Issue date Jul 23, 2024
- STMicroelectronics (Grenoble 2) SAS
- Pierino Calascibetta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite solder balls metallised on the surface and calibrated for...
- Patent number 12,030,138
- Issue date Jul 9, 2024
- LIPCO INDUSTRIE
- Constantin Iacob
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with stress reduction design and method for f...
- Patent number 12,035,475
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure electronic circuit and corresponding assembly process
- Patent number 12,028,981
- Issue date Jul 2, 2024
- BANKS AND ACQUIRERS INTERNATIONAL HOLDING
- Michel Rossignol
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip module
- Patent number 12,022,619
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Jong-Hyun Seok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrating system in package (SiP) with input/output (IO) board fo...
- Patent number 12,002,793
- Issue date Jun 4, 2024
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,974,398
- Issue date Apr 30, 2024
- Denso Corporation
- Hiroyoshi Kunieda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board structure including a closed cavity
- Patent number 11,967,758
- Issue date Apr 23, 2024
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD WITH STIFFENER
- Publication number 20250106984
- Publication date Mar 27, 2025
- KYOCCERA CORPORATION
- Suguru KADOWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, ELECTRONIC EQUIPMENT,...
- Publication number 20250106998
- Publication date Mar 27, 2025
- Canon Kabushiki Kaisha
- TAKASHI NUMAGI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL PACKAGING STRUCTURE FOR LIDAR
- Publication number 20250102633
- Publication date Mar 27, 2025
- Lumentum Operations LLC
- Chong Yang QIN
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20250106991
- Publication date Mar 27, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seong Ho Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF POWER MODULE
- Publication number 20250104902
- Publication date Mar 27, 2025
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD
- Publication number 20250089172
- Publication date Mar 13, 2025
- LG Innotek Co., Ltd.
- Eom Ji KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER FOR TROUBLESHOOTING A BALL GRID ARRAY (BGA) DEVICE AND C...
- Publication number 20250081357
- Publication date Mar 6, 2025
- Western Digital Technologies, Inc.
- Nadav Tsur
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT CARRIER
- Publication number 20250081350
- Publication date Mar 6, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco GAVAGNIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BRIDGE PRINTED CIRCUIT BOARD EMBEDDED WITHIN ANOTHER PRINTED CIRCUI...
- Publication number 20250081348
- Publication date Mar 6, 2025
- Intel Corporation
- Arumanayagam RAJASEKAR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROL BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20250071905
- Publication date Feb 27, 2025
- Hitachi, Ltd
- Masako KATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Density 3D Interconnect Configuration
- Publication number 20250046715
- Publication date Feb 6, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD PROGRAMMABLE SOLDER BALL GRID ARRAY WITH EMBEDDED CONTROL SYS...
- Publication number 20250048561
- Publication date Feb 6, 2025
- Tesla, Inc.
- Vijaykumar KRITHIVASAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE DIMENSIONAL CIRCUIT MOUNTING STRUCTURES
- Publication number 20250048532
- Publication date Feb 6, 2025
- NVIDIA Corp.
- Joey Cai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP SYSTEM AND ELECTRONIC DEVICE
- Publication number 20250014976
- Publication date Jan 9, 2025
- Huawei Technologies Co., Ltd
- Yilu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20250016912
- Publication date Jan 9, 2025
- KYOCERA CORPORATION
- Takafumi OYOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cooling Methodology for Package-on-Package Structures
- Publication number 20250006673
- Publication date Jan 2, 2025
- Intel Corporation
- Siva Prasad JANGILI GANGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING BRIDGE PRINTED CIRCUIT BOARD
- Publication number 20240422954
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Bongkyu MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE COMPRISING ANTENNA AND RF ELEMENT, AND BASE STATION INCLUDIN...
- Publication number 20240405449
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Kwanghyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED BALL GRID ARRAY PAD CAPACITANCE
- Publication number 20240389220
- Publication date Nov 21, 2024
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE
- Publication number 20240389235
- Publication date Nov 21, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240389240
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRACE ARRANGEMENT FOR PRINTED CIRCUIT BOARD
- Publication number 20240381526
- Publication date Nov 14, 2024
- Cisco Technology, Inc.
- Shadi Ebrahimi Asl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC ASSEMBLY COMPRISING TWO PRINTED CIRCUIT BOARDS
- Publication number 20240381534
- Publication date Nov 14, 2024
- Endress+Hauser SE+Co. KG
- Romuald Girardey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDING OF A CIRCUIT OF ELECTRONIC COMPONENTS IN A BENDABLE SECTI...
- Publication number 20240373555
- Publication date Nov 7, 2024
- Magnisity Ltd.
- Benjamin GREENBURG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...
- Publication number 20240347476
- Publication date Oct 17, 2024
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING SURFACE-MOUNT DEVICE TYPE DIPOLES, AND...
- Publication number 20240341037
- Publication date Oct 10, 2024
- STMicroelectronics (Grenoble 2) SAS
- Pierino CALASCIBETTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DE...
- Publication number 20240334608
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Kuei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC CONTROL OF HEAT SINK PRESSURE
- Publication number 20240334589
- Publication date Oct 3, 2024
- Cisco Technology, Inc.
- Rohit Dev Gupta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321662
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Yutaka ONOZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BARRIER CONTACT FOR AN INTEGRATED CIRCUIT
- Publication number 20240324109
- Publication date Sep 26, 2024
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Ball grid array [BGA] Bump grid array

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embedded printed circuit board

Heatsink techniques for optical and electrical modules

Flux resin composition, electronic component, method for manufactur...

Circuit board assembly and electronic device including the same

Apparatus and power module

Semiconductor package for improving power integrity characteristics

High-density interconnects for integrated circuit packages

Electronic device carrier structures including polymer layers as ba...

Module

Direct wire attachment methods and apparatus for a BGA component

High density 3D interconnect configuration

Providing a lower inductance path in a routing substrate for a capa...

Printed circuit board with single rank memory configuration using p...

Platforms including microelectronic packages therein coupled to a c...

Maintaining the shape of a circuit board

Substrate structure and electronic device including the same

Electronic assembly including cable modules

Reinforcement structures for surface mount packaging components

Dynamic control of heat sink pressure

Module comprising antenna and RF element, and base station includin...

Manufacturing method of circuit board

Camera module and manufacturing method thereof

Electronic device comprising surface-mount device type dipoles, and...

Composite solder balls metallised on the surface and calibrated for...

Semiconductor package with stress reduction design and method for f...

Secure electronic circuit and corresponding assembly process

Semiconductor chip module

Integrating system in package (SiP) with input/output (IO) board fo...

Electronic device

Printed circuit board structure including a closed cavity

Patents Applicationslast 30 patents

WIRING BOARD WITH STIFFENER

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, ELECTRONIC EQUIPMENT,...

OPTICAL PACKAGING STRUCTURE FOR LIDAR

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

MANUFACTURING METHOD OF POWER MODULE

CIRCUIT BOARD

INTERPOSER FOR TROUBLESHOOTING A BALL GRID ARRAY (BGA) DEVICE AND C...

COMPONENT CARRIER

BRIDGE PRINTED CIRCUIT BOARD EMBEDDED WITHIN ANOTHER PRINTED CIRCUI...

CONTROL BOARD AND METHOD FOR MANUFACTURING SAME

High Density 3D Interconnect Configuration

FIELD PROGRAMMABLE SOLDER BALL GRID ARRAY WITH EMBEDDED CONTROL SYS...

THREE DIMENSIONAL CIRCUIT MOUNTING STRUCTURES

CHIP SYSTEM AND ELECTRONIC DEVICE

WIRING BOARD

Cooling Methodology for Package-on-Package Structures

ELECTRONIC DEVICE INCLUDING BRIDGE PRINTED CIRCUIT BOARD

MODULE COMPRISING ANTENNA AND RF ELEMENT, AND BASE STATION INCLUDIN...

REDUCED BALL GRID ARRAY PAD CAPACITANCE

CIRCUIT MODULE

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

TRACE ARRANGEMENT FOR PRINTED CIRCUIT BOARD

ELECTRIC ASSEMBLY COMPRISING TWO PRINTED CIRCUIT BOARDS

EMBEDDING OF A CIRCUIT OF ELECTRONIC COMPONENTS IN A BENDABLE SECTI...

METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...

ELECTRONIC DEVICE COMPRISING SURFACE-MOUNT DEVICE TYPE DIPOLES, AND...

METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DE...

DYNAMIC CONTROL OF HEAT SINK PRESSURE

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

SOLDER BARRIER CONTACT FOR AN INTEGRATED CIRCUIT