The present disclosure is directed to a microelectromechanical systems (MEMS) device with electrodes and a dielectric.
Presently, consumer electronic devices like mobile phones, personal computers, smart speakers, hearing aids, and True Wireless Stereo (TWS) earphones among other host devices commonly incorporate one or more small microphones, sensors, and/or actuators. Advancements in micro and nanofabrication technologies have led to the development of MEMS devices, such as microphones, sensors, and actuators, having progressively smaller size and different form-factors. Increasing the bias voltage of capacitive microphones, sensors, actuators, and other capacitive elements in MEMS devices leads to higher output and other operation, but also increases the tendency towards collapse and increases the mechanical stiffness of the system.
In order to describe the manner in which advantages and features of the disclosure can be obtained, a description of the disclosure is rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. These drawings depict only example embodiments of the disclosure and are not therefore considered to limit its scope. The drawings may have been simplified for clarity and are not necessarily drawn to scale.
Embodiments can provide a MEMS device with electrodes and a dielectric. According to a possible embodiment, a MEMS device can include a first electrode oriented lengthwise along and parallel to an axis. The first electrode can have a first end and a second end. The MEMS device can include a second electrode oriented lengthwise along and parallel to the axis. The second electrode can have a first end and a second end. The MEMS device can include a third electrode oriented lengthwise along and parallel to the axis. The third electrode can have a first end and a second end. The MEMS device can include a solid dielectric including a plurality of apertures. The first, second, and third electrodes can each be located at least partially within an aperture of the plurality of apertures. The dielectric can surround the second end of the second electrode and the first end of the third electrode. The first end of the second electrode and the second end of the third electrode can be located outside of the solid dielectric.
At least some embodiments can be based on a dielectric actuator where a dielectric is placed between electrodes at different potentials. The resulting electrostatic force operates to pull the dielectric and electrodes so that the dielectric covers as much of the electrodes as possible thereby maximizing the capacitance between them. The force is proportional to the change in capacitance with displacement and with the square of the voltage.
To elaborate, when a voltage is applied between adjacent electrodes, there is an electrostatic force created to pull the dielectric and electrodes in a manner that more fully engages the dielectric and electrodes. The energy in a capacitor is E=½ CV2. Moving the dielectric into a gap between the electrodes increases the capacitance. The electrostatic force F=δE/δz=½ δC/δz V2, where z is the direction of the engagement of the dielectric and the electrodes. The capacitance between electrodes varies linearly as a function of dielectric displacement as long as the dielectric ends do not get too close to the ends of the conductive electrode and as long as the electrodes are ideally shaped. Thus, the electrostatic force produced is constant regardless of the position of the dielectric between the electrodes.
In traditional parallel plate sensors, the electrostatic force varies inversely with the square of the gap between plates. In a MEMS device, such as a microphone, the electrostatic force causes the diaphragm to deflect and thus stiffen as a function of displacement. When a dielectric motor is used as a sensor in a MEMS device, such as a microphone, the electrostatic force produced by the motor can cause the diaphragm to bow and thus contributes to the stiffness of a diaphragm. This additional stiffness is proportional to the square of the applied voltage. The sensitivity of the sensor is also proportional to the applied voltage so there is a conflict between increasing the applied voltage to increase sensitivity and the decreasing mechanical compliance, i.e. increasing stiffness, of the diaphragm. At least some embodiments can provide a dual dielectric motor which can make overall compliance independent of applied voltage, at least to the first order.
One problem in conventional parallel plate MEMS microphones is the tendency for the diaphragm to collapse onto the back plate under high shock or acoustic loads. A dual diaphragm, single back plate microphone can become highly unstable as the diaphragm to back plate gap becomes unequal. Using a dual dielectric motor for sensing can avoid both the electrostatic collapse and the electrostatic stiffening of the diaphragm(s). Some embodiments can use two opposed dielectric motors to balance the electrostatic force between them. In some embodiments, this can allow for large bias voltages with little or no net electrostatic force nor gradient of electrostatic force with position applied between electrodes and the dielectric of a MEMS device.
Generally, with reference to
A voltage from a first voltage source V1 is applied between the first electrode 110 and the second electrode 120 producing a relatively constant force F1. A voltage from a second voltage source V2 is applied between the first electrode 110 and the third electrode 130 to produce a relatively constant force F2. Forces F1 and F2 are in opposition. If the structure is relatively symmetric and the magnitude of the voltage sources V1 and V2 are equal, forces F1 and F2 are equal and thus a net zero force is exerted between the dielectric and the electrodes. The magnitude of the voltages from the voltage sources V1 and V2 can be unequal to compensate for asymmetries in the structure or to intentionally create a non-zero net force between the dielectric and the electrodes.
The MEMS device can be a MEMS transducer. For example, the MEMS device can be a sensor or actuator. The MEMS device can be driven mechanically, such as for use as a differential sensor, microphone, vibration sensor, or other sensor. The MEMS device can also be driven electrically, such as to create mechanical motion as an actuator or a speaker.
The MEMS device includes at least one dielectric 150. Referring to
The dielectric 150 can be movable relative to the first, second, and third electrodes. For example, the dielectric 150 can be substantially and deliberately movable beyond slight movement due to incidental flexing, bending, bumping, and other slight movement of the dielectric 150. Furthermore, when the dielectric 150 can be movable parallel to the axis 160 relative to the first, second, and third electrodes, the first, second, and third electrodes can also be movable relative to the dielectric 150. Thus, by the electrodes and dielectric 150 being movable relative to each other, the electrodes and/or the dielectric 150 may or may not be fixed or movable relative to other elements of the MEMS device, relative to earth, and/or relative to any other point of reference.
A first capacitance exists between the first electrode 110 and the second electrode 120. A second capacitance exists between the first electrode 110 and the third electrode 130. The capacitance between electrodes can be a function of the dielectric 150. For example, values of the first and second capacitance can change in opposite directions when there is motion of the dielectric 150 in a direction parallel to the axis 160 relative to the electrodes. For example, when the dielectric 150 moves and causes the first capacitance to increase, the second capacitance can decrease. An electrostatic force on the dielectric 150 relative to the electrodes 110, 120, and 130 can be substantially unchanged relative to the displacement.
The first electrode 110 can be disposed at least partially within a first aperture of the plurality of apertures 156. The second end 122 of the second electrode 120 can be disposed within a second aperture of the plurality of apertures 156. The first end 131 of the third electrode 130 can be disposed within a third aperture of the plurality of apertures 156. The first, second, and third apertures can be different apertures.
The dielectric 150 can include a first surface 151 and a second surface 152. The first surface 151 and the second surface 152 can be parallel to a plane perpendicular to the axis 160. The first end 111 and the second end 112 of the first electrode 110 can be located outside of the dielectric 150. The first electrode 110 second end 112 and the third electrode 130 second end 132 can extend beyond the dielectric 150 second surface 152. The second electrode 120 first end 121 can extend beyond the dielectric 150 first surface 151. The first electrode 110 first end 111 can also extend beyond the dielectric 150 first surface 151.
In an embodiment, the first electrode 110 can be an electrically conductive pin of a plurality of first electrically conductive pins electrically connected to each other. The second electrode 120 can be an electrically conductive pin of a plurality of second electrically conductive pins electrically connected to each other. The third electrode 130 can be an electrically conductive pin of a plurality of third electrically conductive pins electrically connected to each other.
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According to a possible embodiment, the diaphragm 170 can be a first diaphragm coupled to the first electrodes 110-x and the third electrodes 130-x. The MEMS device can include a second diaphragm 174 coupled to the first electrodes 110-x and the second electrodes 120-x. The second diaphragm 174 can be located on an opposite side of the dielectric 150 from the first diaphragm 170. The second diaphragm 174 can have a substantially planar surface 176 perpendicular to the axis 160. The first diaphragm 170 and the second diaphragm 174 are spaced from the dielectric 150 to permit relative movement between the electrodes connected to the first and second diaphragms and the dielectric 150. A low-pressure region can be established and sealed between the diaphragms 170 and 174 in order to reduce noise and damping of the structure. The first electrodes 110-x are connected to both the first diaphragm 170 and the second diaphragm 174 and prevent the diaphragms from collapsing onto the dielectric 150. This low-pressure region can be substantially a vacuum such as a pressure less than 1 Torr, less than 300 mTorr, or less than 100 mTorr.
The diaphragms 170 and 174 can be made of a dielectric material, such as silicon nitride. The dielectric 150 can be silicon nitride. The electrodes 110-x, 120-x, and 130-x can be poly silicon. However, other materials can be used. For example, one or more of the diaphragm 170, the diaphragm 174, and the dielectric 150 can be polyimide. As another example, conductors for the electrodes can be plated metals.
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For example, according to a possible embodiment, one electrode, such as the electrode 110 can be full length and another electrode can be segmented, such as into electrodes 120 and 130. The first electrode 110 can be biased. Using charge amplifiers 194 and 196, driven electrodes 120 and 130 can be biased to a fixed potential, i.e. ground, by a very high value resistance across the feedback capacitor. The charge amplifiers 194 and 196 can produce complementary outputs when the dielectric 150 is moved along an axis substantially parallel to the lengths of the first, second, and third electrodes.
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The sensor package 1200 can include an integrated circuit 1530, such as an Application Specific Integrated Circuit (ASIC) electrically coupled to the first, second, and third electrodes 110, 120, and 130. The integrated circuit 1530 can also be coupled to contacts of the external-device interface 1520, such as via an electrical lead 1534 and/or leads running through the base 1110. The integrated circuit 1530 can receive an electrical signal from the MEMS device 100, such as via an electrical lead 1532, and can communicate, such as via the electrical lead 1534 and/or leads in the base 1110, with a host device by using the contacts of the external device interface 1520. According to a possible implementation, the integrated circuit 1530 can be covered by a protective coating 1526.
According to a possible embodiment, the base 1110 can include a sound port 1150. The MEMS device 100 can be acoustically coupled to the sound port 1150. For example, the sound port 1150 can be an aperture in the base 1110 that allows sound to pass through the base to the MEMS device 100. Illustrated embodiments can be considered a bottom port embodiment, but the sound port 1150 can be located at other locations on the transducer assembly. For example, the sound port 1150 can also be on the cover 1105 for a top-port transducer assembly. The sound port 1150 can further be on a side of the sensor package 1100, the sound port 1150 can be anywhere else on the sensor package 1100, or there can be no sound port 1150, such as for a MEMS die vibration sensor or other sensor. According to a possible embodiment, when the MEMS device 100 includes at least one diaphragm 170 and/or 174 the diaphragm 170 and/or 174 can be acoustically coupled to the sound port 1150. According to other embodiments, the MEMS device 100 may not be used in a sensor package, such as when the MEMS device 100 is an actuator, as discussed above.
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The amplifier 1310 can be a Pulse Width Modulation (PWM) or a Pulse Density Modulations (PDM) amplifier where its output is digital, swinging between the two power supply rails. The average value of a PWM amplifier's output and the average value of a PDM amplifier's output are a function of their input. The output of the digital amplifier is applied to the first electrodes 110-x. The electrostatic force applied to the electrodes and hence the diaphragms, is proportional to the square of the average value. A square root function can be included in the digital amplifier so that the movement of the diaphragm can be made linear with the input. The diaphragms can couple their movement directly to air hence producing sound or they can couple their movement through an auxiliary diaphragm to move air and thus produce sound.
According to a possible embodiment, a MEMS device can include a solid dielectric, the dielectric can have a first outer surface and a second outer surface opposite the first outer surface. The dielectric can have a plurality of passages, such as apertures, each of the plurality of passages can have an opening on the first outer surface and an opening on the second outer surface. The MEMS device can be a MEMS transducer. The MEMS device can include an electrode set. The dielectric and electrode set can be movable relative to each other.
The electrode set can include a first electrode partially disposed within a first passage of the plurality of passages such that a first end of the first electrode extends beyond the first outer surface and a second end of the first electrode extends beyond the second outer surface. The first electrode can be an electrode of a plurality of first electrodes electrically connected to each other.
The electrode set can include a second electrode disposed partially within a second passage of the plurality of passages such that a first end of the second electrode extends beyond the first outer surface and a second end of the second electrode is within the second passage. The second electrode can be an electrode of a plurality of second electrodes electrically connected to each other.
The electrode set can include a third electrode disposed partially within a third passage of the plurality of passages such that a first end of the third electrode is within the third passage and a second end of the third electrode extends beyond the second outer surface. The third electrode can be an electrode of a plurality of third electrodes electrically connected to each other. The first, second, and third electrodes can be fixed relative to one another.
According to another possible embodiment, an apparatus can include an electrode set and a dielectric member. The electrode set can include at least a first, a second, and a third electrode. The electrodes of the electrode set can each have an individual height with a top and bottom surface at the ends of each height. A capacitance exists between at least the first and second electrodes and the first and third electrodes of the electrode set.
The dielectric member can have a height with a top and bottom surface at the ends of the height. The dielectric member can have holes through the member such that the dielectric member surrounds the electrode set and is spaced from each electrode in the electrode set. The dielectric member may not be in mechanical contact with any electrode in the electrode set.
The top surface of the first electrode of the electrode set can be above the top surface of the dielectric member and the bottom surface of the first electrode of the electrode set can be below the bottom surface of the dielectric member. The top surface of the second electrode of the electrode set can be above the top surface of the dielectric member and the bottom surface of the second electrode can be between the top surface and the bottom surface of the dielectric member. The top surface of the third electrode of the electrode set can be between the top surface and the bottom surface of the dielectric member and the bottom surface of the third electrode of the electrode set can be below the bottom surface of the dielectric member.
The physical positions of the electrodes of the electrode set can be substantially fixed relative to one another. The physical position of the electrode set relative to the position of the dielectric member can be allowed movement.
The relative position of each electrode to the others can be substantially fixed. Some electrodes can be fixed while allowing others to move. For instance, the first electrode and the dielectric member can be fixed together and the second and third electrodes can be allowed to move relative to the dielectric member. Other configurations are possible.
The first electrode of the electrode set can be split into two electrically independent members. The first member can have the top surface and a second bottom surface. The second member can have a second top surface and the bottom surface. The top surface of the first member of the first electrode can be above the top surface of the dielectric member. The second bottom surface of the first member of the first electrode can be between the top and bottom surfaces of the dielectric member. The second top surface of the second member of the first electrode can be between the top and bottom surfaces of the dielectric member and the bottom surface of the second member of the first electrode can be below the bottom surface of the dielectric member.
According to a possible embodiment, a MEMS device can include a solid dielectric including a plurality of apertures. The MEMS device can include a first plurality of electrodes, the first plurality of electrodes extending completely through a first subset of the plurality of apertures. The MEMS device can include a second plurality of electrodes, the second plurality of electrodes extending partially into a second subset of the plurality of apertures. The second subset can be different from the first subset. The MEMS device can include a third plurality of electrodes, the third plurality of electrodes extending partially into a third subset of the plurality of apertures. The third subset can be different from the first subset.
According to a possible implementation of the above embodiment, the solid dielectric can include a first side and a second side opposite from the first side. The plurality of apertures can extend from the first side to the second side. The second plurality of electrodes can extend partially into the second subset from the first side. The third plurality of electrodes can extend partially into the third subset from the second side. The second subset can be the same as or different from the third subset.
While this disclosure has been described with specific embodiments thereof, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art. For example, various components of the embodiments may be interchanged, added, or substituted in the other embodiments. Also, all of the elements of each figure are not necessary for operation of the disclosed embodiments. For example, one of ordinary skill in the art of the disclosed embodiments would be enabled to make and use the teachings of the disclosure by simply employing the elements of the independent claims. Accordingly, embodiments of the disclosure as set forth herein are intended to be illustrative, not limiting. Various changes may be made without departing from the spirit and scope of the disclosure.
In this document, relational terms such as “first,” “second,” and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. The phrase “at least one of,”” “at least one selected from the group of,” or “at least one selected from” followed by a list is defined to mean one, some, or all, but not necessarily all of, the elements in the list. The terms “comprises,” “comprising,” “including,” or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by “a,” “an,” or the like does not, without more constraints, preclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element. Also, the term “another” is defined as at least a second or more. The terms “including,” “having,” and the like, as used herein, are defined as “comprising.” Furthermore, the background section is not admitted as prior art, is written as the inventor's own understanding of the context of some embodiments at the time of filing, and includes the inventor's own recognition of any problems with existing technologies and/or problems experienced in the inventor's own work.