This application claims priority to and the benefit of Korean Patent Application No. 10-2015-0124769, filed on Sep. 03, 2015, the disclosure of which is incorporated herein by reference in its entirety.
1. Field of the Invention
The present invention relates to a memory device for devices displaying images, and more particularly, to a memory device for a display device in which image data are injected in various directions.
2. Discussion of Related Art
A display device is operated to display screen images on a display panel. The display device is generally used in various electronic equipment such as note-book computers, smart-phones, etc. A screen image is displayed by supplying image data to pixels arranged at cross points of gate lines and source lines of the display panel.
Such display device generally includes a memory device (or a semiconductor memory device) for supplying the image data to the display panel. The semiconductor memory device includes a memory array including a plurality of memory cells which are arranged at cross points of word lines and data lines of the memory array. The image data are stored in the plurality of memory cells and transferred from the plurality of memory cells to the display panel.
The image data are serially injected to the pixels arranged at the cross points of a selected gate line and source lines of the display panel. The image data may be injected to the pixels of the display panel in various injection directions and/or sequences based on the orders of selecting the gate lines and the source lines of the display panel. Thus, it is required to provide the display panel with the image data in directions and/or sequences corresponding to the image data injection directions and/or sequences.
However, in cases that the number of data lines of the memory array is not matched with the number of source lines of the display panel, a mismatching of operation timing occurs between the semiconductor memory device and the display panel.
Therefore, it is desired that a memory device is improved so that the image data is properly provided to the display panel in various image data injection directions and/or sequences, and no mismatching of operation timing occur between the memory device and the display panel in cases that the number of data lines of the memory device is different than the number of source lines of the display panel.
The present invention is directed to a semiconductor memory device adaptable for a multi-style display device.
According to an aspect of the present invention, there is provided a memory device including a memory array that stores image data of pixels arranged at cross points of gate lines and source lines of a display panel, the memory array including a plurality of memory cells arranged at cross points of word lines and data lines of the memory array, a row selection unit that receives a row selection address and selects the word lines of the memory array corresponding to a row selection address, a column selection unit that receives a column selection address and selects the data lines of the memory array corresponding to a column selection address to input/output the image data of the selected data lines, a last address storing unit that stores a last row address and a last column address, wherein the last row address is the row selection address for selecting a word line of a memory cell storing image data of a pixel arranged at a cross point of a last gate line and a last source line, wherein the last column address is the column selection address for selecting a data line of a memory cell storing the image data of the pixel arranged at the cross point of the last gate line and the last source line, and a selection address generating unit that provides the row selection address and the column selection address to the row selection unit and the column selection unit, respectively, wherein the row selection address and the column selection address are based on an external row address and an external column address in a normal mode in which the memory cells are selected based on signals externally supplied, and the row selection address and the column selection address are based on the last row address and the last column address in an auto mode in which the memory cells are selected based on signals internally generated.
The selection address generating unit may include an auto address generating unit that generates an auto row address and an auto column address, wherein the auto row address and the auto column address are generated based on the last row address and the last column address provided from the last address storing unit, and an address selecting unit that generates the row selection address and the column selection address to the row selection unit and the column selection unit, respectively, the address selecting unit receiving a mode selection signal which is activated in the auto mode and not activated in the normal mode.
The address selecting unit may include a start row selection unit that generates a start row address based on the first row address, a row counter that receives and counts the start row address to generate the auto row address, a start column selection unit that generates a start column address based on the first column address, and a column counter that receives and counts the start column address to generate the auto column address.
The above and other objects, features and advantages of the present invention will become more apparent to those of ordinary skill in the art by describing in detail exemplary embodiments thereof with reference to the accompanying drawings, in which:
Exemplary embodiments of the present invention will be described in detail below with reference to the accompanying drawings. While the present invention is shown and described in connection with exemplary embodiments thereof, it will be apparent to those skilled in the art that various modifications can be made without departing from the spirit and scope of the present invention. Thus, the scope of the present invention is not limited to these particular following embodiments.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” or “includes” and/or “including” when used in this specification, specify the presence of stated features, regions, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components, and/or groups thereof.
It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another, rather than ordering the elements. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present invention.
In the present disclosure, a ‘normal mode’ is a mode in which the memory cells are selected based on signals (or address data) externally supplied. An ‘auto mode’ is a mode in which the memory cells are selected based on signals (or address data) internally generated.
In this exemplary embodiment of a semiconductor memory device of the present invention, the operation is performed in the auto mode when image data are provided to a display panel.
A semiconductor memory device according to an exemplary embodiment of the present invention will be described in detail with reference to the drawings.
Referring to
The memory cells MCs store image data DAIMG of pixels PIXs arranged at cross points of gate lines GLs and source lines SLs of a display panel PAN. The gate lines GLs have serial numbers 1 to i, and the source lines SLs have serial numbers 1 to j. Here, ‘ ’ and ‘j’ are natural numbers which are greater than 1. In this exemplary embodiment, the image data DAIMG all the pixels PIXs of the display panel PAN consist of one frame of a screen image IMGIF.
Also, in this exemplary embodiment, the number j of the source lines SLs of the display panel PAN is greater than the number n of the data lines DLs of the memory array MARR. However, the present invention is not limited to this exemplary embodiment. The inventive concepts of the present invention can be applicable to a display device where the number of source lines of a display panel is equal to or smaller than the number of data lines of a memory array.
In this embodiment, the image data DAIMG of one gate line GL of the display panel PAN are stored in the memory cells MCs of multiple word lines WLs, as shown in
In
In
The structure of the memory array MARR can be a single-bank structure, as shown in
Also, the structure of the memory array MARR can be a multi-bank structure, as shown in
In the embodiment of
In the multi-bank structure, the serial number of data lines DL is given in order of the first memory bank BANK<1>, the second memory bank BANK<2>, the third memory bank BANK<3> and the forth memory bank BANK<4>.
Referring to
Referring back to
The row selection unit 100 includes a row decoder 110 and a row driver 130. The row decoder 100 decodes the row selection address SERAD. The row driver 110 is driven to select the word lines WLs of the memory array MARR corresponding to the address decoded by the row decoder 110.
The column selection unit 200 is driven to select the data lines DLs of the memory array MARR corresponding to a column selection address SECAD. The column selection unit 200 is driven to input/output the image data DAIMG of the selected data line DL.
The column selection unit 200 includes a column decoder 210 and a sensing input/output unit 230. The column decoder 210 decodes the column selection address SECAD.
The sensing input/output unit 230 is driven to select the data line DL of the memory array MARR corresponding to the address decoded by the column decoder 310. The sensing input/output unit 230 is driven to input/output the image data DAIMG of the selected data line DL.
The last address storing unit 300 stores a last row address LRAD and a last column address LCAD. Herein, the last row address LRAD is the row selection address SERAD for selecting a word line of the memory cell MC storing the image data DAIMG of the last pixel PIX<i,j> arranged at the cross point of a last gate line (or a gate line with the last serial number) GL<i> and a last source line (or a source line with the last serial number) SL<j>. The last column address LCAD is the column selection address SECAD for selecting a data line of the memory cell MC storing the image data DAIMG of the last pixel PIX<i,j> arranged at the cross point of the last gate line GL<i> and the last source line SL<j>.
Referring back to
Referring back to
The selection address generating unit 400 comprises an auto address generating unit 410 and an address selecting unit 460.
The auto address generating unit 410 generates an auto row address ATRD and an auto column address ATCD. Herein, the auto row address ATRD and the auto column address ATCD are based on the last row address LRAD and the last column address LCAD.
The address selecting unit 460 generates the row selection address SERAD and the column selection address SECAD. Herein, the row selection address SERAD and the column selection address SECAD are based on the external row address ERAD and the external column address ECAD in the normal mode. The row selection address SERAD and the column selection address SECAD are based on the auto row address ATRD and the auto column address ATCD in the auto mode.
The auto row address ATRD and the auto column address ATCD are described in detail.
In the forward row-forward column operation XF-YF of
In the forward row-forward column operation XF-YF of
The forward row-forward column operation XF-YF of
In the backward row-forward column operation XB-YF of
As illustrated in
In the backward row-forward column operation XB-YF of
The backward row-forward column operation XB-YF of
In the forward row-backward column operation XF-YB of
As illustrated in
In the forward row-backward column operation XF-YB of
Also, the auto column address ATCD is generated with backward counting from the column selection address SECAD selecting a last data line (or a data line with the last serial number) DL<512>with respect to the word-lines (for example, WL<1>, WL<3>, . . . , and WL<231>) of the memory cells MCs not corresponding to the pixels PIXs arranged at the last source line SL<j>.
The forward row-backward column operation XF-YB of
In the back row-back column operation XB-YB of
In the back row-back column operation XB-YB of
Also, the auto column address ATCD is generated with backward counting from the column selection address SECAD selecting the last data line DL<512> with last serial number with respect to the word-lines (for example, WL<1>, WL<3>, . . . , and WL<231>) of the memory cells MCs not corresponding to the pixels PIXs arranged at the last source line SL<j>.
The back row-back column operation XB-YB of
As described above, the semiconductor memory device of the present invention can perform various operations in terms of the directions of selecting word lines and the data lines of a memory array that stores image data to be provided to a display panel. Accordingly, the semiconductor memory device of the present invention can be effectively implemented in a display device in which image data injection is performed in various directions.
Referring to
The start row selection unit 411 generates a start row address STRAD based on the first row address FRAD. The row counter 413 generates the auto row address ATRD with counting the start row address STRAD. The start column selection unit 415 generates a start column address STCAD based on the first column address FCAD. The column counter 417 generates the auto column address ATCD with counting the start column address STCAD.
The start row selection unit 411 monitors the first row address FRAD and the start column selection unit 415 monitors the first column address FCAD.
In
The start row address STRAD and the start column address STCAD are described in detail.
In the forward row-forward column operation XF-YF of
In the backward row-forward column operation XB-YF of
As shown
In the forward row-forward column operation XF-YF of
In the forward row-backward column operation XF-YB of
With respect to the word lines of the memory cells storing image data of pixels of one gate line, the start row address STRAD is the row selection address SERAD corresponding to the word lines WL<2> of the memory cell MC storing the image data DAIMG of the pixel arranged at a cross point of the last source line SL<j> and the one gate line.
In the backward row-backward column operation XB-YB of
In the forward row-backward column operation XF-YB of
Also, the start column address STCAD is the column selection address SECAD selecting the last data line DL<512> with respect to the word lines (for example, WL<1>, WL<3>, . . . , and WL<231>) of the memory cells MCs not corresponding to the pixels PIXs arranged at the last source line SL<j>.
Referring back to
The row selection address SERAD and the column selection address SECAD are based on the external row address ERAD and the external column address ECAD in the normal mode. Also, the row selection address SERAD and the column selection address SECAD are based on the auto row address ATRD and the auto column address ATCD in the auto mode.
In this embodiment, the semiconductor memory device of the present invention may include a mode register unit MRS. The mode register unit MRS generates the mode selection signal XMST according to a command or by cutting fuses.
Also, the row backward signal XRDS and the column backward signal XCDS may be configured to be a part of the external row address ERAD and the external column address ECAD. In this embodiment, providing more pins for the row backward signal XRDS and the column backward signal XCDS is not necessitated.
When the memory array has the multi-bank structure, the row backward signal XRDS and the column backward signal XCDS may be configured to be a part of the external row address ERAD and the external column address ECAD for selecting one of the multiple memory banks.
In
It will be apparent to those skilled in the art that various modifications can be made to the above-described exemplary embodiments of the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention covers all such modifications provided they come within the scope of the appended claims and their equivalents.
Number | Date | Country | Kind |
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10-2015-0124769 | Sep 2015 | KR | national |
Number | Name | Date | Kind |
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20080122855 | Sonoyama | May 2008 | A1 |
20080297525 | Rai | Dec 2008 | A1 |
20120127185 | Chowdhry | May 2012 | A1 |
Number | Date | Country | |
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20170069300 A1 | Mar 2017 | US |