BRIEF DESCRIPTION OF THE FIGURES
FIG. 1 is composed of FIGS. 1(a) and 1(b), which are respectively a schematic cross-sectional view of a conventional DRAM memory cell structure which has a trenched capacitor, and an equivalent circuit.
FIG. 2 is a schematic cross-sectional view of a memory cell which is a first embodiment of the invention comprising four layers of capacitors.
FIG. 3 shows an equivalent circuit to the memory cell of FIG. 2.
FIG. 4 is a schematic cross-sectional view of a memory cell which is a second embodiment of the invention comprising two capacitor layers.
FIG. 5 shows an equivalent circuit to the memory cell of FIG. 4.
FIG. 6, which is composed of FIGS. 6(a) and 6(b), shows schematically a third embodiment of the invention which is a ferroelectric memory device having cross point memory cells.
FIG. 7 shows a fourth embodiment of ferroelectric memory device which has an isolation layer.
FIG. 8 shows an equivalent circuit diagram of the memory cells of FIG. 6 and FIG. 7.
FIG. 9 shows experimental results comparing a single layer capacitor structure with a multilayer structure which is an embodiment of the invention.