Claims
- 1. An apparatus for mounting, inspecting and adjusting probe needles used for testing fabricated semiconductor wafers, comprising:
- a planar surface having selective areas to be subjected to probe needle abrasion, said selective areas comprising a plurality of separate, visually perceptible targets, said separate, visually perceptible targets having first segments of a relatively soft material being disturbable by probe needle abrasion and second segments of a relatively hard material being resistant to disturbance by probe needle abrasion, the location of said separate, visually perceptible targets having been predetermined by and made coincidental with the particular surface areas of a fabricated semiconductor wafer to be tested.
- 2. The apparatus of claim 1 wherein said first targets are in the shape of a circle superimposed on a pair of perpendicularly crossing lines.
- 3. The apparatus of claim 2 wherein said second targets are comprised of a first plurality of parallel lines crossing perpendicularly to a second plurality of parallel lines so as to form a matrix.
- 4. The apparatus of claim 3 wherein said first plurality of parallel lines are uniformly spaced.
- 5. The apparatus of claim 4 wherein said second plurality of parallel lines are uniformly spaced.
- 6. The apparatus of claim 5 wherein the centers of said first targets are spatially offset from the centers of a plurality of third targets.
Parent Case Info
This is a divisional of application Ser. No. 08/305,798 filed Sep. 13, 1994, which is a continuation of Ser. No. 07/848,845 filed Mar. 10, 1992, and now abandoned.
US Referenced Citations (7)
Divisions (1)
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305798 |
Sep 1994 |
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Continuations (1)
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848845 |
Mar 1992 |
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