Claims
- 1. An integrated circuit substrate comprising a conductive layer having a pattern defining a plurality of multiple contacts, the pattern comprising:a plurality of substantially rectangular voids formed in the conductive layer, the substantially rectangular voids arranged longitudinally in each of a plurality of substantially parallel rows; the rows evenly spaced apart from each other; the substantially rectangular voids in each row evenly spaced apart from each other and offset from the substantially rectangular voids of neighboring rows; the substantially rectangular voids defining a plurality of T-shaped sections in the conductive layer, the T-shaped sections connected to and offset from each other; and a lower portion of each T-shaped section comprising a plurality of individual contacts separated by one or more structures protruding from an underlying layer of the integrated circuit substrate.
- 2. The integrated circuit substrate of claim 1, wherein the substantially rectangular voids are substantially identical to each other and the T-shaped sections are substantially identical to each other.
- 3. The integrated circuit substrate of claim 1, wherein the substantially rectangular voids each have a substantially equal width and the rows are each spaced apart a distance substantially equal to the width of the substantially rectangular voids.
Parent Case Info
This is a Divisional Application of Ser. No. 09/219,240, filed Dec. 12, 1998 now U.S. Pat. No. 6,194,306, which claims priority under 35 U.S.C. § 119(e)(1) of Provisional Application No. 60/068,409, filed Dec. 22, 1997.
US Referenced Citations (3)
Provisional Applications (1)
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Number |
Date |
Country |
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60/068409 |
Dec 1997 |
US |