Number | Name | Date | Kind |
---|---|---|---|
3657029 | Fuller | Apr 1972 | |
3881884 | Cook et al. | May 1975 | |
4017890 | Howard et al. | Apr 1977 | |
4135292 | Jaffe et al. | Jan 1979 |
Number | Date | Country |
---|---|---|
56-165354 | Dec 1981 | JPX |
57-71175 | May 1982 | JPX |
Entry |
---|
IBM, "Ohmic Contacts to Semiconductor Devices Using Barrier Layers of Aluminum and Titanium", IBM Technical Disclosure Bulletin, vol. 28, No. 4, Sep. 1985. |
Wiley et al, "Amorphous Metallizations for High Temperature Semiconductor Device Applications", IEEE Transactions on Industrial Electronics, vol. IE-29, No. 2, May 1982. |
Suni and Nicolet, "Stability of Amorphous Fe-W Alloys in Multilayer Metallizations on Silicon", Thin Solid Films, 107 (1983), pp. 73-80. |