Claims
- 1. A method for cutting a workpiece, comprising:
placing the workpiece on a porous member having a mounting surface; securing the workpiece on the mounting surface by applying suction to the workpiece through pores in the porous member; cutting the workpiece into individual elements, the elements remaining secured to the mounting surface by the applied suction.
- 2. The method of claim 1, further comprising:
cutting the workpiece using laser energy.
- 3. The method of claim 1, further comprising:
cutting the workpiece using laser energy, wherein the laser energy has a wavelength that is absorbed to a greater degree by the workpiece than by the mounting surface.
- 4. The method of claim 1, further comprising:
reducing the suction to release the elements from the mounting surface; and removing the elements from the mounting surface.
- 5. The method of claim 1, further comprising;
after said cutting the workpiece, adhering the elements to a flexible sheet; and removing the elements adhered to the flexible sheet from the mounting surface.
- 6. The method of claim 1, further comprising:
after said cutting the workpiece, using a robotic device to remove the elements from the mounting surface.
- 7. The method of claim 1, wherein the porous member comprises a rigid plate.
- 8. The method of claim 1, wherein the porous member comprises a flexible sheet.
- 9. The method of claim 1, wherein the porous member comprises paper.
- 10. The method of claim 1, wherein the porous member comprises plastic.
- 11. The method of claim 1, wherein the porous member comprises ceramic.
- 12. The method of claim 1, wherein the porous member comprises metal.
- 13. The method of claim 1, wherein the workpiece comprises a wafer having an active surface, and the active surface is mounted in contact with the mounting surface.
- 14. The method of claim 1, wherein the workpiece comprises an array of integrated devices on a wafer having an active surface and comprising a conductive substrate.
- 15. The method of claim 1, wherein the workpiece comprises a wafer having an active surface comprising GaN, and a metallic substrate.
- 16. The method of claim 1, wherein the workpiece comprises an array of integrated devices.
- 17-32. (Canceled)
RELATED APPLICATIONS
[0001] This application is a divisional of pending application Ser. No. 10/288,719, filed 5 Nov. 2002.
Divisions (1)
|
Number |
Date |
Country |
Parent |
10288719 |
Nov 2002 |
US |
Child |
10852838 |
May 2004 |
US |