Field of the Invention
The present application relates generally to battery cooling systems and more particularly, but not by way of limitation, to battery cooling systems incorporating heat pipes constructed with low-profile extrusions adapted for select heat exchange and designed for use with a battery array.
History of the Related Art
Dependence on non-renewable carbon-based energy sources, such as, for example, oil, gas, coal, and the like has led to intense focus on development of alternative energy sources. Moreover, detrimental environmental effects believed to be associated with carbon-based fuels have contributed to an urgency with which alternative energy sources are developed.
Chief among alternative energy initiatives is development of alternatively-fueled vehicles. In the United States alone, each passenger vehicle is estimated to release in excess of approximately 11,000 pounds of carbon dioxide along with smaller amounts of various other pollutants. Pollution worsens air quality and, in many cases, leads to respiratory problems. In addition, carbon-based pollutants are commonly believed to be a contributing factor in climate change and global warming.
The last decade has seen progress in development of alternatively-fueled vehicles. Vehicles fueled by, for example, natural gas, present cleaner and cheaper alternatives to traditional gasoline-powered vehicles. In addition, hybrid vehicles, combining a small gasoline-powered engine with a battery backup, have been developed. While these developments certainly amount to improvements in existing technology, the long-term goal of automotive research and development is development of an economical electric-powered vehicle.
Development of electric-powered vehicles present unique challenges to auto manufacturers. For example, electric-powered vehicles typically require a potential difference of approximately 36 to approximately 48 Volts. Most commercially-available electric-powered vehicles generate the required voltage with a large battery array. Such an array can include, for example, between six and nine 12-Volt batteries. The requirement of a large battery array presents a number of design challenges. First, a battery array generates considerable heat that must be dissipated to a heat sink. Second, a battery array must be efficiently sized to fit within space-confined areas of a passenger vehicle. Consequently, any cooling system for the battery array must also be economically sized.
The present invention relates generally to battery-cooling systems. In one aspect, the present invention relates to a battery-cooling system. The battery-cooling system includes a battery array and a plurality of heat pipes. Each heat pipe includes a low-profile extrusion having a plurality of hollow tubes formed therein. Each heat pipe includes an evaporator portion and a condenser portion. A heat-transfer fluid is disposed within the plurality of hollow tubes. The evaporator portion is disposed between successive batteries within the battery array. The condenser portion is disposed outside of the battery array and exposed to a heat sink.
In another aspect, the present invention relates to a method of cooling a battery array. The method includes providing a plurality of heat pipes. Each heat pipe includes a low-profile extrusion having a plurality of hollow tubes formed therein. Each heat pipe includes an evaporator portion and a condenser portion. The method further includes placing the evaporator portion between successive batteries within the battery array and arranging the evaporator portion to maximize thermal exposure of the evaporator portion to the successive batteries. The method further includes conducting heat into the evaporator portion from the battery array and discharging the heat from the condenser portion to a heat sink.
For a more complete understanding of the present invention and for further objects and advantages thereof, reference may now be had to the following description taken in conjunction with the accompanying drawings in which:
Various embodiments of the present invention will now be described more fully with reference to the accompanying drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
As used herein, the term “low-profile extrusion” refers to a heat-exchange apparatus including an integral piece of metal having a plurality of hollow tubes formed therein containing a heat-transfer fluid. In one embodiment, the low-profile extrusion includes multi-void micro-extruded hollow tubes designed to resist corrosion and to operate under pressures and temperatures required by modern environmentally-safe refrigeration gases.
In a typical embodiment, the plurality of hollow tubes are interconnected at their ends so as to allow fluid communication between each tube. Low-profile extrusions are typically formed from heat-conductive materials such as, for example, aluminum. In various alternative embodiments, other heat-conductive materials such as, for example, copper, steel, and other metals or metal alloys may be used. In a typical embodiment, the plurality of hollow tubes have a diameter in a range of about 0.0625 inches to about 0.5 inches, but, in various alternative embodiments, the plurality of hollow tubes may also have significantly smaller diameters.
Low-profile extrusions are typically manufactured with a profile, or height, as low as about 0.05 inches and with the plurality of hollow tubes having varying inner diameters. Future advances may allow low-profile extrusions to be manufactured with smaller profiles. Low-profile extrusions have been used in heat-exchanger applications in the automotive industry and are commercially available in strip form (having a generally rectangular geometry) or coil form (a continuous strip coiled for efficient transport). More detailed disclosure of exemplary low-profile extrusions may be found in U.S. Pat. No. 6,935,409, filed Jun. 8, 1999, U.S. Pat. No. 6,988,315, filed Dec. 23, 2002, and U.S. Pat. No. 7,802,436, filed Jan. 20, 2006 each of which is incorporated herein by reference.
Still referring to
Still referring to
Still referring to
Referring to
Still referring to
Still referring to
Although various embodiments of the method and system of the present invention have been illustrated in the accompanying Drawings and described in the foregoing Specification, it will be understood that the invention is not limited to the embodiments disclosed, but is capable of numerous rearrangements, modifications, and substitutions without departing from the spirit and scope of the invention as set forth herein. For example, the heat pipes 14 and 402 have been shown and described herein as having a generally flat profile; however, one skilled in the art will recognize that the heat pipes 14 and 402 could have any profile shape such as, for example, round. It is intended that the Specification and examples be considered as illustrative only.
This application is a continuation of U.S. patent application Ser. No. 13/294,538, filed on Nov. 11, 2011. U.S. patent application Ser. No. 13/294,538 is a Continuation-in-Part of U.S. patent application Ser. No. 12/857,635, filed Aug. 17, 2010. U.S. patent application Ser. No. 12/857,635 is a Continuation of U.S. patent application Ser. No. 10/998,199 (now U.S. Pat. No. 7,857,037), filed Nov. 26, 2004. U.S. patent application Ser. No. 10/998,199 is a Continuation-in-Part of U.S. patent application Ser. No. 10/305,662 (now U.S. Pat. No. 6,834,712), filed Nov. 26, 2002. U.S. patent application Ser. No. 10/305,662 claims priority to U.S. Provisional Patent Application No. 60/334,235 filed Nov. 27, 2001. U.S. patent application Ser. No. 13/294,538 claims priority to U.S. Provisional Patent Application No. 61/412,817, filed Nov. 12, 2010. U.S. patent application Ser. No. 12/857,635, U.S. patent application Ser. No. 10/998,199, U.S. patent application Ser. No. 10/305,662, U.S. patent application Ser. No. 12/871,583, U.S. patent application Ser. No. 11/336,698, U.S. patent application Ser. No. 10/328,537, U.S. patent application Ser. No. 09/328,183, U.S. patent application Ser. No. 08/327,329, U.S. Provisional Patent Application No. 60/525,242, U.S. Provisional Patent Application No. 60/334,235, U.S. Provisional Patent Application No. 61/412,817, and U.S. Provisional Patent Application No. 60/088,428 are each incorporated herein by reference.
Number | Name | Date | Kind |
---|---|---|---|
3528494 | Levedahl | Sep 1970 | A |
3834171 | Johansson | Sep 1974 | A |
3875926 | Frank | Apr 1975 | A |
4036290 | Kelly | Jul 1977 | A |
4072188 | Wilson et al. | Feb 1978 | A |
4125122 | Stachurski | Nov 1978 | A |
4180127 | Maxson | Dec 1979 | A |
4196504 | Eastman | Apr 1980 | A |
4245380 | Maxson | Jan 1981 | A |
4279294 | Fitzpatrick et al. | Jul 1981 | A |
4280519 | Chapman | Jul 1981 | A |
4345642 | Ernst et al. | Aug 1982 | A |
4353415 | Klaschka et al. | Oct 1982 | A |
4375157 | Boesen | Mar 1983 | A |
4381032 | Cutchaw | Apr 1983 | A |
4438759 | Kitajima et al. | Mar 1984 | A |
4448028 | Chao et al. | May 1984 | A |
4470450 | Bizzell et al. | Sep 1984 | A |
4493308 | Hurley et al. | Jan 1985 | A |
4503906 | Andres et al. | Mar 1985 | A |
4513732 | Feldman, Jr. | Apr 1985 | A |
4550774 | Andres et al. | Nov 1985 | A |
4558395 | Yamada et al. | Dec 1985 | A |
4562955 | Horster et al. | Jan 1986 | A |
4621681 | Grover | Nov 1986 | A |
4640347 | Grover et al. | Feb 1987 | A |
4675783 | Murase | Jun 1987 | A |
4686961 | Garrison | Aug 1987 | A |
4706739 | Noren | Nov 1987 | A |
4729060 | Yamamoto et al. | Mar 1988 | A |
4770238 | Owen | Sep 1988 | A |
4802929 | Schock | Feb 1989 | A |
4830100 | Kato et al. | May 1989 | A |
4854377 | Komoto et al. | Aug 1989 | A |
4880052 | Meyer, IV et al. | Nov 1989 | A |
4880053 | Sheyman | Nov 1989 | A |
4884630 | Nelson et al. | Dec 1989 | A |
4896716 | Sotani et al. | Jan 1990 | A |
4899810 | Fredley | Feb 1990 | A |
4909315 | Nelson et al. | Mar 1990 | A |
4921041 | Akachi | May 1990 | A |
4982274 | Murase et al. | Jan 1991 | A |
5002122 | Sarraf et al. | Mar 1991 | A |
5005640 | Lapinski et al. | Apr 1991 | A |
5029389 | Tanzer | Jul 1991 | A |
5036384 | Umezawa | Jul 1991 | A |
5038569 | Shirota et al. | Aug 1991 | A |
5044429 | Sakaya et al. | Sep 1991 | A |
5054296 | Sotani et al. | Oct 1991 | A |
5069274 | Haslett et al. | Dec 1991 | A |
5076351 | Munekawa et al. | Dec 1991 | A |
5084966 | Murase | Feb 1992 | A |
5099311 | Bonde et al. | Mar 1992 | A |
5103897 | Cullimore et al. | Apr 1992 | A |
5117901 | Cullimore | Jun 1992 | A |
5133492 | Wohrstein et al. | Jul 1992 | A |
5139546 | Novobilski | Aug 1992 | A |
5159529 | Lovgren et al. | Oct 1992 | A |
5168921 | Meyer, IV | Dec 1992 | A |
5179043 | Weichold et al. | Jan 1993 | A |
5186252 | Nishizawa et al. | Feb 1993 | A |
5199487 | DiFrancesco et al. | Apr 1993 | A |
5203399 | Koizumi | Apr 1993 | A |
5207674 | Hamilton | May 1993 | A |
5219020 | Akachi | Jun 1993 | A |
5220171 | Hara et al. | Jun 1993 | A |
5268812 | Conte | Dec 1993 | A |
5283464 | Murase | Feb 1994 | A |
5283715 | Carlsten et al. | Feb 1994 | A |
5285347 | Fox et al. | Feb 1994 | A |
5314010 | Sakaya et al. | May 1994 | A |
5316077 | Reichard | May 1994 | A |
5336128 | Birdsong | Aug 1994 | A |
5342189 | Inamura et al. | Aug 1994 | A |
5353639 | Brookins et al. | Oct 1994 | A |
5355942 | Conte | Oct 1994 | A |
5383340 | Larson et al. | Jan 1995 | A |
5388635 | Gruber et al. | Feb 1995 | A |
5404938 | Dinh | Apr 1995 | A |
5409055 | Tanaka et al. | Apr 1995 | A |
5465780 | Muntner et al. | Nov 1995 | A |
5465782 | Sun et al. | Nov 1995 | A |
5535816 | Ishida | Jul 1996 | A |
5544698 | Paulman | Aug 1996 | A |
5555622 | Yamamoto et al. | Sep 1996 | A |
5567493 | Imai et al. | Oct 1996 | A |
5579830 | Giammaruti | Dec 1996 | A |
5598632 | Camarda et al. | Feb 1997 | A |
5615086 | Collins et al. | Mar 1997 | A |
5636684 | Teytu et al. | Jun 1997 | A |
5642775 | Akachi | Jul 1997 | A |
5647429 | Oktay et al. | Jul 1997 | A |
5647430 | Tajima | Jul 1997 | A |
5651414 | Suzuki et al. | Jul 1997 | A |
5653111 | Attey et al. | Aug 1997 | A |
5655598 | Garriss et al. | Aug 1997 | A |
5660229 | Lee et al. | Aug 1997 | A |
5666819 | Rockenfeller et al. | Sep 1997 | A |
5675473 | McDunn et al. | Oct 1997 | A |
5682748 | DeVilbiss et al. | Nov 1997 | A |
5689957 | DeVilbiss et al. | Nov 1997 | A |
5690849 | DeVilbiss et al. | Nov 1997 | A |
5692558 | Hamilton et al. | Dec 1997 | A |
5697428 | Akachi | Dec 1997 | A |
5711155 | DeVilbiss et al. | Jan 1998 | A |
5727619 | Yao et al. | Mar 1998 | A |
5729995 | Tajima | Mar 1998 | A |
5731954 | Cheon | Mar 1998 | A |
5737186 | Fuesser et al. | Apr 1998 | A |
5785088 | Pai | Jul 1998 | A |
5816313 | Baker | Oct 1998 | A |
5890371 | Rajasubramanian et al. | Apr 1999 | A |
5896917 | Lemont et al. | Apr 1999 | A |
5901037 | Hamilton et al. | May 1999 | A |
5901040 | Cromwell et al. | May 1999 | A |
5960866 | Kimura et al. | Oct 1999 | A |
5989285 | DeVilbiss et al. | Nov 1999 | A |
6026890 | Akachi | Feb 2000 | A |
6032726 | Wright et al. | Mar 2000 | A |
6041850 | Esser et al. | Mar 2000 | A |
6058712 | Rajasubramanian et al. | May 2000 | A |
6072697 | Garcia-Ortiz | Jun 2000 | A |
6101715 | Fuesser et al. | Aug 2000 | A |
6148906 | Li et al. | Nov 2000 | A |
6293333 | Ponnappan et al. | Sep 2001 | B1 |
6302192 | Dussinger et al. | Oct 2001 | B1 |
6315033 | Li | Nov 2001 | B1 |
6394175 | Chen et al. | May 2002 | B1 |
6397935 | Yamamoto et al. | Jun 2002 | B1 |
6415612 | Pokharna et al. | Jul 2002 | B1 |
6439298 | Li | Aug 2002 | B1 |
6457515 | Vafai et al. | Oct 2002 | B1 |
6462949 | Parish, IV et al. | Oct 2002 | B1 |
6523259 | Pinneo | Feb 2003 | B1 |
6647625 | Wang et al. | Nov 2003 | B2 |
6672373 | Smyrnov | Jan 2004 | B2 |
6679316 | Lin et al. | Jan 2004 | B1 |
6698502 | Lee | Mar 2004 | B1 |
6705089 | Chu et al. | Mar 2004 | B2 |
6725668 | Cornwall | Apr 2004 | B1 |
6745825 | Nakamura et al. | Jun 2004 | B1 |
6766817 | da Silva | Jul 2004 | B2 |
6795310 | Ghosh | Sep 2004 | B2 |
6810946 | Hoang | Nov 2004 | B2 |
6820684 | Chu et al. | Nov 2004 | B1 |
6828675 | Memory et al. | Dec 2004 | B2 |
6834712 | Parish et al. | Dec 2004 | B2 |
6843308 | Duval | Jan 2005 | B1 |
6918404 | da Silva | Jul 2005 | B2 |
6935409 | Parish, IV et al. | Aug 2005 | B1 |
6948321 | Bell | Sep 2005 | B2 |
7066586 | da Silva | Jun 2006 | B2 |
7150312 | Parish, IV et al. | Dec 2006 | B2 |
7285255 | Kadlec et al. | Oct 2007 | B2 |
7322402 | Hsu | Jan 2008 | B2 |
7331185 | Lee et al. | Feb 2008 | B2 |
7340904 | Sauciuc et al. | Mar 2008 | B2 |
7455101 | Hsu | Nov 2008 | B2 |
7549461 | Kroliczek et al. | Jun 2009 | B2 |
8375728 | Bell | Feb 2013 | B2 |
9496589 | Kopra | Nov 2016 | B2 |
20020038550 | Gillen | Apr 2002 | A1 |
20020189793 | Noda et al. | Dec 2002 | A1 |
20030089486 | Parish et al. | May 2003 | A1 |
20030089487 | Parish, IV et al. | May 2003 | A1 |
20030127215 | Parish, IV et al. | Jul 2003 | A1 |
20040099407 | Parish, IV et al. | May 2004 | A1 |
20040112572 | Moon et al. | Jun 2004 | A1 |
20040177947 | Krassowski et al. | Sep 2004 | A1 |
20050006061 | Quisenberry et al. | Jan 2005 | A1 |
20050039887 | Parish, IV et al. | Feb 2005 | A1 |
20050056403 | Norlin et al. | Mar 2005 | A1 |
20060048519 | Childress | Mar 2006 | A1 |
20060090474 | Sauciuc et al. | May 2006 | A1 |
20060137181 | Parish et al. | Jun 2006 | A1 |
20080006037 | Scott et al. | Jan 2008 | A1 |
20080015531 | Hird et al. | Jan 2008 | A1 |
20080047736 | Levine | Feb 2008 | A1 |
20080110597 | Parish et al. | May 2008 | A1 |
20090007572 | Bell | Jan 2009 | A1 |
20090154105 | Chu | Jun 2009 | A1 |
20110162389 | Bell | Jul 2011 | A1 |
20110203777 | Zhao et al. | Aug 2011 | A1 |
20120111028 | Campbell et al. | May 2012 | A1 |
20160111761 | Kopra | Apr 2016 | A1 |
Number | Date | Country |
---|---|---|
1284506 | Dec 1968 | DE |
3117758 | Jan 1982 | DE |
8512617 | Sep 1985 | DE |
19849919 | May 1999 | DE |
0969354 | Jan 2000 | EP |
334209 | Aug 1930 | GB |
1402509 | Aug 1975 | GB |
2128319 | Apr 1984 | GB |
2128320 | Apr 1984 | GB |
2293446 | Mar 1996 | GB |
53136749 | Nov 1978 | JP |
63115351 | May 1988 | JP |
06291481 | Oct 1994 | JP |
2001-223308 | Aug 2001 | JP |
2002-206881 | Jul 2002 | JP |
589531 | Jan 1978 | SU |
1476297 | Apr 1989 | SU |
WO-9106958 | May 1991 | WO |
WO-9526125 | Sep 1995 | WO |
WO-9820260 | Jan 1998 | WO |
WO-9942781 | Aug 1999 | WO |
WO-0070288 | Nov 2000 | WO |
WO-0103484 | Jan 2001 | WO |
WO-02080270 | Oct 2002 | WO |
WO-03046463 | Jun 2003 | WO |
Entry |
---|
U.S. Appl. No. 10/998,198, filed Nov. 26, 2004, Quisenberry et al. |
U.S. Appl. No. 10/998,199, filed Nov. 26, 2004, Parish, IV et al. |
U.S. Appl. No. 12/871,583, Devilbiss et al. |
U.S. Appl. No. 12/857,635, Parish et al. |
Andre Ali et al.; “Advanced Heat Pipe Thermal Solutions for Higher Power Notebook Computers”; Intel Corporation, Santa Clara, CA 1999; Thermacore, Inc. Lancaster, PA 1999; 6 pages. |
Thermalex, Inc. Brochure, “Setting a Higher Standard in Aluminum Extrusions”, 2758 Gunter Park Drive West, Montgomery, AL, no date; 8 pages. |
“Furukawa Electric Heat Planar”; Brochure undated from Trade Show, Aug. 1999; 4 pages. |
“Gore's Polarchip Thermal Interface Materials . . . Bridge the Gap Between Hot PCBs and Cool Heat Sinks.”; W.L. Gore and Associates, Inc. 2000; 1 page. |
“Thermal Management Components to Fill Virtually Any Gap Configuration”; Stockwell Rubber Company; Nov. 2001. |
“Furukawa Electric Heat Planar”; undated material from Aug. 1999 trade show marketed by Furu Kawa Electric North America, Inc. |
Cornelia Dean, “When Questions of Science Come to a Courtroom, Truth has Many Faces,” The New York Times (Dec. 8, 2006). |
Elson Silva, PhD, “Letter from Elson Silva, PhD, for IDS,” May 16, 2008. (9 pages). |
Thomas, Shane, International Search Report for PCT/US15/16837, May 22, 2015 [2 pages]. |
Number | Date | Country | |
---|---|---|---|
20150318588 A1 | Nov 2015 | US |
Number | Date | Country | |
---|---|---|---|
61412817 | Nov 2010 | US | |
60334235 | Nov 2001 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 13294538 | Nov 2011 | US |
Child | 14799926 | US | |
Parent | 10998199 | Nov 2004 | US |
Child | 12857635 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 12857635 | Aug 2010 | US |
Child | 13294538 | US | |
Parent | 10305662 | Nov 2002 | US |
Child | 10998199 | US |