Claims
- 1. A metal image forming material comprising in sequence
- (a) a support,
- (b) a subbing layer on said support,
- (c) at least one metal layer on said subbing layer, and
- (d) a light-sensitive resin layer provided on the metal layer furthest from said support, wherein said subbing layer is soluble in or has an affinity for an aqueous processing solution, said metal layer being prepared by vapor deposition of a metal and said metal layer furthest from said support being deposited by a vapor directed at said support at an angle of at least 45.degree. to a line normal to said support.
- 2. A metal image forming material according to claim 1 wherein said subbing layer is made of material that provides a contact angle of 30 degrees or less.
- 3. A metal image forming material according to claim 1 wherein said metal layer is formed essentially of aluminum.
- 4. A metal image forming material according to claim 1 wherein said light-sensitive resin layer is a positive working type light-sensitive resin layer.
- 5. A metal image forming material according to claim 4 wherein said positive working type light-sensitive resin layer is formed essentially of a quinondiazide compound.
- 6. A metal image forming material according to claim 1 wherein said light-sensitive resin layer is a negative working type light-sensitive resin layer.
- 7. A metal image forming material according to claim 6 wherein said negative working type light-sensitive resin layer is formed essentially of a photopolymerizable component.
- 8. A metal image forming material according to claim 1 wherein the total thickness of a deposited metal layer or layers is from 100 .ANG. to 3000 .ANG..
- 9. A metal image forming material according to claim 1 wherein said subbing layer is made of material that will swell in an aqueous processing solution.
- 10. A metal image forming material according to claim 1, in which two layers are deposited on said support, and in which the first layer is deposited at an angle of more than 30.degree. but less than 45.degree. and the uppermost layer is deposited at an angle greater than or equal to the deposition angle of said first layer.
- 11. A metal image forming material according to claim 1, in which said angle is about 45.degree..
- 12. A metal image forming material comprising in sequence
- (a) a support,
- (b) at least two metal layers on said support, and
- (c) a light-sensitive resin layer provided on the metal layer furthest from said support,
- wherein said metal layers are prepared by vapor deposition, said metal layer furthest from said support being deposited by a vapor directed at said support at an angle of at least 45.degree. to a line normal to said support, the other metal layers being deposited at an angle relative to the normal of said support which is less than the angle of deposition of said metal layer furthest from said support.
- 13. A metal image forming material according to claim 12 wherein said metal layer furthest from said support is formed essentially of aluminum.
- 14. A metal image forming material according to claim 12 wherein said light-sensitive resin layer is a positive working type light-sensitive resin layer.
- 15. A metal image forming material according to claim 14 wherein said positive working type light-sensitive resin layer is formed essentially of a quinone diazide compound.
- 16. A metal image forming material according to claim 12 wherein said light-sensitive resin layer is a negative working type light-sensitive resin layer.
- 17. A metal image forming material according to claim 16 wherein said negative working type light-sensitive resin layer is formed essentially of a photopolymerizable component.
- 18. A metal image forming material according to claim 12 wherein the total thickness of a deposited metal layer or layers is from 100 .ANG. to 3000 .ANG..
- 19. A metal image forming material comprising a support, a metal layer formed thereon by the deposition of the vapor of a metal deposited thereon at an angle, said angle being greater than 30.degree. but less than 45.degree. from the normal to the support during the initial deposition, and increasing at least 10.degree. at final deposition to an angle of greater than 45.degree., and a light-sensitive resin layer covering said deposited metal layer.
- 20. A metal image forming material according to claim 19 wherein said metal layer is formed essentially of aluminum.
- 21. A metal image forming material according to claim 20 wherein said light-sensitive resin layer is a positive working type light-sensitive resin layer.
- 22. A metal image forming material according to claim 21 wherein said positive working type light-sensitive resin layer is formed essentially of a quinone diazide compound.
- 23. A metal image forming material according to claim 19 wherein said light-sensitive resin layer is a negative working type light-sensitive resin layer.
- 24. A metal image forming material according to claim 23 wherein said negative working type light-sensitive resin layer is formed essentially of a photopolymerizable component.
- 25. A metal image forming material according to claim 19 wherein the total thickness of a deposited metal layer or layers is from 100 .ANG. to 3000 .ANG..
- 26. A method for the production of a metal image forming material comprising the steps of forming at least one metal layer on a support by depositing the vapor of a metal thereon at an angle of at least 45.degree. from a line normal to said support and applying a light-sensitive resin layer over said metal layer.
- 27. A method according to claim 26 further comprising the step of applying a subbing layer between the support and the metal layer, said subbing layer being soluble in or having affinity for an aqueous processing solution.
- 28. A method according to claim 26 wherein said deposition is proceeded with at an increasing angle with respect to the normal to the support.
- 29. A method according to claim 26 wherein said metal image forming material comprises two metal layers, the upper layer being deposited at an angle larger than the lower layer.
- 30. A method according to claim 26, wherein said deposition is conducted by any means of vacuum-depositing, sputtering or ion plating.
Priority Claims (4)
Number |
Date |
Country |
Kind |
56-174417 |
Nov 1981 |
JPX |
|
56-174418 |
Nov 1981 |
JPX |
|
56-174419 |
Nov 1981 |
JPX |
|
56-175800 |
Nov 1981 |
JPX |
|
Parent Case Info
This Application is a continuation of Ser. No. 436,644, filed Oct. 25, 1982, abandoned which claims priority of Japanese Applications 174,417/1981, 174,418/1981, and 174,419/1981, all filed Nov. 2, 1981, and Japanese Application 175,800/1981, filed Nov. 4, 1981.
US Referenced Citations (15)
Non-Patent Literature Citations (2)
Entry |
Hu, Evelyn et al., "High Resolution . . . Junctions", IEEE Transactions on Electron Devices, vol. Ed-28, No. 11, pp. 1382-1385, 11/1981. |
Speidell, J. C., "Simple Method . . . Lines", J. Vac. Sci., Tech., vol. 19, No. 3, 9-10/1981, pp. 693-695. |
Continuations (1)
|
Number |
Date |
Country |
Parent |
436644 |
Oct 1982 |
|