Claims
- 1. An apparatus comprising:an electrically conductive chassis, said chassis divided into two electrically isolated sections wherein each of said sections serves as a current path; an isolating barrier, said barrier dividing said chassis and isolating a supply current from a ground current; and a power supply coupled to said chassis, wherein said chassis thermally dissipates heat from said power supply.
- 2. The apparatus of claim 1 wherein said chassis comprises of a thermally conductive material.
- 3. The apparatus of claim 1 wherein an integrated circuit device is coupled to a first and a second of said electrically isolated sections of said chassis, said first section serving as a supply current path and said second section serving as a ground current path.
- 4. The apparatus of claim 1 wherein said power supply is mounted flush to said chassis.
- 5. The apparatus of claim 4 further comprising a thermally conductive medium between mating surfaces of said chassis and said power supply.
- 6. The apparatus of claim 5 wherein said thermally conductive medium comprises a thermal grease.
- 7. The apparatus of claim 5 wherein said thermally conductive medium comprises a thermal adhesive.
- 8. The apparatus of claim 1 further comprising cooling fins coupled to said power supply.
- 9. The apparatus of claim 8 further comprising a cooling fan mechanically coupled to said chassis, said fan located proximate to said power supply to provide an airflow across said cooling fins.
- 10. The apparatus of claim 4 wherein said power supply is mounted on an outside surface of said chassis.
- 11. The apparatus of claim 4 wherein said power supply is mounted on a back plane portion of said chassis.
- 12. The apparatus of claim 1 wherein said power supply is coupled to said chassis with a thermally conductive bracket.
- 13. The apparatus of claim 1 wherein said power supply is soldered to said chassis.
- 14. A computer system comprising:an electrically conductive computer chassis, said chassis divided into two electrically isolated sections wherein each of said sections serves as a current path; a microprocessor coupled to said chassis; and a power supply coupled to said chassis, wherein said chassis thermally dissipates heat from said power supply.
- 15. The computer system of claim 14 wherein said computer chassis conducts heat.
- 16. The computer system of claim 14 wherein said microprocessor is coupled to a first and a second of said electrically isolated sections of said chassis, said first section serving as a supply current path and said second section serving as a ground current path.
- 17. The computer system of claim 14 wherein said power supply is mounted flush to said computer chassis.
- 18. The computer system of claim 14 further comprising a thermally conductive medium between mating surfaces of said chassis and said power supply.
- 19. The computer system of claim 18 further wherein said thermally conductive medium comprises a thermal grease.
- 20. The computer system of claim 18 further wherein said thermally conductive medium comprises a thermal adhesive.
- 21. The computer system of claim 14 further comprising cooling fins coupled to said power supply.
- 22. The computer system of claim 21 further comprising a cooling fan mechanically coupled to said chassis, said fan located proximate to said power supply to provide an airflow across said cooling fins.
- 23. The computer system of claim 17 wherein said power supply is mounted on an outside surface of said chassis.
- 24. The computer system of claim 17 wherein said power supply is mounted on a back plane portion of said chassis.
- 25. The computer system of claim 14 wherein said power supply is coupled to said computer chassis with a thermally conductive bracket.
- 26. The computer system of claim 14 wherein said power supply is soldered to said computer chassis.
- 27. The computer system of claim 14 wherein said microprocessor is mounted on a motherboard.
- 28. The computer system of claim 14 wherein said microprocessor is mounted on said computer chassis.
- 29. A power supply assembly comprising:a chassis, said chassis composed of a thermally and electrically conductive material; an isolating barrier, said barrier dividing said chassis into two electrically isolated sections wherein each of said sections serves as a current path; and a power supply mounted flush to said chassis, wherein said chassis thermally dissipates heat from said power supply.
- 30. The power supply assembly of claim 29 wherein said power supply is coupled to said chassis with a thermally conductive bracket.
- 31. The power supply assembly of claim 29 further comprising a thermally conductive medium between mating surfaces of said chassis and said power supply.
- 32. The power supply assembly of claim 29 further comprising cooling fins coupled to said power supply.
- 33. The power supply assembly of claim 29 further comprising a cooling fan mechanically coupled to said chassis, said fan located proximate to said power supply to provide an airflow across said cooling fins.
RELATED APPLICATIONS
The present application is a divisional of application Ser. No. 08/775,784, filed Dec. 31, 1996, now U.S. Pat. No. 6,137,688 and is related to the following patents and applications: U.S. Patent entitled “Daisy Chained Clock Distribution Scheme,” by Borkar, et al., U.S. Pat. No. 5,546,023, issued Aug. 13, 1996 and filed Jun. 26, 1995; U.S. Patent Application entitled “Point-To-Point Phase-Tolerant Communication,” by Self et al., application Ser. No. 08/296,019, filed Aug. 25, 1994, which has been issued as U.S. Pat. No. 5,623,644 on Apr. 22, 1997; U.S. Patent Application entitled “Microprocessor Point-To-Point Communication,” by Self et al., application Ser. No. 08/295,556, filed Aug. 25, 1994, which has been issued as U.S. Pat. No. 5,643,043 on May 27, 1997; U.S. Patent Application entitled “Method For Controlling Solder Bump Height and Volume for Substrates Containing Both Pan-On And Pad-Off Via Contacts,” by Mashimoto, application Ser. No. 08/625,797, filed Mar. 29, 1996, which has been issued as U.S. Pat. No. 5,880,530 on Mar. 9, 1999; U.S. application entitled “Power-Pod Power Delivery System,” by McCutchan et al., application Ser. No. 08/672,864, filed on Jun. 28, 1996, which has been issued as U.S. Pat. No. 5,864,478 on Jan. 26, 1999; U.S. Patent Application entitled “Use of Flexible Interconnects and Point-to-Point Communications Protocol to Connect Subsystems with Dissimilar Thermal Properties,” by Borkar et al., application Ser. No. 08/777,260, filed Dec. 31, 1996; U.S. Patent Application entitled “Method and Apparatus for Mounting a Very Large Scale Integration (VLSI) Chip Package to a Computer Chassis for Cooling,” by Borkar et al., application Ser. No. 08/777,601, filed Dec. 31, 1996; U.S. Patent entitled “Method and Apparatus For Mounting a Very Large Scale Integration (VLSI) Chip Package to a Computer Chassis for Cooling,” by Borkar et al., U.S. Pat. No. 5,969,944, issued Oct. 19, 1999 and filed Sep. 3, 1998; U.S. Patent Application entitled “Method and Apparatus for Retrofit Mounting a VLSI Chip to a Computer Chassis for Cooling,” by Borkar et al., application Ser. No. 08/777,251, filed Dec. 31, 1996, which has been issued as U.S. Pat. No. 6,018,465 on Jan. 25, 2000; U.S. Patent Application entitled “Method and Apparatus for Mounting a Very Large Scale Integration (VLSI) Chip Package to a Computer Chassis for Current Supply,” by Borkar et al., application Ser. No. 08/777,604, filed Dec. 31, 1996, which has been issued as U.S. Pat. No. 5,978,228 on Nov. 2, 1999; and U.S. Patent Application entitled “Method and Apparatus for Mounting a Power Supply to a Computer Chassis for Cooling,” by Borkar et al., application Ser. No. 08/775,782, filed Dec. 31, 1996.
US Referenced Citations (75)
Foreign Referenced Citations (2)
Number |
Date |
Country |
412115 |
Nov 1998 |
CH |
64-41255 |
Feb 1989 |
JP |