MEMORY DEVICE AND METHOD FOR MANUFACTURING THEREFOR

Abstract

A memory device includes a stacked body of alternately arranged conductor-including layers and insulating films in the first direction and pillar bodies within the stacked body. Each pillar body includes first and second conductive pillars and an insulator pillar located between the first conductive pillar and the second conductive pillar. Each conductor-including layer includes a semiconductor member, an electrode film and a ferroelectric layer provided between the semiconductor member and the electrode film. The semiconductor members in the multiple conductor-including layers are separated from each other in the first direction.

Description

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefits of Japanese Patent Application No. 2022-079389 filed in Japan on May 13, 2022, which is incorporated herein by reference for all purposes.

FIELD OF THE INVENTION

The present invention relates to memory or storage devices and their manufacturing methods. In particular, the present invention relates to memory or storage devices, including those formed in a three-dimensional memory or storage array out of thin-film memory or storage transistors, whether based on any charge-storage and ferroelectric mechanisms.

BACKGROUND OF THE INVENTION

In recent years, to achieve high integration of semiconductor storage devices, multilayer storage devices in which memory or storage cells are integrated three-dimensionally have been developed. In a three-dimensional memory or storage device, high reliability of operation is required.

SUMMARY

According to one embodiment of the present invention, a memory device includes a stacked body of conductor-including layers and insulating films that are alternately provided one atop another along the first direction. Formed in the stacked body are pillar bodies, each pillar body including first and second conductive pillars (e.g., semiconductor pillars of a first conductivity type) isolated from each other by an insulator pillar. Within the stacked body, each conductor-including layer includes a semiconductor member in contact with the first and second conductive pillars, an electrode film and a ferroelectric layer between the semiconductor member and the electrode film. The semiconductor members in the conductor-including layers are separated from each other in the first direction.

According to one embodiment of the present invention, a method for forming a memory device includes: making a stacked body of alternately provided sacrificial and insulating films, one atop another along a first direction; forming a through-hole in the stack, the through-hole extends along the first direction; forming recesses into the sacrificial films at a side surface of the through-hole; forming a semiconductor layer of the second conductivity type on the side surface of the through-hole; anisotropically etching the semiconductor layer from the side surface of the through-hole, such that only portions of the semiconductor layer located in the recesses remain and forming semiconductor members; forming pillar bodies each including first and second conductive pillars (e.g., depositing semiconductor material of the first conductivity type) and an insulator pillar between the first and the second conductive pillars, the pillars each extending along the first direction in the through-hole; removing the sacrificial films to form cavities bordered by exposed surfaces of the semiconductor members and the insulating films; forming a ferroelectric layer over exposed surfaces of the semiconductor members in the cavities and the insulating films; and forming a conductor in each of the cavities.

Therefore, a memory or storage device capable of highly reliable operations and a method for manufacturing such a memory or storage device are realized.

BRIEF DESCRIPTION OF THE DRAWINGS

Various embodiments of the invention are disclosed in the following detailed description and the accompanying drawings. Although the drawings depict various examples of the invention, the invention is not limited by the depicted examples. It is to be understood that, in the drawings, like reference numerals designate like structural elements. Also, it is understood that the depictions in the figures are not necessarily to scale.

FIG. 1 is a perspective view showing semiconductor memory device 1, according to a first embodiment of the present invention;

FIG. 2 is a plan view showing semiconductor memory device 1 of FIG. 1;

FIG. 3 is a cross-sectional view of semiconductor memory device 1 along line A-A′ shown in FIG. 2;

FIG. 4 is a cross-sectional view of semiconductor memory device 1 along line B-B′ shown in FIG. 2;

FIGS. 5A and 5B are partially enlarged cross-sectional views showing semiconductor memory device 1 of FIG. 1; FIG. 5A shows a region corresponding to region C of FIG. 2; and FIG. 5B shows a region corresponding to region D of FIG. 3;

FIG. 6 is a circuit diagram representative of semiconductor memory device 1 of FIG. 1;

FIGS. 7A-7B, 8A-8B, 9A-9B, 10A-10B, 11A-11B, 12A-12C, 13A-13C, 14A-14C, 15A-15B, 16A-16B, 17A-17B, 18A-18B, 19A-19B, 20A-20B and 21A-21B are cross-sectional views illustrating a method for manufacturing semiconductor memory device 1 of FIG. 1;

FIG. 22 is a plan view showing semiconductor memory device 2, according to a second embodiment of the present invention;

FIGS. 23A and 23B are partially enlarged cross-sectional views showing semiconductor memory device 3, according to a third embodiment of the present invention;

FIGS. 24A and 24B are partially enlarged cross-sectional views showing semiconductor memory device 4, according to a fourth embodiment of the present invention; and

FIGS. 25A and 25B are partially enlarged cross-sectional views showing semiconductor memory device 5, according to a fifth embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

In the present description, to facilitate reference to the figures, a Cartesian coordinate reference frame is used, in which the Z-direction is normal to the planar surface of the semiconductor surface and the X-direction and the Y-directions are orthogonal to the Z-direction and to each other, as indicated in the figures. Moreover, the drawings provided herein are idealized representations to illustrate embodiments of the present disclosure and are not meant to be actual views of any particular component, structure, or device. The drawings are not necessarily to scale, and the thickness and dimensions of some layers may be exaggerated for effective presentation. Variations from the shapes of the illustrations are to be expected. For example, a region illustrated as a box shape may typically have rough and/or nonlinear features. Sharp angles that are illustrated may be rounded. Like numerals refer to like components throughout.

In this detailed description, many features (e.g., “pillar bodies 40”) are present in one or more embodiments in pluralities. In some instances, the feature may be discussed collectively (e.g., as “pillar bodies 40”). Elsewhere, an individual representative instance of the same feature may be discussed. In those instances, the representative instance of the feature is presented in singular and called out by the same reference numeral (e.g., as “pillar body 40”). Unless expressly specified, the discussion of the representative instance of the feature in singular is applicable to all instances of the same feature.

First Embodiment

FIGS. 1-6 illustrate semiconductor memory device 1, according to one embodiment of the present invention. In FIG. 1, only conductive portions of semiconductor memory device 1 are shown, with insulating portions omitted. The semiconductor memory device is sometimes referred to as a storage device. As shown in FIG. 1, semiconductor memory device 1 includes source pillars 41 (each labeled “SL”) and drain pillars 42 (each labeled “BL”), which are provided adjacent multiple electrode films 31, which serve as (i) gate electrodes 100 (each labeled “WL”) for memory cell transistors, (ii) gate electrodes 100a (each labeled “PCH”) for pre-charge transistors, and (iii) lower select gate electrode films 23 and upper select gate electrode films 73. Gate electrode films 23 and 73 are each labeled “SG”.

As shown in FIGS. 1-4, semiconductor memory device 1 is formed on substrate 10 and is organized as a lower structure 20, a stacked body 30, pillar or columnar bodies 40, semiconductor members 50, ferroelectric layers 60, a upper structure 70, bit lines 80, and ST structures 90. ST structures 90 separate memory device 1 into portions 34 each including lower structure 20, stacked body 30 and upper structure 70. See, e.g., FIGS. 3-4. Stacked body 30 includes electrode films 31 and inter-electrode insulating films 32. Pillar bodies 40 are provided within stacked body 30, each pillar body including one instance of source pillars 41 and one instance of drain pillars 42, electrically isolated from each other by one instance of insulator pillars 43.

In FIGS. 1-5, the direction from substrate 10 toward stacked body 30 is taken as the “Z-direction”. In each of pillar bodies 40, the direction from source pillar 41 toward drain pillar 42 is taken as the “Y-direction”. The direction orthogonal to the Z-direction and the Y-direction is taken as the “X-direction”. Along the Z-direction, the direction that is from substrate 10 toward stacked body 30 may be referred to in this detailed description as “up”, while the opposite direction may be referred to as “down.” For example, in semiconductor memory device 1, substrate 10, lower structure 20, stacked body 30, upper structure 70, and bit lines 80 are arranged in this order upward from below. Likewise, an item located upwards from a second item may be described as being “above” the second item, and the second item may be described as being “below” the first item. Note that the Z direction does not necessarily represent the direction of Earth’s gravity.

Substrate 10 may be formed using single-crystal silicon (Si). An upper layer portion of substrate 10 may be rendered conductive by being doping with an impurity. Lower structure 20 may include insulating film 21, lower semiconductor pillars 22, lower select gate electrode film 23, and lower select gate insulating films 24.

Insulating film 21 may be formed out of silicon oxide (SiO₂). Lower semiconductor pillars 22 -- which are embedded in insulating film 21 - each extend lengthwise along the Z direction. Lower semiconductor pillar 22 may be formed out of a semiconductor material or a conductive material and is sometimes referred to as a conductive pillar 22. Lower semiconductor pillar 22 has a lower end connected to substrate 10. In this detailed description, the term “connected” refers to an electrical connection. Lower select gate electrode film 23 - which spreads over an X-Y plane -- is conductive. Lower select gate insulating film 24, which is located at the periphery of each of lower semiconductor pillars 22, is interposed between lower semiconductor pillars 22 and lower select gate electrode film 23.

Stacked body 30 is located above lower structure 20. In the semiconductor memory device 1 thus formed, conductor-including layers, each including an electrode film 31, and inter-electrode insulating films 32 are alternately formed along the Z-direction. Electrode films 31 includes a conductive material (e.g., formed out of doped polysilicon or a metal material, such as tungsten (W)). Inter-electrode insulating films 32 may be formed out of, for example, silicon oxide. In the present description, a conductor-including layer refers to the layers in the stacked body formed between adjacent inter-electrode insulating films 32. Each conductor-including layer includes an electrode film 31, the ferroelectric layer 60 and the semiconductor member 50.

Through-holes 33 -- each extending lengthwise through stacked body 30 along the Z-direction -- are provided, with through-holes 33 each accommodating one of pillar bodies 40. See, e.g., FIGS. 2-4 and 5A-5B. Through-hole 33 -- and hence pillar body 40 - is columnar or cylindrical and having, for example, an elliptical cross-section in an X-Y plane, with a major-axis along the Y-direction and a minor axis along X-direction. Of course, pillar body 40 may have any suitable shape in an X-Y plane (e.g., circular, rectangular or other suitable shapes). In this detailed description, the terms “ellipse” and “elliptical” may also include ovals, for example, in addition to a mathematically exact ellipse. Each of pillar bodies 40 may have the same X-Y plane cross-section along the Z-direction, or may taper downwards, for example.

In pillar body 40, source pillar 41 and drain pillar 42 are separated and electrically isolated from each other along the Y-direction by insulator pillar 43. See, e.g., FIGS. 5A-5B. The lower end of each source pillar 41 is connected to the upper end of a corresponding lower semiconductor pillar 22. Accordingly, source pillar 41 is connected to substrate 10 via a corresponding lower semiconductor pillar 22.

Within pillar body 40, interface 47 -- where source pillar 41 meets insulator pillar 43, for example - may be planar in an X-Z plane. Likewise, interface 48 - where drain pillar 42 meets insulator pillar 43, for example - may also be planar in an X-Z plane. Accordingly, interface 47 and interface 48 within each of pillar bodies 40 may be seen in an X-Y plane cross-section as two mutually parallel straight lines extending in the X-direction.

Source pillars 41 and drain pillars 42 may each be formed out of a conductive material (e.g., n-type doped silicon). Alternatively, source pillars 41 and drain pillars 42 may be made of a low resistivity material or a metallic material (e.g., titanium nitride (TiN)-lined tungsten (W) layer, a tungsten nitride (WN)-lined tungsten (W) layer, a molybdenum nitride (MoN) lined molybdenum (Mo) layer, or a liner-less tungsten or molybdenum or cobalt layer, or other metal layers). Insulator pillars 43 may each be formed out of a single insulating material (e.g., any of: silicon oxide, silicon nitride (SiN), or any low-k material). In some embodiments, pillar body 40 need include only a source pillar 41, a drain pillar 42, and an insulator pillar 43. In the present embodiment, source pillars 41 and drain pillars 42 are sometimes referred to as semiconductor pillars or conductive pillars, referring to pillars with semiconductor materials of a given conductivity type or pillars with low resistivity materials, such as a metal.

Semiconductor member 50 is provided between pillar body 40 and electrode film 31. Semiconductor member 50 has an annular, ring or arc shape, for example, and contacts both source pillar 41 and drain pillar 42 at each pillar body 40. See, e.g., FIG. 5A. The annular or ring shape need not be a closed loop (e.g., can be merely an arc), and may be an elliptical ring, an oval ring, a circular ring, or a rectangular or other polygonal frame that conform to pillar body 40. Semiconductor members 50 (e.g., the same number as the number of electrode films 31) are provided along the peripheries of pillar bodies 40 and are separated from each other along the Z-direction.

Semiconductor members 50 may include a semiconductor material (e.g., p-type silicon or an oxide semiconductor material, such as n-type IGZO (InGaZnO), IWO (InWO), IGZTO (InGaZnSnO)). In some embodiments, semiconductor members 50 may be formed from other oxide semiconductor materials, such as indium zinc oxide (IZO), indium tungsten oxide (IWO), or indium tin oxide (ITO). A lower leakage current and/or a higher on-current may be expected when semiconductor members 50 are formed using an oxide semiconductor. Source pillar 41, drain pillar 42, and insulator pillar 43 of pillar body 40 contact alternately, along the Z-direction, semiconductor members 50 and inter-electrode insulating films 32. See, e.g., FIGS. 3-4.

Ferroelectric layer 60 is provided between electrode film 31 and semiconductor member 50, and may be provided adjacent a surface of electrode films 31. See, e.g., FIG. 5A. Ferroelectric layers 60 may be made of a ferroelectric material (e.g., hafnium zirconium oxide (HfZrO), hafnium silicon oxide (HfSiO), hafnium aluminum oxide (HfAlO), lead zirconate titanate(PZT)). In some embodiments, ferroelectric layer 60 may be a doped hafnium oxide layer. In some examples, the doped hafnium oxide layer may include one or more of: zirconium-doped hafnium oxide (HZO), silicon-doped hafnium oxide (HSO), aluminum zirconium-doped Hafnium oxide (HfZrAlO), aluminum-doped hafnium oxide (HfO2:Al), lanthanum-doped hafnium oxide (HfO2—La), hafnium zirconium oxynitride (HfZrON), hafnium zirconium aluminum oxide (HfZrAlO) and any hafnium oxide that includes zirconium impurities.

Interface insulating layer 61 may be provided between ferroelectric layer 60 and semiconductor member 50 and between ferroelectric layer 60 and inter-electrode insulating film 32. See, e.g., FIGS. 5A-5B. Interface insulating layer 61 may be formed of an insulating material (e.g., silicon oxide, silicon nitride (SiN), silicon oxynitride (SiON)). Interface insulating layer 61 is optional (i.e., need not be provided), as ferroelectric layer 60 is generally insulating. However, when semiconductor member 50 is made of silicon and the ferroelectric layer 60 is made of HfSiO, interface insulating layer 61 can reduce silicon diffusion from semiconductor member 50 into ferroelectric layer 60. Silicon diffusion may cause degradation of polarization performance in ferroelectric layer 60. On the other hand, when semiconductor member 50 is an oxide semiconductor, there is a lesser risk of diffusion of the oxide semiconductor material into ferroelectric layer 60. In that case, because interface insulating layer 61 is not present, the electric field can be more effectively applied to ferroelectric layer 60, and degradation due to a high electric field in interface insulating layer 61 is avoided.

Upper structure 70 is located above stacked body 30. See, e.g., FIGS. 3-4. Upper structure 70 includes insulating film 71, multiple upper semiconductor pillars 72, upper select gate electrode film 73, and upper select gate insulating films 74. Insulating film 71 may be made of silicon oxide. Upper semiconductor pillars 72 may be made of a semiconductor material or a conductive material and is sometimes referred to as a conductive pillar 72. Each upper semiconductor pillar 72 extends through insulating film 71 along the Z-direction to connect to an upper end of a respective drain pillar 42.

Upper select gate electrode film 73 - which may be made of a conductive material -- is provided in insulating film 71 and spreads over an X-Y plane. Upper select gate insulating film 74 is an insulating material that is provided at the periphery of upper semiconductor pillar 72, so as to interpose between upper semiconductor pillar 72 and upper select gate electrode film 73.

Bit lines 80, each extending along the X-direction, are located above upper structure 70 and at predetermined intervals along the Y-direction. The pitch of bit lines 80 (i.e., the separation between adjacent bit lines) along the Y-direction may be, for example, several tens of nanometers (nm). Bit lines 80 are each connected at one or more upper ends of upper semiconductor pillars 72, to connect thereby drain pillars 42. Bit lines 80 may be insulated by being encased in an insulating film (not shown) above upper structure 70.

In semiconductor memory device 1, multiple ST structures 90 are provided on substrate 10, in predetermined intervals along the X-direction. As shown in FIG. 4, ST structure 90 has a plate shape spreading over a Y-Z plane. In FIGS. 2 and 4, ST structure 90 divides semiconductor memory device 1 along the X-direction between two portions 34, with each portion 34 having both lower structure 20 and stacked body 30. ST structure 90 includes conductive plate 91 between two insulating plates 92, with each plate spreading over a Y-Z plane. Insulating plates 92 are each provided between conductive plate 91 and one of two stack portions 34 along an X-direction. Conductive plate 91 may be made of a conductive material (e.g., a metal or a doped polysilicon material). The lower end of conductive plate 91 is connected to substrate 10, thereby connecting conductive plate 91 to source pillars 41 and lower semiconductor pillars 22 (via substrate 10).

Portion 34 of stacked body 30, as demarcated by ST structure 90, includes multiple pillar bodies 40 arranged in columns (labeled columns 46 in FIG. 2). Pillar bodies 40 in adjacent columns are not aligned along the X-direction. That is, between columns 46, the pillar bodies 40 are offset in the Y-direction from each other. In fact, as shown in FIG. 2, none of pillar bodies 40 in columns 46 of a portion 34 are aligned in the X-direction, so that any bit line 80 that passes through the region directly above a portion 34 contacts and connects to only a single drain pillar 42 in a portion 34. In other words, drain pillars 42 of pillar bodies 40 in each portion 34 are each connected to a different one of bit lines 80.

Method for manufacturing a semiconductor memory device of the present invention

A method for manufacturing semiconductor memory device 1, according to one embodiment is now illustrated by FIGS. 7A-7B, 8A-8B, 9A-9B, 10A-10B, 11A-11B, 12A-12C, 13A-13C, 14A-14C, 15A-15B, 16A-16B, 17A-17B, 18A-18B, 19A-19B, 20A-20B and 21A-21B. More specifically, FIG. 7B is a cross-sectional view along line E-E′ of the structure shown in FIG. 7A; and FIG. 7A is a plan view along line F-F′ of the structure shown in FIG. 7B. Likewise for FIG. 8A and FIG. 8B, FIG. 9A and FIG. 9B, FIG. 10A and FIG. 10B, FIG. 11A and FIG. 11B, FIG. 15A and FIG. 15B, FIG. 16A and FIG. 16B, FIG. 17A and FIG. 17B, FIG. 18A and FIG. 18B, FIG. 19A and FIG. 19B, FIG. 20A and FIG. 20B, and FIG. 21A and FIG. 21B.

FIG. 12B is a cross-sectional view along line E-E′ of the structure shown in FIG. 12A; FIG. 12C is a cross-sectional view along line G-G′ of the structure shown in FIG. 12A; and FIG. 12A is a plan view along line F-F′ of the structures shown in FIGS. 12B and 12C. Likewise for FIGS. 13A-13C and FIGS. 14A-14C.

First, lower structure 20 is formed on substrate 10. As shown in FIGS. 3 and 4, insulating film 21 is formed on substrate 10; and multiple lower semiconductor pillars 22, lower select gate electrode film 23, and multiple lower select gate insulating films 24 are formed in insulating film 21. The lower ends of lower semiconductor pillars 22 reach substrate 10.

Then, as shown in FIG. 3, FIG. 4, FIG. 7A, and FIG. 7B, inter-electrode insulating film 32 and sacrificial film 36 are alternately formed, one on top of another along the Z-direction above lower structure 20. Sacrificial film 36 is formed out of a different material than inter-electrode insulating film 32. For example, inter-electrode insulating film 32 may be formed out of silicon oxide; and sacrificial film 36 may be formed out of silicon nitride. The alternating inter-electrode insulating films and sacrificial films 36 provide initial form of stacked body 30.

As shown in FIGS. 8A and 8B, through-hole 33 that extends in the Z-direction into stacked body 30 is formed by an anisotropic etching step (e.g., by reactive ion etching (RIE)). As shown in FIG. 2, multiple through-holes 33 may be formed in stacked body 30. Through-holes 33 each extend through the entire length of stacked body 30.

As shown in FIG. 8A, through-hole 33 has an elliptical or oval cross section in an X-Y plane. Through-hole 33 may also have a circular or rectangular cross section in an X-Y plane. In some embodiments, although it is preferred that the cross section in an X-Y plane at any point along the Z-direction remain constant, through-hole 33 may taper downward.

Then, as shown in FIGS. 9A and 9B, sacrificial films 36 at the exposed side surface of the through-hole 33 are selectively etched with respect to inter-electrode insulating films 32, using wet etching, for example, thereby creating recesses 37 into the side surfaces of through-holes 33. Recesses 37 are arranged along the Z-direction in each through-hole 33. Each recess 37 has a ring shape cross section in an X-Y plane through through-hole 33.

Thereafter, as shown in FIGS. 10A and 10B, a semiconductor material (e.g., p-type polysilicon) is deposited conformally, so that semiconductor layer 50a is formed on the side surface of through-hole 33, including the surface of recesses 37.

Then, as shown in FIGS. 11A and 11B, an anisotropic etching step (e.g., RIE) removes the portions of semiconductor layer 50a outside of recesses 37, such that substantially only the portions of semiconductor layer 50a inside recesses 37 remain. As the portions of semiconductor 50a are mutually separated, they form semiconductor members 50.

As shown in FIGS. 12A-12C, a semiconductor material (e.g., n-type polysilicon) is then provided to fill through-hole 33, forming semiconductor pillar 45. Semiconductor pillar 45 conforms to through-hole 33 (e.g., elliptical or oval). Semiconductor pillar 45 contacts semiconductor members 50 and inter-electrode insulating films 32 along the Z-direction that are previously exposed by through-hole 33. The lower end of semiconductor pillar 45 connects to lower semiconductor pillar 22.

Then, as shown in FIGS. 13A-13C, resist mask 101 is formed on stacked body 30 with opening 102, which exposes a portion of semiconductor pillar 45. In FIG. 13A, which is a plan view of an X-Y cross section of stacked body 30, opening 102 is shown in dash lines projected onto this cross section. In this embodiment, opening 102 exposes a portion of semiconductor pillar 45 between two end portions at opposite ends of a major axis of semiconductor pillar 45. In FIG. 13A, opening 102 intersects semiconductor pillar 45 at two mutually parallel straight sides, each extending along the X-direction.

An anisotropic etching step (e.g., RIE) excavates the portion of semiconductor pillar 45 that is exposed by opening 102, leaving behind the two end portions of semiconductor pillar 45 as separate pillars. The portions of the separated pillars within stacked body 30 have been referred to herein as source pillar 41 and drain pillar 42. As described above, source pillar 41 and drain pillar 42 each extend along the Z-direction, separated from each other along the Y-direction. The portion of semiconductor pillar 45 to which lower semiconductor pillar 22 connects becomes source pillar 41.

As shown in FIGS. 14A-14C, an insulating material is then deposited to fill excavated through-hole 33. The insulating material may be of a single composition, thus forming insulator pillar 43.

Thereafter, as shown in FIGS. 15A-15B, trench 95 is formed using an anisotropic etching step (e.g., RIE). Trench 95 extends lengthwise along the Y-direction and reaches depth-wise to substrate 10 along the Z-direction through stacked body 30 and lower structure 20, Trench 95 divides stacked body 30 and lower structure 20 into multiple portions 34 at predetermined intervals along the X-direction.

Then, as shown in FIGS. 16A-16B, sacrificial films 36 are removed via trench 95 using an isotropic etching step (e.g., a suitable wet etch), forming cavity 96 after sacrificial films 36 are removed.

Thereafter, as shown FIGS. 17A-17B, interface insulating layer 61 is formed on the inner surfaces of trench 95 and cavity 96. Interface insulating layer 61 is an optional barrier or adhesive layer. Therefore, interface insulating layer 61, being optional, is not illustrated in the remainder of the drawings.

A ferroelectric material is deposited via trench 95, as shown in FIGS. 18A-18B. (Interface insulating layer 61 is now omitted.) As shown in FIG. 18B, ferroelectric layer 60 is formed conformally on the inner surfaces of trench 95 and cavity 96. When interface insulating layer 61 is provided, ferroelectric layer 60 is formed on the exposed surfaces of interface insulating layer 61.

As shown in FIGS. 19A-19B, a conductive material is deposited into trench 95 and cavity 96. Thereafter, an anisotropic etching step (e.g., RIE) removes the portion of the conductive material in trench 95, so that the portions of the conductive material located in cavities 96 are separated from each other. These portions of the conductive material in cavities 96 form electrode films 31. At this time, ferroelectric layer 60 and interface insulating layer 61 on the side surfaces of trench 95 may be removed. FIGS. 1 and 3 show the embodiment in which ferroelectric layer 60 is removed from the side surface of trench 95.

Then, as shown in FIGS. 20A-20B, an insulating material is deposited on the inner surface of the trench 95. An anisotropic etching step (e.g., RIE) then removes the insulating material from the bottom surface of trench 95, leaving the insulating material on the side surfaces of the trench 95 as insulating plates 92.

As shown in FIGS. 21A and 21B, a conductive material then fills trench 95, forming conductive plate 91 between the insulating plates 92 in trench 95. The lower end of conductive plate 91 connects substrate 10. ST structure 90 is thereby complete.

Then, as shown in FIGS. 1-4, insulating film 71 is formed on stack body 30. Then, upper semiconductor pillars 72, upper select gate electrode film 73, and upper select gate insulating films 74 are formed in insulating film 71. The lower end of upper semiconductor pillar 72 connects the upper end of the drain pillar 42. Upper structure 70 is thus formed on stacked body 30. Bit lines 80 are then formed on insulating film 71. Bit lines 80 connect to the upper ends of upper semiconductor pillars 72. Then, an insulating film (not illustrated) is provided to cover bit lines 80 on upper structure 70. Thus, semiconductor memory device 1 is formed, in accordance with one embodiment of the present invention.

Operations

In semiconductor memory device 1, as shown in FIGS. 5B and 6, memory cell transistor 100 is formed where one of pillar bodies 40 and one of electrode films 31 meet. In memory cell transistor 100, source pillar 41 provides a source region, drain pillar 42 provides a drain region, semiconductor member 50 provides a channel region, and electrode film 31 provides a gate electrode. A potential is applied from the bit line 80 to the drain pillar 42 via the upper semiconductor pillar 72; and a potential is applied from the conductive plate 91 to the source pillar 41 via the substrate 10 and the lower semiconductor pillar 22. When a potential difference is applied to drain pillar 42 and source pillar 41 relative to the gate electrode, the threshold voltage of memory cell transistor 100 is changed as a result of a change in orientation of an electric field polarization in ferroelectric layer 60. The threshold voltage thus set represents the data stored in memory cell transistor 100. More than one bit may be stored in memory cell transistor 100 by polarizing ferroelectric layer 60 in more than one domain, or by forming ferroelectric layer 60 out of an anti-dielectric material.

A portion of memory cell transistors 100 may serve as pre-charge transistors (labeled pre-charge transistor 100a in FIGS. 1 and 6). Pre-charge transistor 100a, when rendered conducting, connects drain pillar 42 and source pillar 41, thereby equalizing the voltages on drain pillar 42 to source pillar 41.

In lower structure 20, source-side select transistor 25 is formed where one of lower semiconductor pillars 22 and one of lower select gate electrode films 23 meet. In source-side select transistor 25, lower semiconductor pillar 22 provides a channel region, lower select gate electrode film 23 provides a gate electrode, and lower select gate insulating film 24 provides a gate insulating or dielectric film. Source-side select transistor 25 controls whether or not source pillar 41 connects to substrate 10.

Substrate 10, which is connected to lower semiconductor pillar 22, can also serve as a channel region. For such a purpose, a source capacitance that includes the substrate capacitance can be formed by inverting to n-type the portion of substrate 10 that contacts conductive plate 91, for example, while the remainder portion of substrate 10 is held at p-type. In such a configuration, performance degradation due to insufficient capacitance that may develop at the source side during a read operation may be avoided. When source pillar 41 has a sufficient capacitance, semiconductor memory device 1 can be operated without lower select gate electrode film 23.

In upper structure 70, drain-side select transistor 75 is formed where one of upper semiconductor pillars 72 and one of upper select gate electrode films 73 meet. In drain-side select transistor 75, upper semiconductor pillar 72 provides a channel region, upper select gate electrode film 73 provides a gate electrode, and upper select gate insulating film 74 provides a gate insulating or dielectric film. Drain-side select transistor 75 controls whether or not drain pillar 42 connects bit line 80.

FIG. 6 shows a memory string in semiconductor memory device 1, in which multiple memory cell transistors 100 are each connected in series with drain-side select transistor 75 and source-side select transistor 25. The memory string is connected in series between bit line 80 and substrate 10. Memory cell transistors 100 each store data. One or more memory cell transistors 100 may serve as a pre-charge transistor (e.g., pre-charge transistor 100a), which connects drain pillar 42 and source pillar 41. As a pre-charge transistor, pre-charge transistor 100a would not store data.

Although source pillar 41 connects to substrate 10 via source-side select transistor 25, the voltage applied to source pillar 41 may be different from the voltage applied to elsewhere in substrate 10. For example, an n-well may be formed in an upper portion of substrate 10, a p-well may be formed in the n-well, and lower semiconductor pillar 22 and conductive plate 91 may connect to the p-well. In such a configuration, the path from conductive plate 91 to source pillar 41 via the p-well and lower semiconductor pillar 22 can be electrically isolated from the other portions of substrate 10. As a result, any voltage (e.g., any positive voltage) can be applied to conductive plate 91 and applied to source pillar 41, while applying the ground potential (e.g., “VSS”) to substrate 10.

Although source-side select transistors 25 are all connected in common to substrate 10 in the embodiments described herein, the present invention is not so limited. Multiple source lines may be provided between substrate 10 and lower structure 20, and source pillars 41 may be connected to such source lines via source-side select transistors 25. For example, each source line may extend in the X-direction, and source pillars 41 of pillar bodies 40 that are arranged in one column along the X-direction may be connected to a common source line. In that configuration, different voltages may be applied to source pillars 41 situated at different Y-direction positions, so that pre-charge transistors 100a need not be provided. Without having to provide pre-charge transistors, for a given memory density, the number of layers in stacked body 30 may be reduced, as the voltages can be applied to source pillars 41 via the source lines.

Advantages

In semiconductor memory device 1, semiconductor members 50 are independently provided for each of electrode films 31, so that semiconductor members 50 each correspond to one of memory cell transistors 100. Consequently, reduced leakage current is achieved between adjacent ones of memory cell transistors 100 in the Z-direction. Reliable operations in semiconductor memory device 1 is thereby enhanced.

In semiconductor memory device 1, interface 47 between the source pillar 41 and insulator pillar 43 and interface 48 between drain pillar 42 and insulator pillar 43 are substantially parallel. Therefore, the distance between source pillar 41 and drain pillar 42 is substantially constant. Stability in the threshold voltage of memory cell transistor 100, the on-current, and the leakage current in the off-state are all achieved. Accordingly, reliable operations of the semiconductor memory device 1 are also achieved.

According to one embodiment of the present invention, semiconductor pillar 45 is formed according to the process illustrated by FIGS. 12A-12C. Semiconductor pillar 45 is subsequently subdivided into source pillar 41 and drain pillar 42 according to the process illustrated in FIGS. 13A-13C. Source pillar 41 and drain pillar 42 are thus formed using very few process steps, resulting in a reduced manufacturing cost.

Although source pillars 41 connect to conductive plate 91 in the embodiments described herein, other connections are within the scope of the present invention are possible. For example, source pillars 41 may connect to a circuit that may be formed in substrate 10.

Source pillar 41 may be left floating. In such a configuration, ST structure 90 may have the interior of trench 95 filled by insulating plate 92, without providing conductive plate 91. In that configuration, in forming trench 95 according to the process illustrated in FIGS. 15A-15B, the lower end of trench 95 may be positioned in insulating film 21 without trench 95 reaching substrate 10.

In some embodiments, an oxide-nitride-oxide (ONO) film may be provided instead of ferroelectric layer 60. For example, in the process illustrated by FIGS. 18A-18B, an ONO film may be formed, rather than ferroelectric layer 60. In such a semiconductor memory device, the threshold voltage of the memory cell transistor is determined by the charge stored in the ONO film.

Second Embodiment

FIG. 22 is a plan view showing semiconductor memory device 2, according to a second embodiment of the present invention.

As shown in FIG. 22, semiconductor memory device 2 differs from the semiconductor memory device 1 of FIGS. 1-6 in that pillar bodies 40 are obliquely arranged. In other words, as shown in FIG. 22, pillar body 40 has an elliptical cross section in an X-Y plane oriented such that major axis 40L of pillar body 40 intersects the Y-direction (e.g., along the length of conductive plate 91) at an angle θ. It is advantageous for angle θ to be at least 3 degrees, but not more than 45 degrees, and more preferably between 10 degrees and 20 degrees. Major axis 40L of pillar body 40 is, for example, between 80 nm and 200 nm, while minor axis 40S of pillar body 40 is preferably between 50 nm and 120 nm. According to this second embodiment, the “Y-direction” is taken to be the direction in which conductive plate 91 extends.

By orienting major axis 40L of pillar body 40 at an oblique angle to the Y-direction, which is taken to be the direction along which conductive plate 91 extends, the length of pillar body 40 in the Y-direction is reduced, so that a narrower pitch of bit lines 80 can be achieved. As a result, semiconductor memory device 2 can achieve a higher degree of integration. This second embodiment achieves otherwise substantially the same configuration, the same operations, and the same effects as the first embodiment described herein. Also, this second embodiment may be manufactured using substantially the same method as that for manufacturing the first embodiment described herein.

Third Embodiment

FIGS. 23A-23B are partially enlarged cross-sectional views showing semiconductor memory device 3, according a third embodiment of the present invention. In particular, FIG. 23A shows a region corresponding to region C for semiconductor memory device 1 of FIG. 2; and FIG. 23B shows a region corresponding to region D for semiconductor memory device 1 of FIG. 3.

In semiconductor memory device 3, as shown in FIGS. 23A-23B, insulator pillar 43 includes core insulating pillar 43a and liner insulating film 43b. Core insulating pillar 43a, which extends the length of insulator pillar 43 along the Z-direction, is separated from source pillar 41, drain pillar 42, and semiconductor member 50 by liner insulating film 43b. Liner insulating film 43b contacts source pillar 41, drain pillar 42, and semiconductor member 50.

Core insulating pillar 43a may be formed out of silicon oxide deposited by chemical vapor deposition (CVD), and liner insulating film 43b may be formed by thermal oxidation of the silicon in source pillar 41, drain pillar 42 and semiconductor member 50. In other embodiments, liner insulating film 43b may be formed out of a high-k material (e.g., aluminum oxide or alumina (Al₂O₃)).

In this third embodiment, liner insulating film 43b has high-quality (i.e., having few defects) suitable for being located adjacent semiconductor member 50, which is a channel region of memory cell transistor 100. Liner insulating film 43b reduces trapped fixed charge between source pillar 41 and drain pillar 42, which improves the electrical characteristics of memory cell transistor 100. At the same time, core insulating pillar 43a may be more efficiently formed by CVD. This third embodiment achieves otherwise substantially the same configuration, the same operations, and the same effects as the first embodiment described herein. Also, this third embodiment may be manufactured using substantially the same method as that for manufacturing the first embodiment described herein.

Fourth Embodiment

FIGS. 24A and 24B are partially enlarged cross-sectional views showing semiconductor memory device 4, according to a fourth embodiment of the present invention. In particular, FIG. 24A shows a region corresponding to region C of semiconductor memory device 1 of FIG. 2; and FIG. 24B shows a region corresponding to region D of semiconductor memory device 1 of FIG. 3.

As shown in FIGS. 24A-24B, semiconductor memory device 4 differs from semiconductor memory device 3 in that an air gap 43c is formed, instead of core insulating pillar 43a. A gas (e.g., ambient air, or an inert gas) may fill air gap 43c. As described above, liner insulating film 43b contacts source pillar 41, drain pillar 42, and semiconductor member 50. Air gap 43c is separated from source pillar 41, drain pillar 42, and semiconductor member 50 by liner insulating film 43b.

Providing air gap 43c in insulator pillar 43 reduces the parasitic capacitance between source pillar 41 and drain pillar 42, between source pillar 41 and semiconductor member 50 (i.e., a channel region), and between drain pillar 42 and semiconductor member 50. As a result, a higher speed is achieved in memory cell transistor 100. This fourth embodiment achieves otherwise substantially the same configuration, the same operations, and the same effects as the first embodiment described herein. Also, this fourth embodiment may be manufactured using substantially the same method as that for manufacturing the first embodiment described herein.

Fifth Embodiment

FIGS. 25A-25B are partially enlarged cross-sectional views showing semiconductor memory device 5, according to a fifth embodiment of the present invention. FIG. 25A shows a region corresponding to region C of semiconductor memory device 1 of FIG. 2; and FIG. 25B shows a region corresponding to region D of semiconductor memory device 1 of FIG. 3.

As shown in FIGS. 25A-25B, semiconductor memory device 5 differs from semiconductor memory device 3 in that core metal pillar 43d is included, instead of core insulating pillar 43a. Core metal pillar 43d may be made of a conductive material (e.g., titanium nitride (TiN), or tungsten (W)). As described above, liner insulating film 43b contacts source pillar 41, drain pillar 42, and semiconductor member 50. Core metal pillar 43d is separated from source pillar 41, drain pillar 42, and semiconductor part 50 by liner insulating film 43b. The upper end portion or the lower end portion of core metal pillar 43d connects to an interconnect (not illustrated).

Oxide semiconductors have large bandgaps. Also, holes are substantially not generated in oxide semiconductors, so that, when semiconductor member 50 is formed out of an oxide semiconductor, it is possible that a suitable electric field may not be efficiently applied to ferroelectric layer 60. By providing core metal pillar 43d instead of insulator pillar 43, core metal pillar 43d may serve as a back gate of memory cell transistor 100. As a result, core metal pillar 43d and electrode film 31 can effectively apply a suitable electric field to ferroelectric layer 60, enabling reliable polarization in ferroelectric layer 60. This fifth embodiment achieves otherwise substantially the same configuration, the same operations, and the same effects as the first embodiment described herein. Also, this fifth embodiment may be manufactured using substantially the same method as that for manufacturing the first embodiment described herein.

Further Embodiments

According to yet other embodiments of the present invention, source pillars 41 and drain pillars 42 may be formed using a metallic material (e.g., tungsten, often with a barrier or an adhesive liner, such as titanium nitride (TiN)). For those embodiments, through-hole 33 may be first filled with a suitable sacrificial material (e.g., silicon nitride (SiN), silicon carbon (SiC), amorphous silicon). Thereafter, a photo-lithographical step masks and remove the sacrificial material from a central portion of through-hole 33, in a similar manner as described above in conjunction with FIGS. 13A-13B. Then, an insulating material (e.g., silicon oxide) is deposited in the excavated cavity to form insulator pillar 43. The remaining sacrificial material in through-hole 33 may be removed and replaced by a metallic material in a subsequent step to provide source pillar 41 and drain pillar 42. To allow effective removal of the sacrificial material, the sacrificial material is preferably selected to have a substantial etch selectivity to the material in insulator pillar 43.

Alternatively, rather than filling through-hole 33 with the sacrificial material or the target material for source pillars 41 and drain pillars 42, through-hole 33 may be filled initially with the target insulator material for insulator pillar 43 and then excavated subsequently where source pillars 41 and drain pillar 43 are intended in photo-lithographical step. The excavated cavities may then be filled with the sacrificial material (e.g., for metal source and drain pillars) or target source and drain materials (e.g., for polysilicon source and drain pillars).

The embodiments of the present invention described herein are merely exemplary and is not limited to be limiting of the present invention. Numerous modification and variations within the scope of the present invention are possible. For example, the materials of the components are not limited to the examples described above. Also, conductivity types of source pillar 41, drain pillar 42, and semiconductor member 50 may be reversed. Furthermore, in this detailed description, various embodiments or examples of the present invention may be implemented in numerous ways, including as a process; an apparatus; a system; and a composition of matter. A detailed description of one or more embodiments of the invention is provided above along with accompanying figures that illustrate the principles of the invention. The scope of the invention is limited only by the claims and the invention encompasses numerous alternatives, modifications, and equivalents. For clarity, technical material that is known in the technical fields related to the invention has not been described in detail so that the invention is not unnecessarily obscured. The present invention is defined by the appended claims.

Claims

1. A memory device, comprising: a stacked body comprising a plurality of alternately provided conductor-including layers and insulating films, provided one on top of another along a first direction; anda plurality of pillar bodies, each pillar body comprising (i) first and second conductive pillars each extending along the first direction through the stacked body; and (ii) an insulator pillar provided between the first and second conductive pillars, such that the first and second conductive pillars are electrically isolated from each other;wherein the conductor-including layers each comprises (i) adjacent each pillar body, a semiconductor member in contact with the first and second conductive pillars; (ii) an electrode film and (iii) a ferroelectric layer between the semiconductor member and the electrode film, and wherein the semiconductor members in the plurality of conductor-including layers are separated from each other in the first direction.

2. The memory device of claim 1, wherein the first and second conductive pillars each comprise a semiconductor material of a first conductivity and wherein the semiconductor member comprises a semiconductor material of a second conductivity opposite the first conductivity.

3. The memory device of claim 1, wherein the first and second conductive pillars each comprise a metallic material and wherein the semiconductor member comprises an oxide semiconductor.

4. The memory device of claim 3, wherein the oxide semiconductor comprises one or more of: indium gallium zirconium oxide (IGZO), indium tungsten oxide (IWO), indium zinc oxide (IZO), indium tin oxide (ITO) and indium gallium zinc oxide (IGZTO).

5. The memory device of claim 1, wherein the ferroelectric layer comprises one or more of: hafnium zirconium oxide (HfZrO), hafnium silicon oxide (HfSiO), hafnium aluminum oxide (HfAlO), lead zirconate titanate(PZT), zirconium-doped hafnium oxide (HZO), silicon-doped hafnium oxide (HSO), aluminum zirconium-doped Hafnium oxide (HfZrAlO), aluminum-doped hafnium oxide (HfO2—Al), lanthanum-doped hafnium oxide (HfO2—La), hafnium zirconium oxynitride (HfZrON), hafnium zirconium aluminum oxide (HfZrAlO) and any hafnium oxide that includes zirconium impurities.

6. The memory device of claim 1, wherein the insulator pillar comprises an insulating material of a single composition.

7. The memory device of claim 1, wherein the insulator pillar comprises a core metal pillar electrically isolated from the first and second conductive pillars by a liner insulating film.

8. The memory device of claim 1, wherein the insulator pillar comprises a liner insulating film enclosing an air gap.

9. The memory device of claim 1, wherein each semiconductor member is in an annular or a ring form, surrounding a respective pillar body.

10. The memory device of claim 1, wherein, as seen in a cross section of the pillar body that is normal to the first direction, the first conductive pillar and the insulator pillar has a first interface and the second conductive pillar and the insulator pillar has a second interface, the first and second interfaces being substantially parallel lines.

11. The memory device of claim 1, the memory device being formed on a substrate, the memory device further comprising a plurality of interconnect conductors, wherein the first conductive pillar contacts the substrate, and the second conductive pillar is connected to one of the interconnect conductors.

12. The memory device of claim 11, further comprising: a conductive plate that has a substantially planar surface that extends in both the first direction and a second direction orthogonal to the first direction, thereby dividing the stacked body along a third direction that is orthogonal to both the first and the second directions; andan insulating plate between the conductive plate and the stacked body, electrically isolating the conductive plate from the stacked body.

13. The memory device of claim 12, wherein the substrate is conductive and the conductive plate is electrically connected to the substrate.

14. The memory device of claim 12, wherein the interconnect conductors each extend along the third direction, wherein the pillar bodies are organized as columns arranged along the third direction, the pillar bodies within each column being arranged along the second direction and wherein adjacent pillar bodies in adjacent columns are offset along the second direction, such that the adjacent pillars are positioned to be contacted by separate ones of the interconnect conductors.

15. The memory device of claim 12, wherein the pillar bodies are each elliptical having a major axis forming an oblique angle relative to the second direction.

16. The memory device of claim 12, wherein the angle is between 3 degrees and 45 degrees, and preferably between 10 degrees and 20 degrees.

17. A process for forming a memory device, comprising: forming a stacked body of alternating sacrificial films and insulating films along a first direction;forming a through-hole in the stacked body, the through-hole extending in the first direction;etching the sacrificial films at a side surface of the through-hole to create a plurality of recesses into the sacrificial films;forming a semiconductor layer on the side surface of the through-hole,anisotropically etching the semiconductor layer to remove portions of the semiconductor layer outside of the recesses, portions of the semiconductor layer remaining in the recesses forming semiconductor members;filling the through-hole to form an initial conductive pillar;subdividing the initial conductive pillar into first and second conductive pillars by removing a portion of semiconductor pillar between the first and second conductive pillars;providing an insulator pillar between the first and the second conductive pillars, the insulator pillar electrically isolating the first conductive pillar from the second conductive pillar;removing the sacrificial films to create cavities between the insulating films and exposing the semiconductor members;forming a ferroelectric layer on the exposed surfaces of the semiconductor members and the insulating films in cavities; andfilling the cavities with a conductive material thereby providing a plurality of electrode films.

18. The process of claim 17, wherein the first and second conductive pillars each comprise a semiconductor material of a first conductivity and wherein the semiconductor layer is a semiconductor material of a second conductivity opposite the first conductivity.

19. The process of claim 17, wherein the first and second conductive pillars each comprise a metallic material and wherein the semiconductor layer comprises an oxide semiconductor.

20. The process of claim 19, wherein the oxide semiconductor comprises one or more of: indium gallium zirconium oxide (IGZO), indium tungsten oxide (IWO), indium zinc oxide (IZO), indium tin oxide (ITO) and indium gallium zinc oxide (IGZTO).

21. The process of claim 17, wherein the ferroelectric layer comprises one or more of: hafnium zirconium oxide (HfZrO), hafnium silicon oxide (HfSiO), hafnium aluminum oxide (HfAlO), lead zirconate titanate(PZT), zirconium-doped hafnium oxide (HZO), silicon-doped hafnium oxide (HSO), aluminum zirconium-doped Hafnium oxide (HfZrAlO), aluminum-doped hafnium oxide (HfO2—Al), lanthanum-doped hafnium oxide (HfO2—La), hafnium zirconium oxynitride (HfZrON), hafnium zirconium aluminum oxide (HfZrAlO) and any hafnium oxide that includes zirconium impurities.

22. The process of claim 17, wherein the insulator pillar is provided by filling an insulating material of a single composition to fill the removed portion of the initial conductive pillar.

23. The process of claim 17, further comprising forming a trench in the stacked body, the trench extending along both the first direction and a second direction orthogonal to the first direction, wherein the removing of sacrificial films, the forming of the ferroelectric layer and the filling of cavities are accomplished using the trench for introducing etchant for the sacrificial films, for depositing a ferroelectric material and for depositing the conductive material.

24. The process of claim 23, further comprising removing portions of the conductive material on the side surface of the trench by an anisotropic etching step of the conductive material.