Claims
- 1. A process for chemical mechanical polishing a low dielectric constant inorganic polymer surface of an IC wafer, comprising the steps of:
(a) providing a chemical mechanical polishing slurry to the surface of said wafer, said slurry comprising a colloidally stable dispersion of zirconium oxide particles, said particles having a surface area ranging from about 40 m2/g to about 430 m2/g, an aggregate size distribution less than about 1.0 micron, and a mean aggregate diameter less than about 0.4 micron, b) chemical mechanical polishing said low dielectric constant inorganic polymer surface on said wafer with said slurry.
- 2. The process of claim 1 wherein said low dielectric constant inorganic polymer surface is an organo silicate glass.
- 3. The process of claim 2 wherein said surface layer further comprising at least one via comprising a metal selected from the group consisting of tungsten, aluminum, copper, platinum, palladium, gold, iridium, and any combination or alloy thereof.
- 4. The process of claim 1 wherein said particles are present in a range between about 0.01% and 20% by weight.
- 5. The process of claim 4 wherein said particles are present in a range between about 0.1% and 10% by weight.
- 6. The process of claim 5 wherein said particles are present in a range between about 0.5% and 5% by weight.
- 7. The process of claim 1 wherein said slurry has a pH within the range of 1 to 11.
- 8. The process of claim 7 wherein said slurry has a pH within the range of 1 to 6.
- 9. The process of claim 8 wherein said slurry has a pH within the range of 1.5 to 5.
- 10. The process of claim 1 wherein said slurry further comprises a surfactant.
- 11. The process of claim 10 wherein the surfactant is selected from the group consisting of nonionic surfactants, anionic surfactants, cationic surfactants, amphoteric surfactants and mixtures thereof.
- 12. The process of claim 11 wherein said surfactant is selected from the group consisting of: polyalkyl siloxanes, polyaryl siloxanes, polyoxyalkylene ethers, and mixtures and copolymers thereof.
Parent Case Info
[0001] This application is a continuation-in-part of application Ser. No. 09/505,042 filed Feb. 16, 2000 which claims the benefit of Provisional Application No. 60/120,567 filed Feb. 18, 1999.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60120567 |
Feb 1999 |
US |
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
09505042 |
Feb 2000 |
US |
Child |
09742853 |
Dec 2000 |
US |