Method and system for fabricating high junction angle read sensors

Information

  • Patent Grant
  • 9812155
  • Patent Number
    9,812,155
  • Date Filed
    Monday, November 23, 2015
    9 years ago
  • Date Issued
    Tuesday, November 7, 2017
    7 years ago
Abstract
A method provides a magnetic read apparatus. A sensor stack is deposited. The read sensor is defined from the stack such that the sensor has sides forming a junction angle of 75 degrees-105 degrees from a sensor bottom. Defining the sensor includes performing a first ion mill at a first angle and a first energy and performing a second ion mill at a second angle greater than the first angle and at a second energy less than the first energy. The first angle is 5 degrees-30 degrees from normal to the top surface. After the first ion mill, less than half of the stack's bottom layer depth remains unmilled. Magnetic bias structure(s) adjacent to the sides may be formed. The magnetic bias structure(s) include a side shielding material having at least one of the saturation magnetization greater than 800 emu/cm3 and an exchange length less than five nanometers.
Description
BACKGROUND


FIG. 1 depicts an air-bearing surface (ABS) view of a conventional read apparatus used in magnetic recording technology applications. The conventional read apparatus 10 includes shields 12 and 18, insulator 14, magnetic bias structures 16, and sensor 20. The read sensor 20 is typically a giant magnetoresistive (GMR) sensor or tunneling magnetoresistive (TMR) sensor. The read sensor 20 includes an antiferromagnetic (AFM) layer 22, a pinned layer 24, a nonmagnetic spacer layer 26, and a free layer 28. Also shown is a capping layer 30. In addition, seed layer(s) may be used. The free layer 28 has a magnetization sensitive to an external magnetic field. Thus, the free layer 28 functions as a sensor layer for the magnetoresistive sensor 20. The read sensor 20 typically has its top narrower than its bottom. Thus, the read sensor 20 has junction angle, a. The junction angle is typically fifty degrees, plus or minus fifteen degrees. The lower junction angles are desirable to reduce or prevent damage to the tunneling barrier layer 26 during fabrication and to account for redeposition that occurs during fabrication. The magnetic bias structures 16 are used to magnetically bias the free layer 28.


Although the conventional apparatus 10 functions, there are drawbacks. The trend in magnetic recording is to higher areal density recording. A lower track width (TW) is desired for such higher areal densities. In addition, a reduced shield-to-shield spacing (SS) is desired for higher density recording. However, at smaller track widths, the performance of the read sensor 20 may be adversely affected. For example, the volumes of the AFM layer 22, pinned layer 24 and free layer 28 are reduced at narrow track widths. The free layer 28 reduction in volume is exacerbated by the free layer 28 being narrower than remaining magnetic layers. Thus, the stability of the read sensor 20 and ability of the free layer 28 to function as a sensor layer are impaired. Because a narrow shield-to-shield spacing is also desired and because of the nature of the read sensor 20, the thickness of the layers 22, 24 and 28 may be desired to remain thin.


Accordingly, what is needed is a system and method for improving the performance of a magnetic recording read apparatus, particularly at higher areal densities.





BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS


FIG. 1 depicts an ABS view of a conventional magnetic recording read apparatus.



FIG. 2 is a flow chart depicting an exemplary embodiment of a method for fabricating a magnetic read apparatus having read sensor with a high junction angle.



FIG. 3 is a flow chart depicting an exemplary embodiment of a method for fabricating a read sensor with a high junction angle.



FIGS. 4-8 depict an exemplary embodiment of a portion of a magnetic recording read apparatus during fabrication.



FIG. 9 depicts an ABS view of another exemplary embodiment of a portion of a magnetic recording read apparatus.



FIG. 10 depicts an ABS view of another exemplary embodiment of a portion of a magnetic recording read apparatus.



FIG. 11 depicts an ABS view of another exemplary embodiment of a portion of a magnetic recording read apparatus.



FIG. 12 depicts an ABS view of another exemplary embodiment of a portion of a magnetic recording read apparatus.



FIG. 13 depicts an ABS view of another exemplary embodiment of a portion of a magnetic recording read apparatus.





DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

While the various embodiments disclosed are applicable to a variety of data storage devices such as magnetic recording disk drives, solid-state hybrid disk drives, networked storage systems etc., for the sake of illustration the description below will use disk drives as examples.



FIG. 2 is an exemplary embodiment of a method 100 for providing a read apparatus. More specifically, the method 100 is used in providing a read sensor. For simplicity, some steps may be omitted, interleaved, combined, have multiple substeps and/or performed in another order unless otherwise specified. Although described in the context of a single magnetic read apparatus, multiple magnetic read apparatuses may be fabricated at substantially the same time. The method 100 may also be used to fabricate other magnetic recording apparatuses. The method 100 is also described in the context of particular layers. A particular layer may include multiple materials and/or multiple sub-layers. The method 100 is described in the context of a disk drive. However, the method may be used in other magnetic storage devices. The method is also described in the context of particular magnetic junctions. In other embodiments, other magnetic junctions may be formed. The method 100 also may start after formation of other portions of the magnetic read apparatus. For example, the method 100 may start after the bottom shield is fabricated.


The layers to form a read sensor stack are deposited, via step 102. The layers deposited in step 102 depend upon the type of read sensor being formed. For example, step 102 may include depositing a reference layer, depositing a nonmagnetic layer on the reference layer and depositing a free layer on the nonmagnetic layer. The nonmagnetic layer may be a tunneling barrier layer or a conductive layer. The reference layer has its magnetic moment fixed, or pinned in a particular direction. In some embodiments, step 102 also includes depositing a pinning layer, such as an antiferromagnetic layer, adjoining the reference layer. Thus, the layers for a magnetic tunneling junction (MTJ) or spin valve may be deposited in step 102. In another embodiment, step 102 may include depositing a first free layer, depositing a nonmagnetic layer on the first free layer and depositing a second free layer on the nonmagnetic layer. Thus, a dual free layer magnetic junction may also be fabricated using the method 100. In other embodiments, other and/or additional layers may be deposited for the magnetic junctions being formed.


The read sensor is then defined using steps 104 and 106. The read sensor could be defined in the track width direction in steps 104 and 106 or in the stripe height direction. The stripe height direction is perpendicular to the ABS. In addition, steps 104 and 106 may define the read sensor such that the read sensor has sides that form junction angles with respect to a bottom of the read sensor. The junction angles are each at least seventy-five degrees and not more than one hundred and five degrees. In some such embodiments, the junction angles may each be at least eighty-five degrees and not more than ninety-five degrees. Junction angles less than ninety degrees may occur for a read sensor having a top smaller than the bottom. Junction angles greater than ninety degrees may occur for a read sensor having a top wider than the bottom. For junction angles described above, the sidewalls need not be straight. For example, for a dual free layer read sensor, the two free layers may be symmetric. In such an embodiment, the middle region of the read sensor may be narrower than the top or the bottom.


A first ion mill on the read sensor stack at a first angle and a first ion mill energy, via step 104. The first angle is at least five degrees and not more than thirty degrees from a normal to the top surface of the read sensor stack. Thus, the first ion mill is performed relatively close to perpendicular to the surface of the read sensor stack. In some embodiments, the first energy at which the ion mill is performed is relatively high. For example, the ion mill may be performed at a milling energy of at least two hundred electron volts. The first ion mill of step 104 mills through most if not all of the read sensor stack. In some embodiments, enough of the read sensor stack is removed that less than half of the depth of a bottom layer of the read sensor stack remains unmilled. In other embodiments, the read sensor stack may be completely milled through. Thus, the bottom layer of the read sensor stack is milled though in such an embodiment.


A second ion mill is performed at a second angle and a second ion mill energy, via step 106. The second ion mill energy is less than the first ion mill energy. In contrast, the second angle for the second ion mill is greater than the first angle for the first ion mill. In some embodiments, the second ion mill energy is at least one-fourth of the first ion mill energy and not more than three-fourths of the first ion mill energy. In some embodiments, the second ion mill energy is nominally half of the first ion mill energy. The second angle may be significantly greater than the first angle. For example, in some embodiments the second angle is at least seventy and not more than eighty five degrees from the normal to the top surface. Thus, the second angle is at a glancing angle from the top of the read sensor layers.


In some embodiments, steps 104 and 106 define the read sensor in the track width direction. Thus, the sides of the read sensor that are formed are the sidewalls as viewed from the ABS. In other embodiments, steps 104 and 106 define the read sensor in the stripe height direction. Thus, the back of the read sensor may be formed in steps 104 and 106. The front/ABS surface of the read sensor is generally formed by lapping. In other embodiments, steps 104 and 106 may define the read sensor in both the stripe height and the track width direction. In such embodiments, steps 104 and 106 might be carried out twice, once for the track width direction and once for the stripe height direction.


An additional ion mill may be performed after step 104 but before step 106 in some embodiments. Such an ion mill may be performed at an energy that is greater than the second energy of step 106, but may use a larger angle than step 104. For example, the energy may be substantially the same as used in step 104 but the angle for such an ion mill may be at least sixty-five degrees and not more than eighty-five degrees from normal to the top surface. In other embodiments, this additional ion milling step may be omitted.


Thus, the read sensor may be defined in the stripe height and/or track width directions by steps 104 and 106. Fabrication of the read apparatus may then be completed, via step 108. For example, side bias structure(s) may be provided. These side bias structure may be magnetic and are used to magnetically bias the free layer(s). In some embodiments, the side bias structures include side shielding material(s). The side shielding material(s) having at least one of a saturation magnetization exceeding 800 emu/cm3 and an exchange length of less than five nanometers. In some cases, a rear magnetic bias structure may also be fabricated. A top shield is also generally provided in step 108. The remainder of the read apparatus, magnetic write apparatus (if any) and data storage device may thus be manufactured.


The method 100 may be used to fabricate a read sensor having substantially vertical sides in the track width and/or stripe height direction. The read sensor may also have a small track width. For example, the track width may be as low as five nanometers or less. Because the sidewalls have large junction angles, the free layer volume may be increased at lower track widths. Thus, the magnetic behavior of the read sensor may be closer to that desired. In addition, steps 104 and 106, particularly step 106 may be used to remove redeposition and/or damaged regions from the sides of the magnetic junction being formed. Because of the lower energy used, this removal can be achieved without causing additional damage to the read sensor. As a result, a read sensor having large junction angles and improved performance may be reliably fabricated.



FIG. 3 is another exemplary embodiment of a method 110 for defining a read sensor in a magnetic read apparatus. For simplicity, some steps may be omitted, interleaved, combined, have multiple substeps and/or performed in another order unless otherwise specified. FIGS. 4-8 depict an exemplary embodiment of a magnetic read apparatus 200 during fabrication using the method 110. For clarity FIGS. 4-8 are not to scale. FIGS. 4-8 may also be either all ABS location views (views as seen from the plane that will become the ABS) or apex views. If FIGS. 4-8 are considered ABS location views, the method 110 defines the read sensor in the track width direction. If FIGS. 4-8 are considered to be apex views, the read sensor is defined in the stripe height direction using the method 110. Although described in the context of the magnetic read apparatus 200, the method 110 may be used in fabricating other read sensors. Referring to FIGS. 4-8, the method 110 is described in the context of providing a single read apparatus 200 for a magnetic recording disk drive. The method 110 may be used to fabricate multiple magnetic readers at substantially the same time. The method 110 is also described in the context of particular layers. A particular layer may include multiple materials and/or multiple sub-layers. The method 110 also may start after formation of other portions of the magnetic read apparatus. For example, the method 110 may start after the shield and layers for the read sensor stack have been deposited.


The read sensor stack is milled at a first angle and a first ion mill energy, via step 112. FIG. 4 depicts the read apparatus 200 before step 112 starts. Thus, a shield 202 and read sensor stack 210 is shown. Also depicted is mask 204 used to define the read sensor. The read sensor stack 210 may include multiple layers. For example, the layers for a magnetic tunneling junction, spin valve, dual free layer sensor or other read sensor may be present in the read sensor stack 210. FIG. 5 depicts the read apparatus 200 during step 112. The direction of the ions used in the first ion mill are shown by arrows. The ion mill of step 112 is performed at a first angle, α1. The first angle is at least five degrees and not more than thirty degrees from a normal to the top surface of the read sensor stack. In some embodiments, the first angle is not more than twenty degrees from normal to the surface. In some embodiments, the first ion mill energy at which may be performed at a milling energy of at least two hundred electron volts. In other embodiments, other energies may be used. The first ion mill of step 112 mills through most if not all of the read sensor stack 210. Thus, as can be seen in FIG. 5, the read sensor 210 has been mostly milled through. The dashed line in the read sensor stack 210 of FIG. 5 indicates the top surface of the bottom layer in the read sensor stack 210. Thus, less than half of the depth of the bottom layer of the read sensor stack 210 is unmilled. Although not shown in FIG. 5, the read sensor stack 210 may be completely milled through. Also shown in FIG. 5 is redeposition 212. The redeposition 212 resides at least on the mask 204 used in defining the read sensor.


A second, intermediate ion mill is performed, via step 114. Such an ion mill may be performed at an energy that is not more than the first ion mill energy of step 112, but may use a larger angle than step 112. For example, the second ion mill energy may be substantially the same as used in step 112. In other embodiments, the second energy is less than that used in the first ion mill. FIG. 6 depicts the read apparatus 200 during step 114. The direction of the ions used in the second ion mill are shown by arrows. As can be seen in FIG. 6, the second ion mill is performed at a second angle α2 from the normal to the top surface of the read sensor stack 210. The second angle is significantly larger than the first angle. In the embodiment shown, the second angle is at least sixty-five degrees and not more than eighty-five degrees from normal to the top surface. In other embodiments, this second angle may be at least seventy-five degrees. Thus, as can be seen in FIG. 6, the redeposition 212 has been removed. However, a damage/redeposition layer 214 has been formed on the sides of the sensor stack 210.


A third ion mill is performed at a third angle and a third ion mill energy, via step 116. The third ion mill energy is less than the first ion mill energy and less than the second ion mill energy. In some embodiments, the third ion mill energy is at least one-fourth of the first ion mill energy and not more than three-fourths of the first ion mill energy. In some embodiments, the third ion mill energy is nominally half of the first ion mill energy. FIG. 7 depicts the read apparatus 200 during step 116. The direction of the ions used in the third ion mill are shown by arrows. Thus, the ion mill is at a third angle, α3. The third angle for this ion mill is greater than the first angle for the first ion mill. In some embodiments the third angle is at least seventy and not more than eighty five degrees from the normal to the top surface of the read sensor stack. Because of the angle and energy used in step 116, the damage layer 214 has been removed. Additional damage due to the third ion mill is minimal or nonexistent because of the low energy and high angle used. Further, the read sensor 210 has been defined. The sides of the read sensor 210 form junction angles θ1 and θ2 with the bottom. In some embodiments, θ1 and θ2 are substantially equal. Further, the junction angles are close to ninety degrees. In some embodiments, the junction angles are each at least seventy-five degrees and not more than one hundred and five degrees. In some such embodiments, the junction angles may each be at least eighty-five degrees and not more than ninety-five degrees.



FIG. 8 depicts the read apparatus after conclusion of the method 110. In addition, additional structures are shown. The read apparatus 200 includes the read sensor 210 having junction angles θ1 and θ2, side layers 220, top shield 230 and optional insulating layers 232. Other structures (not shown) such as capping and/or seed layers, additional sensors, and/or leads might be included. If FIG. 8 shows an ABS view, the side layers 220 might be side magnetic bias structures. If FIG. 8 is an apex view (e.g. prior to lapping), then the side layers 220 may be nonmagnetic insulating refill layers and/or rear bias structures.


Thus, the read sensor 210 may be defined in the stripe height and/or track width directions using the method 110. The read sensor 210 has substantially vertical sides in the track width and/or stripe height direction. The read sensor may also have a small track width. For example, the track width may be as low as five nanometers or less. Because the sidewalls have large junction angles, θ1 and θ2, the free layer volume may be increased at lower track widths. Thus, the magnetic behavior of the read sensor 210 may be closer to that desired. In addition, the method 110 removes redeposition and/or damaged regions from the sides of the read sensor 210 being formed. Because of the lower energy used, this can be achieved without causing additional damage to the read sensor 210. As a result, a read sensor 210 having improved performance may be achieved.



FIG. 9 depicts an ABS view of an exemplary embodiment of a portion of a magnetic read apparatus 300. For clarity, FIG. 9 is not to scale. The read apparatus 300 may be part of a read head or may be part of a merged head that also includes a write apparatus. Thus, the read apparatus 300 may be part of a disk drive having a media, a slider and the read apparatus coupled with (fabricated on) the slider. In other embodiments, the read apparatus 300 may be part of another data storage device. Further, only a portion of the components of the read apparatus 300 are depicted. The view shown in FIG. 9 may be for a read apparatus fabricated using the methods 100 and/or 110 in which the ion mills used to define the read sensor are performed at least for the cross-track direction. Thus, the read apparatus 300 may be analogous to the read apparatus 200.


The read apparatus 300 includes shields 302 and 304, read sensor 310, capping layer 318 and soft magnetic bias structures 320. The shield-to-shield spacing is SS, while the track width is TW. The shields 302 and 304 are shown as monolithic shields, which include only a single layer. However, other structures are possible for the shields 302 and 304.


The read sensor 310 may include multiple layers. For example, the layers for a magnetic tunneling junction, spin valve, dual free layer sensor or other read sensor may be present in the read sensor stack 310. The read sensor 310 has a bottom in proximity to (and shown as adjoining) the shield 302, a top in proximity to (and shown as adjoining) the capping layer 318 or shield 304 and sides. The sides form junction angles θ1 and θ2 with the bottom of the read sensor 310. The junction angles are each at least seventy-five degrees and not more than one hundred and five degrees. In some embodiments, the junction angles are each at least eighty-five degrees and not more than ninety-five degrees. In the embodiment depicted in FIG. 9, the junction angles are less than ninety degrees. This configuration results in the top of the read sensor 310 being narrower than the bottom in the cross-track direction. However, larger junction angles are possible. For junction angle(s) of ninety degree, the sides of the read sensor 310 are substantially vertical. Thus, the top of the read sensor 310 may have the same width as the bottom of the read sensor 310. In other embodiments, in which the junction angle(s) are greater than ninety degrees, the top of the read sensor 310 may be wider than the bottom of the read sensor 310 in the cross-track direction. For junction angles described above, the sidewalls need not be straight. For example, for a dual free layer read sensor, the two free layers may be symmetric. In such an embodiment, the middle region of the read sensor may be narrower than the top or the bottom.


Also shown are side magnetic bias structures 320 and nonmagnetic layers 306. The nonmagnetic layers 306 may be insulating if current is driven through the read sensor 310 perpendicular to plane (in the down track direction). The magnetic bias structures 320 include a side shielding material that has a saturation magnetization and an exchange length. In some embodiments, the saturation magnetization of the side shielding material is greater than 800 emu/cm3. In other embodiments, the exchange length of the side shielding material is less than five nanometers. In some embodiments, both the saturation magnetization of the side shielding material is greater than 800 emu/cm3 and the exchange length of the side shielding material is less than five nanometers. This may be achieved by selection of side shielding materials. For example, nanomagnets such as small clusters of Co or Fe particles in an insulating or oxide matrix, such as Hf oxide, may have the reduced exchange length described above. Other materials such as Co, Fe, a CoFe alloy such as Co90Fe10 and/or NiFeX, where X is a material such as Cr and/or Ta, may also be used. Other materials having the saturation magnetization and exchange length described above may also be used.


The side magnetic bias structures 320 may consist of only the side shielding material. In some such embodiments, multiple different side shielding materials having the saturation magnetization greater than 800 emu/cm3 and/or the exchange length less than five nanometers may be used. In other embodiments, the side shielding material may be incorporated in another manner. For example, the side magnetic bias structures 320 may include one or more layers of the side shielding material as well as other magnetic or nonmagnetic layers. In such embodiments, the layers of side shielding materials may be ferromagnetically or antiferromagnetically aligned.


The magnetic read apparatus 300 may have improved performance. The large junction angles θ1 and θ2 may allow for improved performance of the read sensor 310. For example, stability and/or other magnetic properties may be improved. Further, the high junction angle read sensor 310 may be reliably fabricated using the method 100 and/or 110. The side magnetic bias structures 320 may also provide improved side shielding. In particular, the combination of the (nearly) vertical sidewalls of the read sensor 310 and the side shielding material discussed above may improve the cross-track resolution. It is noted that the side shielding material described above has a lower exchange length and larger magnetization than is typically selected for side shields. Thus, the improvement in the cross-track resolution for the magnetic read apparatus 300 may be considered surprising.



FIG. 10 depicts an ABS view of an exemplary embodiment of a read apparatus 300′. For clarity, FIG. 10 is not to scale. The read apparatus 300′ may be part of a read head or may be part of a merged head that also includes a write apparatus. Thus, the read apparatus 300′ may be part of a disk drive having a media, a slider and the read apparatus coupled with (fabricated on) the slider. In other embodiments, the read apparatus 300′ may be part of another data storage device. Further, only a portion of the components of the read apparatus 300′ are depicted. The view shown in FIG. 10 may be for a read apparatus fabricated using the methods 100 and/or 110 in which the ion mills used to define the read sensor are performed at least for the cross-track direction. The head of which the read apparatus 300′ is a part is part of a disk drive having a media, a slider and the head coupled with the slider. The read apparatus 300′ corresponds to the read apparatus 300. Consequently, analogous components are labeled similarly. The read apparatus 300′ includes shields 302 and 304, read sensor 310, capping layer 318, nonmagnetic layer 306 and soft magnetic bias structures 320′ that are analogous to the shields 302 and 304, read sensor 310, capping layer 318, nonmagnetic layer 306 and soft magnetic bias structures 320, respectively.


The magnetic bias structures 320′ include magnetic bias layers 330 and 350 and nonmagnetic layer 340. In some embodiments, the magnetic moments of the magnetic bias layers 330 and 350 are antiferromagnetically aligned. In other embodiments, the magnetic moments of the magnetic bias layers 330 and 350 are ferromagnetically aligned. One or both of the magnetic bias layers 330 and 350 include the side shielding material that has the saturation magnetization greater than 800 emu/cm3 and/or the exchange length less than five nanometers. The side shielding material(s) may be selected from the material(s) described above. In some embodiments, only the magnetic layers 330 are formed of the side shielding material(s). In other embodiments, only the magnetic layers 350 are formed of the side shielding material(s). In still other embodiments both of the magnetic layers 330 and 350 include the side shielding material(s).


The magnetic read apparatus 300′ may have improved performance analogous to that of the magnetic read apparatus 200 and/or 300. The large junction angles θ1 and θ2 may allow for improved performance of the read sensor 310. Further, the high junction angle read sensor 310 may be reliably fabricated using the method 100 and/or 110. The side magnetic bias structures 320′, particularly in combination with the large junction angle read sensor 310, may also provide improved side shielding. The side shielding material described above has a lower exchange length and larger magnetization than is typically selected for side shields. Thus, the improvement in the cross-track resolution for the magnetic read apparatus 300′ may be considered surprising.



FIG. 11 depicts an ABS view of an exemplary embodiment of a read apparatus 300″. For clarity, FIG. 11 is not to scale. The read apparatus 300″ may be part of a read head or may be part of a merged head that also includes a write apparatus. Thus, the read apparatus 300″ may be part of a disk drive having a media, a slider and the read apparatus coupled with (fabricated on) the slider. In other embodiments, the read apparatus 300″ may be part of another data storage device. Further, only a portion of the components of the read apparatus 300″ are depicted. The view shown in FIG. 11 may be for a read apparatus fabricated using the methods 100 and/or 110 in which the ion mills used to define the read sensor are performed at least for the cross-track direction. The head of which the read apparatus 300″ is a part is part of a disk drive having a media, a slider and the head coupled with the slider. The read apparatus 300″ corresponds to the read apparatus 300 and/or 300′. Consequently, analogous components are labeled similarly. The read apparatus 300″ includes shields 302 and 304, read sensor 310, capping layer 318, nonmagnetic layer 306 and soft magnetic bias structures 320″ that are analogous to the shields 302 and 304, read sensor 310, capping layer 318, nonmagnetic layer 306 and soft magnetic bias structures 320/320′, respectively.


The magnetic bias structures 320″ include magnetic bias layers 330′ and 350′. In the embodiment shown, the magnetic bias layers 330′ and 350′ adjoin (share an interface). However, in alternate embodiments, a nonmagnetic layer analogous to the nonmagnetic layer 340 may be included. In some embodiments, the magnetic moments of the magnetic bias layers 330′ and 350′ are ferromagnetically aligned. One or both of the magnetic bias layers 330′ and 350′ include the side shielding material that has the saturation magnetization greater than 800 emu/cm3 and/or the exchange length less than five nanometers. The side shielding material(s) may be selected from the material(s) described above. In some embodiments, only the magnetic layers 330′ are formed of the side shielding material(s). Because a portion of the magnetic bias layers 330′ are closer to the read sensor 310 than the magnetic bias layers 350′, it may be preferred to use the above-described side shielding materials in at least the magnetic bias layer 330′. In other embodiments, only the magnetic layers 350′ are formed of the side shielding material(s). In still other embodiments both of the magnetic layers 330′ and 350′ include the side shielding material(s).


The magnetic read apparatus 300″ may have improved performance analogous to that of the magnetic read apparatus 200, 300 and/or 300′. The large junction angles θ1 and θ2 may allow for improved performance of the read sensor 310. Further, the high junction angle read sensor 310 may be reliably fabricated using the method 100 and/or 110. The side magnetic bias structures 320″, particularly in combination with the large junction angle read sensor 310, may also provide improved side shielding. The side shielding material described above has a lower exchange length and larger magnetization than is typically selected for side shields. Thus, the improvement in the cross-track resolution for the magnetic read apparatus 300″ may be considered surprising.



FIG. 12 depicts an ABS view of an exemplary embodiment of a read apparatus 400. For clarity, FIG. 12 is not to scale. The read apparatus 400 may be part of a read head or may be part of a merged head that also includes a write apparatus. Thus, the read apparatus 400 may be part of a disk drive having a media, a slider and the read apparatus coupled with (fabricated on) the slider. In other embodiments, the read apparatus 400 may be part of another data storage device. Further, only a portion of the components of the read apparatus 400 are depicted. The view shown in FIG. 12 may be for a read apparatus fabricated using the methods 100 and/or 110 in which the ion mills used to define the read sensor are performed at least for the cross-track direction. The head of which the read apparatus 400 is a part is part of a disk drive having a media, a slider and the head coupled with the slider. The read apparatus 400 may correspond to the read apparatuses 200, 300, 300′ and/or 300″. Consequently, analogous components are labeled similarly. The read apparatus 400 includes shields 402 and 404, read sensor 410, capping layer 418, nonmagnetic layer 406 and magnetic bias structures 420 that are analogous to the shields 302 and 304, read sensor 310, capping layer 318, nonmagnetic layer 306 and soft magnetic bias structures 320/320′/320″, respectively.


The magnetic bias structures 420 may be monolithic, as shown in FIG. 12. Alternatively, the magnetic bias structures 420 or may include multiple layers, for example as shown in FIGS. 10 and 11. The magnetic read apparatus 400 also includes sensor 410. In the embodiment shown, the read sensor 410 includes an antiferromagnetic (AFM) layer 411, a reference layer 412 adjoining the AFM layer 411, a nonmagnetic spacer layer 414 and a free layer 416. The nonmagnetic spacer layer 414 may be a tunneling barrier layer, a conductive nonmagnetic layer or another analogous layer. The free layer 416 and reference layer 412 are magnetic and may include one or more sublayers. Similarly, the AFM layer 411 may be a multilayer or a single layer.


The magnetic read apparatus 400 may have improved performance analogous to that of the magnetic read apparatus 200, 300, 300′ and/or 300″. The large junction angles θ1 and θ2 may allow for improved performance of the read sensor 410. For example, the free layer 416 may have a larger volume and an attendant improvement in magnetic properties. The high junction angle read sensor 410 may be reliably fabricated using the method 100 and/or 110. The side magnetic bias structures 420, particularly in combination with the large junction angle read sensor 410, may also provide improved side shielding for the reasons discussed above. Thus, performance of the read apparatus 400 may be enhanced.



FIG. 13 depicts an ABS view of an exemplary embodiment of a read apparatus 400′. For clarity, FIG. 13 is not to scale. The read apparatus 400′ may be part of a read head or may be part of a merged head that also includes a write apparatus. Thus, the read apparatus 400′ may be part of a disk drive having a media, a slider and the read apparatus coupled with (fabricated on) the slider. In other embodiments, the read apparatus 400′ may be part of another data storage device. Further, only a portion of the components of the read apparatus 400′ are depicted. The view shown in FIG. 13 may be for a read apparatus fabricated using the methods 100 and/or 110 in which the ion mills used to define the read sensor are performed at least for the cross-track direction. The head of which the read apparatus 400′ is a part is part of a disk drive having a media, a slider and the head coupled with the slider. The read apparatus 400′ may correspond to the read apparatuses 200, 300, 300′, 300″ and/or 400. Consequently, analogous components are labeled similarly. The read apparatus 400′ includes shields 402 and 404, read sensor 410′, capping layer 418, nonmagnetic layer 406 and magnetic bias structures 420 that are analogous to the shields 402 and 404, read sensor 410, capping layer 418, nonmagnetic layer 406 and soft magnetic bias structures 420, respectively.


The magnetic bias structures 420 may be monolithic, as shown in FIG. 13. Alternatively, the magnetic bias structures 420 or may include multiple layers, for example as shown in FIGS. 10 and 11. The magnetic read apparatus 400′ also includes sensor 410′. In the embodiment shown, the read sensor 410′ is a dual free layer read sensor. Thus, the read sensor 410′ includes a first free layer 416A, a nonmagnetic spacer layer 414 and a second free layer 416B. The nonmagnetic spacer layer 414 may be a tunneling barrier layer, a conductive nonmagnetic layer or another analogous layer. The free layers 416A and 416B are magnetic and may include one or more sublayers. The magnetic layers 416A and 416B may be desired to be biased in a scissor mode. Thus, the magnetic read apparatus 400′ may include a rear magnetic bias structure (not shown in FIG. 13). In such an embodiment, the read sensor 410′ is between the rear bias structure and the ABS. Although depicted as straight, the sidewalls for the read sensor 410′ need not be. For example, the two free layers 416A and 416B may be symmetric. In such an embodiment, the middle region of the read sensor 410′ may be narrower than the top or the bottom.


The magnetic read apparatus 400′ may have improved performance analogous to that of the magnetic read apparatus 200, 300, 300′, 300″ and/or 400. The large junction angles θ1 and θ2 may allow for improved performance of the read sensor 410′. For example, the free layers 416A and 416B may have a larger volume and an attendant improvement in magnetic properties. The high junction angle read sensor 410′ may be reliably fabricated using the method 100 and/or 110. The side magnetic bias structures 420, particularly in combination with the large junction angle read sensor 410′, may also provide improved side shielding for the reasons discussed above. Thus, performance of the read apparatus 400′ may be enhanced.


Using the methods 100 and/or 110, the apparatuses 200, 300, 300′, 300″, 400 and/or 400′ may be fabricated. Thus, the benefits of one or more of the apparatuses 200, 300, 300′, 300″, 400, and/or 400′ may be achieved. In particular, the formation of the read sensors and the configuration of the magnetic bias structures may improve reading and side shielding. The benefits of the methods 100 and 110 and one or more of the read apparatuses 200, 300, 300′, 300″, 400 and/or 400′ may be attained.

Claims
  • 1. A magnetic read apparatus having an air-bearing surface (ABS), the magnetic read apparatus comprising: a read sensor having a bottom, a top, and a plurality of sides, the plurality of sides forming at least one junction angle with the bottom of the read sensor, at least one junction angle being at least seventy-five degrees and not more than one hundred and five degrees, the read sensor having a track width in a cross track direction of not more than five nanometers; andat least one soft side magnetic bias structure adjacent to the plurality of sides of the read sensor and separated from the plurality of sides by a nonmagnetic layer, the at least one soft side magnetic bias structure comprising a side shielding material having a saturation magnetization and an exchange length, at least one of the saturation magnetization being greater than 800 emu/cm3 and the exchange length being less than five nanometers, each of the at least one soft side magnetic bias structures comprising a first layer and a second layer adjoining the first layer, wherein the second layer comprises a first surface that is substantially parallel to the bottom of the read sensor and a second surface that is substantially parallel to the plurality of sides of the read sensor in a down track direction that is perpendicular to the cross-track direction, and wherein the second surface is directly between the second layer and the first layer such that the second layer is separated from the nonmagnetic layer by a portion of the first layer.
  • 2. The magnetic read apparatus of claim 1 wherein the at least one soft side magnetic bias structure consists of the side shielding material.
  • 3. The magnetic read apparatus of claim 1 wherein the at least one soft side magnetic bias structure comprises an additional side shielding material different from the side shielding material, the additional side shielding material having an additional saturation magnetization and an additional exchange length, at least one of the additional saturation magnetization being greater than 800 emu/cm3 and the additional exchange length being less than five nanometers.
  • 4. The magnetic read apparatus of claim 1 wherein the first layer of the at least one soft side magnetic bias structure comprises the side shielding material.
  • 5. The magnetic read apparatus of claim 4 wherein the first layer is adjacent to the plurality of sides of the read sensor.
  • 6. The magnetic read apparatus of claim 1 wherein the first layer and the second layer are ferromagnetically aligned.
  • 7. The magnetic read apparatus of claim 1 wherein the first layer and the second layer are antiferromagnetically aligned.
  • 8. The magnetic read apparatus of claim 1 wherein the second layer comprises an additional side shielding material different from the side shielding material, the additional side shielding material having an additional saturation magnetization and an additional exchange length, at least one of the additional saturation magnetization being greater than 800 emu/cm3 and the additional exchange length being less than five nanometers.
  • 9. The magnetic read apparatus of claim 1 wherein the junction angle is formed by: performing a first ion mill on the read sensor at a first angle and a first ion mill energy, the first angle being at least five degrees and not more than thirty degrees from a normal to the top surface of the read sensor, the first ion mill removing a portion of the read sensor such that less than half of a depth of a bottom layer of the read sensor remains unmilled; andperforming a second ion mill at a second angle and a second ion mill energy, the second ion mill energy being less than the first ion mill energy, the second angle being greater than the first angle.
US Referenced Citations (624)
Number Name Date Kind
5529671 Debley et al. Jun 1996 A
6016290 Chen et al. Jan 2000 A
6018441 Wu et al. Jan 2000 A
6025978 Hoshi et al. Feb 2000 A
6025988 Yan Feb 2000 A
6032353 Hiner et al. Mar 2000 A
6033532 Minami Mar 2000 A
6034851 Zarouri et al. Mar 2000 A
6043959 Crue et al. Mar 2000 A
6046885 Aimonetti et al. Apr 2000 A
6049650 Jerman et al. Apr 2000 A
6054023 Chang et al. Apr 2000 A
6055138 Shi Apr 2000 A
6058094 Davis et al. May 2000 A
6073338 Liu et al. Jun 2000 A
6078479 Nepela et al. Jun 2000 A
6081499 Berger et al. Jun 2000 A
6094803 Carlson et al. Aug 2000 A
6099362 Viches et al. Aug 2000 A
6103073 Thayamballi Aug 2000 A
6108166 Lederman Aug 2000 A
6118629 Huai et al. Sep 2000 A
6118638 Knapp et al. Sep 2000 A
6125018 Takagishi et al. Sep 2000 A
6130779 Carlson et al. Oct 2000 A
6134089 Barr et al. Oct 2000 A
6136166 Shen et al. Oct 2000 A
6137661 Shi et al. Oct 2000 A
6137662 Huai et al. Oct 2000 A
6160684 Heist et al. Dec 2000 A
6163426 Nepela et al. Dec 2000 A
6166891 Lederman et al. Dec 2000 A
6173486 Hsiao et al. Jan 2001 B1
6175476 Huai et al. Jan 2001 B1
6178066 Barr Jan 2001 B1
6178070 Hong et al. Jan 2001 B1
6178150 Davis Jan 2001 B1
6181485 He Jan 2001 B1
6181525 Carlson Jan 2001 B1
6185051 Chen et al. Feb 2001 B1
6185077 Tong et al. Feb 2001 B1
6185081 Simion et al. Feb 2001 B1
6188549 Wiitala Feb 2001 B1
6190764 Shi et al. Feb 2001 B1
6193584 Rudy et al. Feb 2001 B1
6195229 Shen et al. Feb 2001 B1
6198608 Hong et al. Mar 2001 B1
6198609 Barr et al. Mar 2001 B1
6201673 Rottmayer et al. Mar 2001 B1
6204998 Katz Mar 2001 B1
6204999 Crue et al. Mar 2001 B1
6212153 Chen et al. Apr 2001 B1
6215625 Carlson Apr 2001 B1
6219205 Yuan et al. Apr 2001 B1
6221218 Shi et al. Apr 2001 B1
6222707 Huai et al. Apr 2001 B1
6229782 Wang et al. May 2001 B1
6230959 Heist et al. May 2001 B1
6233116 Chen et al. May 2001 B1
6233125 Knapp et al. May 2001 B1
6237215 Hunsaker et al. May 2001 B1
6252743 Bozorgi Jun 2001 B1
6255721 Roberts Jul 2001 B1
6258468 Mahvan et al. Jul 2001 B1
6266216 Hikami et al. Jul 2001 B1
6271604 Frank, Jr. et al. Aug 2001 B1
6275354 Huai et al. Aug 2001 B1
6277505 Shi et al. Aug 2001 B1
6282056 Feng et al. Aug 2001 B1
6296955 Hossain et al. Oct 2001 B1
6297955 Frank, Jr. et al. Oct 2001 B1
6304414 Crue, Jr. et al. Oct 2001 B1
6307715 Berding et al. Oct 2001 B1
6310746 Hawwa et al. Oct 2001 B1
6310750 Hawwa et al. Oct 2001 B1
6317290 Wang et al. Nov 2001 B1
6317297 Tong et al. Nov 2001 B1
6322911 Fukagawa et al. Nov 2001 B1
6330136 Wang et al. Dec 2001 B1
6330137 Knapp et al. Dec 2001 B1
6333830 Rose et al. Dec 2001 B2
6340533 Ueno et al. Jan 2002 B1
6349014 Crue, Jr. et al. Feb 2002 B1
6351355 Min et al. Feb 2002 B1
6353318 Sin et al. Mar 2002 B1
6353511 Shi et al. Mar 2002 B1
6356412 Levi et al. Mar 2002 B1
6359779 Frank, Jr. et al. Mar 2002 B1
6369983 Hong Apr 2002 B1
6376964 Young et al. Apr 2002 B1
6377535 Chen et al. Apr 2002 B1
6381095 Sin et al. Apr 2002 B1
6381105 Huai et al. Apr 2002 B1
6389499 Frank, Jr. et al. May 2002 B1
6392850 Tong et al. May 2002 B1
6395388 Iwasaki et al. May 2002 B1
6396660 Jensen et al. May 2002 B1
6399179 Hanrahan et al. Jun 2002 B1
6400526 Crue, Jr. et al. Jun 2002 B2
6404600 Hawwa et al. Jun 2002 B1
6404601 Rottmayer et al. Jun 2002 B1
6404706 Stovall et al. Jun 2002 B1
6410170 Chen et al. Jun 2002 B1
6411522 Frank, Jr. et al. Jun 2002 B1
6417998 Crue, Jr. et al. Jul 2002 B1
6417999 Knapp et al. Jul 2002 B1
6418000 Gibbons et al. Jul 2002 B1
6418048 Sin et al. Jul 2002 B1
6421211 Hawwa et al. Jul 2002 B1
6421212 Gibbons et al. Jul 2002 B1
6424505 Lam et al. Jul 2002 B1
6424507 Lederman et al. Jul 2002 B1
6430009 Komaki et al. Aug 2002 B1
6430806 Chen et al. Aug 2002 B1
6433965 Gopinathan et al. Aug 2002 B1
6433968 Shi et al. Aug 2002 B1
6433970 Knapp et al. Aug 2002 B1
6437945 Hawwa et al. Aug 2002 B1
6445536 Rudy et al. Sep 2002 B1
6445542 Levi et al. Sep 2002 B1
6445553 Barr et al. Sep 2002 B2
6445554 Dong et al. Sep 2002 B1
6447935 Zhang et al. Sep 2002 B1
6448765 Chen et al. Sep 2002 B1
6451514 Iitsuka Sep 2002 B1
6452742 Crue et al. Sep 2002 B1
6452765 Mahvan et al. Sep 2002 B1
6456465 Louis et al. Sep 2002 B1
6459552 Liu et al. Oct 2002 B1
6462920 Karimi Oct 2002 B1
6466401 Hong et al. Oct 2002 B1
6466402 Crue, Jr. et al. Oct 2002 B1
6466404 Crue, Jr. et al. Oct 2002 B1
6468436 Shi et al. Oct 2002 B1
6469877 Knapp et al. Oct 2002 B1
6477019 Matono et al. Nov 2002 B2
6479096 Shi et al. Nov 2002 B1
6483662 Thomas et al. Nov 2002 B1
6487040 Hsiao et al. Nov 2002 B1
6487056 Gibbons et al. Nov 2002 B1
6490125 Barr Dec 2002 B1
6496330 Crue, Jr. et al. Dec 2002 B1
6496334 Pang et al. Dec 2002 B1
6504676 Hiner et al. Jan 2003 B1
6512657 Heist et al. Jan 2003 B2
6512659 Hawwa et al. Jan 2003 B1
6512661 Louis Jan 2003 B1
6512690 Qi et al. Jan 2003 B1
6515573 Dong et al. Feb 2003 B1
6515791 Hawwa et al. Feb 2003 B1
6532823 Knapp et al. Mar 2003 B1
6535363 Hosomi et al. Mar 2003 B1
6552874 Chen et al. Apr 2003 B1
6552928 Qi et al. Apr 2003 B1
6577470 Rumpler Jun 2003 B1
6583961 Levi et al. Jun 2003 B2
6583968 Scura et al. Jun 2003 B1
6597548 Yamanaka et al. Jul 2003 B1
6611398 Rumpler et al. Aug 2003 B1
6618223 Chen et al. Sep 2003 B1
6629357 Akoh Oct 2003 B1
6633464 Lai et al. Oct 2003 B2
6636394 Fukagawa et al. Oct 2003 B1
6639291 Sin et al. Oct 2003 B1
6650503 Chen et al. Nov 2003 B1
6650506 Risse Nov 2003 B1
6654195 Frank, Jr. et al. Nov 2003 B1
6657816 Barr et al. Dec 2003 B1
6661621 Iitsuka Dec 2003 B1
6661625 Sin et al. Dec 2003 B1
6674610 Thomas et al. Jan 2004 B1
6680863 Shi et al. Jan 2004 B1
6683763 Hiner et al. Jan 2004 B1
6687098 Huai Feb 2004 B1
6687178 Qi et al. Feb 2004 B1
6687977 Knapp et al. Feb 2004 B2
6691226 Frank, Jr. et al. Feb 2004 B1
6697294 Qi et al. Feb 2004 B1
6700738 Sin et al. Mar 2004 B1
6700759 Knapp et al. Mar 2004 B1
6704158 Hawwa et al. Mar 2004 B2
6707083 Hiner et al. Mar 2004 B1
6713801 Sin et al. Mar 2004 B1
6721138 Chen et al. Apr 2004 B1
6721149 Shi et al. Apr 2004 B1
6721203 Qi et al. Apr 2004 B1
6724569 Chen et al. Apr 2004 B1
6724572 Stoev et al. Apr 2004 B1
6729015 Matono et al. May 2004 B2
6735850 Gibbons et al. May 2004 B1
6737281 Dang et al. May 2004 B1
6744608 Chen et al. Jun 2004 B1
6747301 Hiner et al. Jun 2004 B1
6751055 Alfoqaha et al. Jun 2004 B1
6754049 Seagle et al. Jun 2004 B1
6756071 Shi et al. Jun 2004 B1
6757140 Hawwa Jun 2004 B1
6760196 Niu et al. Jul 2004 B1
6762910 Knapp et al. Jul 2004 B1
6765756 Hong et al. Jul 2004 B1
6775902 Huai et al. Aug 2004 B1
6778358 Jiang et al. Aug 2004 B1
6781927 Heanuc et al. Aug 2004 B1
6785955 Chen et al. Sep 2004 B1
6791793 Chen et al. Sep 2004 B1
6791807 Hikami et al. Sep 2004 B1
6798616 Seagle et al. Sep 2004 B1
6798625 Ueno et al. Sep 2004 B1
6801408 Chen et al. Oct 2004 B1
6801411 Lederman et al. Oct 2004 B1
6803615 Sin et al. Oct 2004 B1
6806035 Atireklapvarodom et al. Oct 2004 B1
6807030 Hawwa et al. Oct 2004 B1
6807332 Hawwa Oct 2004 B1
6809899 Chen et al. Oct 2004 B1
6816345 Knapp et al. Nov 2004 B1
6828897 Nepela Dec 2004 B1
6829160 Qi et al. Dec 2004 B1
6829819 Crue, Jr. et al. Dec 2004 B1
6833979 Knapp et al. Dec 2004 B1
6834010 Qi et al. Dec 2004 B1
6859343 Alfoqaha et al. Feb 2005 B1
6859997 Tong et al. Mar 2005 B1
6861937 Feng et al. Mar 2005 B1
6870712 Chen et al. Mar 2005 B2
6873494 Chen et al. Mar 2005 B2
6873547 Shi et al. Mar 2005 B1
6879464 Sun et al. Apr 2005 B2
6888184 Shi et al. May 2005 B1
6888704 Diao et al. May 2005 B1
6891702 Tang May 2005 B1
6894871 Alfoqaha et al. May 2005 B2
6894877 Crue, Jr. et al. May 2005 B1
6906894 Chen et al. Jun 2005 B2
6909578 Missell et al. Jun 2005 B1
6912106 Chen et al. Jun 2005 B1
6934113 Chen Aug 2005 B1
6934129 Zhang et al. Aug 2005 B1
6940688 Jiang et al. Sep 2005 B2
6942824 Li Sep 2005 B1
6943993 Chang et al. Sep 2005 B2
6944938 Crue, Jr. et al. Sep 2005 B1
6947258 Li Sep 2005 B1
6950266 McCaslin et al. Sep 2005 B1
6954332 Hong et al. Oct 2005 B1
6958885 Chen et al. Oct 2005 B1
6961221 Niu et al. Nov 2005 B1
6969989 Mei Nov 2005 B1
6975486 Chen et al. Dec 2005 B2
6987643 Seagle Jan 2006 B1
6989962 Dong et al. Jan 2006 B1
6989972 Stoev et al. Jan 2006 B1
7006327 Krounbi et al. Feb 2006 B2
7007372 Chen et al. Mar 2006 B1
7012832 Sin et al. Mar 2006 B1
7023658 Knapp et al. Apr 2006 B1
7026063 Ueno et al. Apr 2006 B2
7027268 Zhu et al. Apr 2006 B1
7027274 Sin et al. Apr 2006 B1
7035046 Young et al. Apr 2006 B1
7041985 Wang et al. May 2006 B1
7046490 Ueno et al. May 2006 B1
7054113 Seagle et al. May 2006 B1
7057857 Niu et al. Jun 2006 B1
7059868 Yan Jun 2006 B1
7092195 Liu et al. Aug 2006 B1
7110289 Sin et al. Sep 2006 B1
7111382 Knapp et al. Sep 2006 B1
7113366 Wang et al. Sep 2006 B1
7114241 Kubota et al. Oct 2006 B2
7116517 He et al. Oct 2006 B1
7124654 Davies et al. Oct 2006 B1
7126788 Liu et al. Oct 2006 B1
7126790 Liu et al. Oct 2006 B1
7131346 Buttar et al. Nov 2006 B1
7133253 Seagle et al. Nov 2006 B1
7134185 Knapp et al. Nov 2006 B1
7154715 Yamanaka et al. Dec 2006 B2
7170725 Zhou et al. Jan 2007 B1
7177117 Jiang et al. Feb 2007 B1
7193815 Stoev et al. Mar 2007 B1
7196880 Anderson et al. Mar 2007 B1
7199974 Alfoqaha Apr 2007 B1
7199975 Pan Apr 2007 B1
7211339 Seagle et al. May 2007 B1
7212384 Stoev et al. May 2007 B1
7238292 He et al. Jul 2007 B1
7239478 Sin et al. Jul 2007 B1
7248431 Liu et al. Jul 2007 B1
7248433 Stoev et al. Jul 2007 B1
7248449 Seagle Jul 2007 B1
7280325 Pan Oct 2007 B1
7283327 Liu et al. Oct 2007 B1
7284316 Huai et al. Oct 2007 B1
7286329 Chen et al. Oct 2007 B1
7289303 Sin et al. Oct 2007 B1
7292409 Stoev et al. Nov 2007 B1
7296339 Yang et al. Nov 2007 B1
7307814 Seagle et al. Dec 2007 B1
7307818 Park et al. Dec 2007 B1
7310204 Stoev et al. Dec 2007 B1
7318947 Park et al. Jan 2008 B1
7333295 Medina et al. Feb 2008 B1
7337530 Stoev et al. Mar 2008 B1
7342752 Zhang et al. Mar 2008 B1
7349170 Rudman et al. Mar 2008 B1
7349179 He et al. Mar 2008 B1
7354664 Jiang et al. Apr 2008 B1
7363697 Dunn et al. Apr 2008 B1
7371152 Newman May 2008 B1
7372665 Stoev et al. May 2008 B1
7375926 Stoev et al. May 2008 B1
7379269 Krounbi et al. May 2008 B1
7386933 Krounbi et al. Jun 2008 B1
7389577 Shang et al. Jun 2008 B1
7417832 Erickson et al. Aug 2008 B1
7419891 Chen et al. Sep 2008 B1
7428124 Song et al. Sep 2008 B1
7430098 Song et al. Sep 2008 B1
7436620 Kang et al. Oct 2008 B1
7436638 Pan Oct 2008 B1
7440220 Kang et al. Oct 2008 B1
7443632 Stoev et al. Oct 2008 B1
7444740 Chung et al. Nov 2008 B1
7493688 Wang et al. Feb 2009 B1
7508627 Zhang et al. Mar 2009 B1
7522377 Jiang et al. Apr 2009 B1
7522379 Krounbi et al. Apr 2009 B1
7522382 Pan Apr 2009 B1
7542246 Song et al. Jun 2009 B1
7551406 Thomas et al. Jun 2009 B1
7552523 He et al. Jun 2009 B1
7554767 Hu et al. Jun 2009 B1
7583466 Kermiche et al. Sep 2009 B2
7595967 Moon et al. Sep 2009 B1
7639457 Chen et al. Dec 2009 B1
7660080 Liu et al. Feb 2010 B1
7672080 Tang et al. Mar 2010 B1
7672086 Jiang Mar 2010 B1
7684160 Erickson et al. Mar 2010 B1
7688546 Bai et al. Mar 2010 B1
7691434 Zhang et al. Apr 2010 B1
7695761 Shen et al. Apr 2010 B1
7719795 Hu et al. May 2010 B2
7726009 Liu et al. Jun 2010 B1
7729086 Song et al. Jun 2010 B1
7729087 Stoev et al. Jun 2010 B1
7736823 Wang et al. Jun 2010 B1
7785666 Sun et al. Aug 2010 B1
7796356 Fowler et al. Sep 2010 B1
7800858 Bajikar et al. Sep 2010 B1
7819979 Chen et al. Oct 2010 B1
7829264 Wang et al. Nov 2010 B1
7846643 Sun et al. Dec 2010 B1
7855854 Hu et al. Dec 2010 B2
7869160 Pan et al. Jan 2011 B1
7872824 Macchioni et al. Jan 2011 B1
7872833 Hu et al. Jan 2011 B2
7910267 Zeng et al. Mar 2011 B1
7911735 Sin et al. Mar 2011 B1
7911737 Jiang et al. Mar 2011 B1
7916426 Hu et al. Mar 2011 B2
7918013 Dunn et al. Apr 2011 B1
7968219 Jiang et al. Jun 2011 B1
7982989 Shi et al. Jul 2011 B1
8008912 Shang Aug 2011 B1
8012804 Wang et al. Sep 2011 B1
8015692 Zhang et al. Sep 2011 B1
8018677 Chung et al. Sep 2011 B1
8018678 Zhang et al. Sep 2011 B1
8024748 Moravec et al. Sep 2011 B1
8072705 Wang et al. Dec 2011 B1
8074345 Anguelouch et al. Dec 2011 B1
8077418 Hu et al. Dec 2011 B1
8077434 Shen et al. Dec 2011 B1
8077435 Liu et al. Dec 2011 B1
8077557 Hu et al. Dec 2011 B1
8079135 Shen et al. Dec 2011 B1
8081403 Chen et al. Dec 2011 B1
8091210 Sasaki et al. Jan 2012 B1
8097846 Anguelouch et al. Jan 2012 B1
8104166 Zhang et al. Jan 2012 B1
8116043 Leng et al. Feb 2012 B2
8116171 Lee Feb 2012 B1
8125856 Li et al. Feb 2012 B1
8134794 Wang Mar 2012 B1
8136224 Sun et al. Mar 2012 B1
8136225 Zhang et al. Mar 2012 B1
8136805 Lee Mar 2012 B1
8141235 Zhang Mar 2012 B1
8146236 Luo et al. Apr 2012 B1
8149536 Yang et al. Apr 2012 B1
8151441 Rudy et al. Apr 2012 B1
8163185 Sun et al. Apr 2012 B1
8164760 Willis Apr 2012 B2
8164855 Gibbons et al. Apr 2012 B1
8164864 Kaiser et al. Apr 2012 B2
8165709 Rudy Apr 2012 B1
8166631 Tran et al. May 2012 B1
8166632 Zhang et al. May 2012 B1
8169473 Yu et al. May 2012 B1
8171618 Wang et al. May 2012 B1
8179636 Bai et al. May 2012 B1
8191237 Luo et al. Jun 2012 B1
8194365 Leng et al. Jun 2012 B1
8194366 Li et al. Jun 2012 B1
8196285 Zhang et al. Jun 2012 B1
8200054 Li et al. Jun 2012 B1
8203800 Li et al. Jun 2012 B2
8208350 Hu et al. Jun 2012 B1
8220140 Wang et al. Jul 2012 B1
8222599 Chien Jul 2012 B1
8225488 Zhang et al. Jul 2012 B1
8227023 Liu et al. Jul 2012 B1
8228633 Tran et al. Jul 2012 B1
8231796 Li et al. Jul 2012 B1
8233248 Li et al. Jul 2012 B1
8248896 Yuan et al. Aug 2012 B1
8254060 Shi et al. Aug 2012 B1
8257597 Guan et al. Sep 2012 B1
8259410 Bai et al. Sep 2012 B1
8259539 Hu et al. Sep 2012 B1
8262918 Li et al. Sep 2012 B1
8262919 Luo et al. Sep 2012 B1
8264797 Emley Sep 2012 B2
8264798 Guan et al. Sep 2012 B1
8270126 Roy et al. Sep 2012 B1
8276258 Tran et al. Oct 2012 B1
8277669 Chen et al. Oct 2012 B1
8279719 Hu et al. Oct 2012 B1
8284517 Sun et al. Oct 2012 B1
8288204 Wang et al. Oct 2012 B1
8289821 Huber Oct 2012 B1
8291743 Shi et al. Oct 2012 B1
8307539 Rudy et al. Nov 2012 B1
8307540 Tran et al. Nov 2012 B1
8308921 Hiner et al. Nov 2012 B1
8310785 Zhang et al. Nov 2012 B1
8310901 Batra et al. Nov 2012 B1
8315019 Mao et al. Nov 2012 B1
8316527 Hong et al. Nov 2012 B2
8320076 Shen et al. Nov 2012 B1
8320077 Tang et al. Nov 2012 B1
8320219 Wolf et al. Nov 2012 B1
8320220 Yuan et al. Nov 2012 B1
8320722 Yuan et al. Nov 2012 B1
8322022 Yi et al. Dec 2012 B1
8322023 Zeng et al. Dec 2012 B1
8325569 Shi et al. Dec 2012 B1
8333008 Sin et al. Dec 2012 B1
8334093 Zhang et al. Dec 2012 B2
8336194 Yuan et al. Dec 2012 B2
8339738 Tran et al. Dec 2012 B1
8341826 Jiang et al. Jan 2013 B1
8343319 Li et al. Jan 2013 B1
8343364 Gao et al. Jan 2013 B1
8349195 Si et al. Jan 2013 B1
8351307 Wolf et al. Jan 2013 B1
8357244 Zhao et al. Jan 2013 B1
8373945 Luo et al. Feb 2013 B1
8375564 Luo et al. Feb 2013 B1
8375565 Hu et al. Feb 2013 B2
8381391 Park et al. Feb 2013 B2
8385157 Champion et al. Feb 2013 B1
8385158 Hu et al. Feb 2013 B1
8393073 Contreras et al. Mar 2013 B2
8394280 Wan et al. Mar 2013 B1
8400731 Li et al. Mar 2013 B1
8404128 Zhang et al. Mar 2013 B1
8404129 Luo et al. Mar 2013 B1
8405930 Li et al. Mar 2013 B1
8409453 Jiang et al. Apr 2013 B1
8413317 Wan et al. Apr 2013 B1
8416540 Li et al. Apr 2013 B1
8419953 Su et al. Apr 2013 B1
8419954 Chen et al. Apr 2013 B1
8422176 Leng et al. Apr 2013 B1
8422342 Lee Apr 2013 B1
8422841 Shi et al. Apr 2013 B1
8424192 Yang et al. Apr 2013 B1
8437106 Yanagisawa May 2013 B2
8441756 Sun et al. May 2013 B1
8443510 Shi et al. May 2013 B1
8444866 Guan et al. May 2013 B1
8449948 Medina et al. May 2013 B2
8451556 Wang et al. May 2013 B1
8451563 Zhang et al. May 2013 B1
8454846 Zhou et al. Jun 2013 B1
8455119 Jiang et al. Jun 2013 B1
8456961 Wang et al. Jun 2013 B1
8456963 Hu et al. Jun 2013 B1
8456964 Yuan et al. Jun 2013 B1
8456966 Shi et al. Jun 2013 B1
8456967 Mallary Jun 2013 B1
8458892 Si et al. Jun 2013 B2
8462592 Wolf et al. Jun 2013 B1
8468682 Zhang Jun 2013 B1
8472288 Wolf et al. Jun 2013 B1
8480911 Osugi et al. Jul 2013 B1
8486285 Zhou et al. Jul 2013 B2
8486286 Gao et al. Jul 2013 B1
8488272 Tran et al. Jul 2013 B1
8491801 Tanner et al. Jul 2013 B1
8491802 Gao et al. Jul 2013 B1
8493693 Zheng et al. Jul 2013 B1
8493695 Kaiser et al. Jul 2013 B1
8495813 Hu et al. Jul 2013 B1
8498084 Leng et al. Jul 2013 B1
8506828 Osugi et al. Aug 2013 B1
8514517 Batra et al. Aug 2013 B1
8518279 Wang et al. Aug 2013 B1
8518832 Yang et al. Aug 2013 B1
8520336 Liu et al. Aug 2013 B1
8520337 Liu et al. Aug 2013 B1
8524068 Medina et al. Sep 2013 B2
8526275 Yuan et al. Sep 2013 B1
8531801 Xiao et al. Sep 2013 B1
8532450 Wang et al. Sep 2013 B1
8533937 Wang et al. Sep 2013 B1
8537494 Pan et al. Sep 2013 B1
8537495 Luo et al. Sep 2013 B1
8537502 Park et al. Sep 2013 B1
8545999 Leng et al. Oct 2013 B1
8547659 Bai et al. Oct 2013 B1
8547667 Roy et al. Oct 2013 B1
8547730 Shen et al. Oct 2013 B1
8555486 Medina et al. Oct 2013 B1
8559141 Pakala et al. Oct 2013 B1
8563146 Zhang et al. Oct 2013 B1
8565049 Tanner et al. Oct 2013 B1
8576517 Tran et al. Nov 2013 B1
8578594 Jiang et al. Nov 2013 B2
8582238 Liu et al. Nov 2013 B1
8582241 Yu et al. Nov 2013 B1
8582253 Zheng et al. Nov 2013 B1
8588039 Shi et al. Nov 2013 B1
8593914 Wang et al. Nov 2013 B2
8597528 Roy et al. Dec 2013 B1
8599520 Liu et al. Dec 2013 B1
8599657 Lee Dec 2013 B1
8603593 Roy et al. Dec 2013 B1
8607438 Gao et al. Dec 2013 B1
8607439 Wang et al. Dec 2013 B1
8611035 Bajikar et al. Dec 2013 B1
8611054 Shang et al. Dec 2013 B1
8611055 Pakala et al. Dec 2013 B1
8614864 Hong et al. Dec 2013 B1
8619512 Yuan et al. Dec 2013 B1
8625233 Ji et al. Jan 2014 B1
8625941 Shi et al. Jan 2014 B1
8628672 Si et al. Jan 2014 B1
8630068 Mauri et al. Jan 2014 B1
8634280 Wang et al. Jan 2014 B1
8637397 Maekawa et al. Jan 2014 B2
8638529 Leng et al. Jan 2014 B1
8643980 Fowler et al. Feb 2014 B1
8649123 Zhang et al. Feb 2014 B1
8665561 Knutson et al. Mar 2014 B1
8670211 Sun et al. Mar 2014 B1
8670213 Zeng et al. Mar 2014 B1
8670214 Knutson et al. Mar 2014 B1
8670294 Shi et al. Mar 2014 B1
8670295 Hu et al. Mar 2014 B1
8675318 Ho et al. Mar 2014 B1
8675455 Krichevsky et al. Mar 2014 B1
8681594 Shi et al. Mar 2014 B1
8689430 Chen et al. Apr 2014 B1
8693141 Elliott et al. Apr 2014 B1
8703397 Zeng et al. Apr 2014 B1
8705205 Li et al. Apr 2014 B1
8711518 Zeng et al. Apr 2014 B1
8711528 Xiao et al. Apr 2014 B1
8717709 Shi et al. May 2014 B1
8720044 Tran et al. May 2014 B1
8721902 Wang et al. May 2014 B1
8724259 Liu et al. May 2014 B1
8749790 Tanner et al. Jun 2014 B1
8749920 Knutson et al. Jun 2014 B1
8753903 Tanner et al. Jun 2014 B1
8760807 Zhang et al. Jun 2014 B1
8760818 Diao et al. Jun 2014 B1
8760819 Liu et al. Jun 2014 B1
8760822 Li et al. Jun 2014 B1
8760823 Chen Jun 2014 B1
8763235 Wang et al. Jul 2014 B1
8780498 Jiang et al. Jul 2014 B1
8780505 Xiao Jul 2014 B1
8786983 Liu et al. Jul 2014 B1
8790524 Luo et al. Jul 2014 B1
8790527 Luo et al. Jul 2014 B1
8792208 Liu et al. Jul 2014 B1
8792312 Wang et al. Jul 2014 B1
8793866 Zhang et al. Aug 2014 B1
8796152 Mao et al. Aug 2014 B2
8797680 Luo et al. Aug 2014 B1
8797684 Tran et al. Aug 2014 B1
8797686 Bai et al. Aug 2014 B1
8797692 Guo et al. Aug 2014 B1
8813324 Emley et al. Aug 2014 B2
8922953 Childress Dec 2014 B1
8953284 Mashima et al. Feb 2015 B1
9076468 Keener Jul 2015 B1
20090290264 Ayukawa Nov 2009 A1
20100053820 Miyauchi Mar 2010 A1
20100290157 Zhang et al. Nov 2010 A1
20110086240 Xiang et al. Apr 2011 A1
20110279923 Miyauchi Nov 2011 A1
20120111826 Chen et al. May 2012 A1
20120216378 Emley et al. Aug 2012 A1
20120237878 Zeng et al. Sep 2012 A1
20120298621 Gao Nov 2012 A1
20130216702 Kaiser et al. Aug 2013 A1
20130216863 Li et al. Aug 2013 A1
20130257421 Shang et al. Oct 2013 A1
20140154529 Yang et al. Jun 2014 A1
20140175050 Zhang et al. Jun 2014 A1
20140218823 McKinlay et al. Aug 2014 A1
20140218825 Sapozhnikov et al. Aug 2014 A1
20140252517 Zhang et al. Sep 2014 A1
20140252518 Zhang et al. Sep 2014 A1
20150092303 Aoyama Apr 2015 A1
20150116867 Childress Apr 2015 A1
20150154991 Le Jun 2015 A1
20150248903 Aoyama Sep 2015 A1
Non-Patent Literature Citations (2)
Entry
Y.Chen et al. , “2Tbit/in2 Reader Design Outlook”, IEEE Trans. Magn. , vol. 46, No. 3, pp. 697-701, Mar. 2010.
G. S. Abo et al. , “Definition of Magnetic Exchange Length”, IEEE Trans. Magn. , vol. 49, No. 8, pp. 4937-4939, Aug. 2013.