BRIEF DESCRIPTION OF DRAWINGS
In the accompanying drawings:
FIGS. 1A and 1B are diagrams each showing a circuit configuration of a memory cell;
FIG. 2 is a view showing a laser irradiation pattern;
FIG. 3 is a view showing a laser irradiation pattern;
FIG. 4 is a view showing a structure of a laser irradiation apparatus;
FIG. 5 is a view showing a structure of a laser irradiation apparatus;
FIGS. 6A and 6B are views each showing a divergence pattern of a diffractive optical element;
FIG. 7 is a view showing a structure of a laser irradiation apparatus;
FIG. 8 is a view showing a cross section of a semiconductor device;
FIG. 9 is a flow chart of a manufacturing method of a semiconductor device;
FIG. 10 is a flow chart of a manufacturing method of a semiconductor device;
FIGS. 11A and 11B are views each showing a manufacturing process of a semiconductor device;
FIGS. 12A and 12B are views each showing a manufacturing process of a semiconductor device;
FIG. 13 is a diagram showing a configuration of a nonvolatile memory circuit;
FIGS. 14A to 14E are views each showing an embodiment of an antenna;
FIGS. 15A to 15C are views each showing an embodiment of an antenna;
FIGS. 16A to 16E are views each showing a manufacturing process of a semiconductor device;
FIGS. 17A to 17D are views each showing a manufacturing process of a semiconductor device;
FIGS. 18A and 18B are views each showing a manufacturing process of a semiconductor device;
FIGS. 19A to 19H are views each showing an application of a semiconductor device manufactured according to the present invention;
FIG. 20 is a view showing a bag using a semiconductor device manufactured according to the present invention;
FIGS. 21A and 21B are views each showing a certificate using a semiconductor device manufactured according to the present invention;
FIG. 22 is a view showing groceries control using a semiconductor device manufactured according to the present invention;
FIGS. 23A and 23B are views each showing distribution management using a semiconductor device manufactured according to the present invention; and
FIG. 24 is a view showing IC card settlement using a semiconductor device manufactured according to the present invention.