1. Technical Field
Embodiments of the present disclosure relate to computer memory testing systems and, particularly, to a computer memory chip testing system with a connector for connecting to a memory chip interface.
2. Description of Related Art
The data accessing rates of computer memory chips are growing fast, and the stability of data accessing is an important factor in assessing the quality of a memory chip. For computer makers, the stability of data accessing under different voltages is tested to evaluate the quality of a memory chip. Memory chips on a mainboard can be tested one by one by soldering wires of test equipment such as a rheostat or a voltmeter to testing pins on the memory chips. After testing, the wires are removed. Nevertheless, during the process of soldering and removing the wires, the mainboard may be damaged.
The disclosure, including the accompanying drawings in which like reference numerals indicate similar elements, is illustrated by way of example and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references can mean “at least one.”
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The connector 13 includes an insulating substrate 131 and a number of conductive posts 132. The conductive posts 132 are partly fixed in the insulating substrate 131 and arranged according to the pins 103 of the memory chip interface 102. In particular, each of the conductive posts 132 corresponds to a pin 103 of the memory chip interface 102. The conductive posts 132 include a number of first conductive posts 1321 and a number of second conductive posts 1322. The first conductive posts 1321 are taller than the second conductive posts 1322. The first conductive posts 1321 are used to connect to the rheostat 11 and the voltmeter 12. A portion of each of the conductive posts 132 that is fixed in the insulating substrate 131 includes an open-ended hollow tube 1323. A pair of elastic strips 133 are set in the open-ended hollow tube 1323. In the embodiment, each of the elastic strips 133 is arcuate, and the elastic strips 133 abut against each other.
In the embodiment, the second conductive posts 1322 are used for stabilizing the connection between the connector 13 and the pins 103 of the memory chip interface 102, thereby preventing the pins 103 of the memory chip interface 102 from being damaged when connecting the connector 13 to the pins 103 of the memory chip interface 102. In other embodiments, the second conductive posts 1322 can be omitted from the connector 13, and only the first conductive posts 1321 used. In other embodiments, the first conductive posts 1321 and the second conductive posts 1322 of the connector 13 may have the same height, so that the connector 13 can be used to test different types of memory chips 14 whose functional pins have different arrangements.
In use of the memory chip testing system 1, the connector 13 is maneuvered so that the open ends of the open-ended hollow tubes 1323 are aligned with and receive the pins 103 of the memory chip interface 102. The arcuate elastic strips 133 in the open-ended hollow tubes 1323 clamp the pins 103 of the memory chip interface 102, thereby firmly connecting the connector 13 to the pins 103 of the memory chip interface 102. During testing a memory chip 14, the rheostat 11 and voltmeter 12 are connected to the corresponding first conductive posts 1321 on the connector 13, instead of being soldered to certain of the pins 103 of the memory chip interface 102. The connector 13 is easily detached from the memory chip interface 102 having the memory chip 14, and easily connected to a next memory chip interface 102 having a next memory chip 14 needing testing. Typically, the next memory chip interface 102 having the next memory chip 14 is on the same mainboard 101 as the first memory chip interface 102 having the first memory chip 14. With the above structure, there is no need for a process of soldering wires and later removing the wires from the pins 103 of the memory chip interface 102. Thereby, damage to the mainboard 101 is avoided.
Although certain embodiments have been specifically described, the present disclosure is not to be construed as being limited thereto. Various changes or modifications may be made to the present embodiments without departing from the scope and spirit of the present disclosure.
Number | Date | Country | Kind |
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2013100757835 | Mar 2013 | CN | national |