of organic layers

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CPC
H01L21/31058

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/31058of organic layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chuck assembly, planarization process, apparatus and method of manu...
- Patent number 12,165,903
- Issue date Dec 10, 2024
- Canon Kabushiki Kaisha
- Seth J. Bamesberger
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Atomic layer etch process using plasma in conjunction with a rapid...
- Patent number 12,159,789
- Issue date Dec 3, 2024
- BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY, CO., LTD
- Shawming Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device structure with gate and res...
- Patent number 12,136,572
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chai-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method with metal hard mask
- Patent number 12,100,601
- Issue date Sep 24, 2024
- BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Yu Zhang
- B08 - CLEANING
Information Patent Grant
Semiconductor device with encapsulant deposited along sides and sur...
- Patent number 12,094,729
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ambient controlled two-step thermal treatment for spin-on coating l...
- Patent number 12,087,592
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a protective layer to prevent formation of leakage paths
- Patent number 12,057,350
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Leo Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resist underlayer film-forming composition
- Patent number 12,044,969
- Issue date Jul 23, 2024
- NISSAN CHEMICAL CORPORATION
- Hiroto Ogata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 11,984,342
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 11,967,628
- Issue date Apr 23, 2024
- NANYA TECHNOLOGY CORPORATION
- Chih-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for loading a superstrate onto a superstrate chuck
- Patent number 11,964,421
- Issue date Apr 23, 2024
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor package and method
- Patent number 11,948,890
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 11,935,757
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for treating substrate
- Patent number 11,923,212
- Issue date Mar 5, 2024
- Semes Co., Ltd.
- Kyungsik Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,915,936
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Wei Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ambient controlled two-step thermal treatment for spin-on coating l...
- Patent number 11,901,189
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of etch-stop layer for enhanced patterning
- Patent number 11,869,770
- Issue date Jan 9, 2024
- Lam Research Corporation
- Nagraj Shankar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-layer line structure and method for manufacturing thereof
- Patent number 11,862,564
- Issue date Jan 2, 2024
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,843,027
- Issue date Dec 12, 2023
- Tokyo Electron Limited
- Tatsuya Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to improve profile control during selective etching of silic...
- Patent number 11,837,474
- Issue date Dec 5, 2023
- American Air Liquide, Inc.
- Xiangyu Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective layer formation using deposition and removing
- Patent number 11,804,373
- Issue date Oct 31, 2023
- ASM IP Holding, B.V.
- Eva E. Tois
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,776,853
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,742,402
- Issue date Aug 29, 2023
- NANYA TECHNOLOGY CORPORATION
- Chih-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer structures and methods of forming
- Patent number 11,742,204
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chuck assembly, planarization process, apparatus and method of manu...
- Patent number 11,728,203
- Issue date Aug 15, 2023
- Canon Kabushiki Kaisha
- Seth J. Bamesberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package structure
- Patent number 11,699,694
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal etching with in situ plasma ashing
- Patent number 11,699,596
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsing-Hsiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Improving surface topography by forming spacer-like components
- Patent number 11,665,897
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Chang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming planarization layer and pattern forming method u...
- Patent number 11,651,968
- Issue date May 16, 2023
- SK Hynix Inc.
- Ji Sok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical capacitor structure having capacitor in cavity, and method...
- Patent number 11,631,734
- Issue date Apr 18, 2023
- Advanced Semiconductor Engineering, Inc.
- Syu-Tang Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240404877
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsai-Ming HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMBIENT CONTROLLED TWO-STEP THERMAL TREATMENT FOR SPIN-ON COATING L...
- Publication number 20240387188
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE FILM AND MET...
- Publication number 20240387401
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE WITH GATE AND RES...
- Publication number 20240371698
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manfacturing Co., Ltd.
- Chai-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT APPARATUS FOR ARRANGING SEMICONDUCTOR DEVICES
- Publication number 20240355648
- Publication date Oct 24, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Zi Chow LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240250036
- Publication date Jul 25, 2024
- TAIWAN SEMICODUCTOR MANUFACTURING CO., LTD.
- Shih-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEGRADABLE SUBSTRATE FOR ELECTRONIC DEVICE, DEGRADABLE SUBSTRATE AS...
- Publication number 20240242973
- Publication date Jul 18, 2024
- Korea University Research and Business Foundation
- Suk Won HWANG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240222454
- Publication date Jul 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Chih-Wei HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED DRY DESMEAR EQUIPMENT WITH PROTECTIVE FILM PEELING CAPABIL...
- Publication number 20240222089
- Publication date Jul 4, 2024
- Intel Corporation
- Ala OMER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20240186148
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO IMPROVE PROFILE CONTROL DURING SELECTIVE ETCHING OF SILIC...
- Publication number 20240112920
- Publication date Apr 4, 2024
- American Air Liquide, Inc.
- Xiangyu GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD WITH METAL HARD MASK
- Publication number 20240112923
- Publication date Apr 4, 2024
- Beijing NAURA Microelectronics Equipment Co., Ltd.
- Yu ZHANG
- B08 - CLEANING
Information Patent Application
MULTI-LAYER LINE STRUCTURE
- Publication number 20240088040
- Publication date Mar 14, 2024
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERSTRATE INCLUDING A BODY AND LAYERS AND METHODS OF FORMING AND...
- Publication number 20230415195
- Publication date Dec 28, 2023
- Canon Kabushiki Kaisha
- Niyaz KHUSNATDINOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PATTERNS
- Publication number 20230406970
- Publication date Dec 21, 2023
- Samsung SDI Co., Ltd.
- Seung-Wook SHIN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
AMBIENT CONTROLLED TWO-STEP THERMAL TREATMENT FOR SPIN-ON COATING L...
- Publication number 20230386852
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Fong Tsai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Multi-Layer Structures and Methods of Forming
- Publication number 20230369049
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20230352549
- Publication date Nov 2, 2023
- NANYA TECHNOLOGY CORPORATION
- Chih-Wei HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHUCK ASSEMBLY, PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANU...
- Publication number 20230335428
- Publication date Oct 19, 2023
- Canon Kabushiki Kaisha
- SETH J. BAMESBERGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Info Structure with Copper Pillar Having Reversed Profile
- Publication number 20230335426
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING PADS FOR IMPROVED REMOVAL RATE AND PL...
- Publication number 20230294240
- Publication date Sep 21, 2023
- Jonathan G. Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPLATE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230296979
- Publication date Sep 21, 2023
- KIOXIA Corporation
- Takeharu MOTOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZING AGENT FOR FORMING ORGANIC FILM, COMPOSITION FOR FORMING...
- Publication number 20230274936
- Publication date Aug 31, 2023
- Shin-Etsu Chemical Co., Ltd.
- Yasuyuki YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20230245900
- Publication date Aug 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FORMING METHOD, ARTICLE MANUFACTURING METHOD, SUPPLY DEVICE, F...
- Publication number 20230221636
- Publication date Jul 13, 2023
- Canon Kabushiki Kaisha
- JUN KATO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230146366
- Publication date May 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Wei SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING NANOSTRUCTURES INCLUDING METAL OXIDES USING BLOC...
- Publication number 20230116129
- Publication date Apr 13, 2023
- Micron Technology, Inc.
- Nicholas Hendricks
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD TO IMPROVE PROFILE CONTROL DURING SELECTIVE ETCHING OF SILIC...
- Publication number 20230026743
- Publication date Jan 26, 2023
- American Air Liquide, Inc.
- Xiangyu GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LAYER FORMATION USING DEPOSITION AND REMOVING
- Publication number 20230016537
- Publication date Jan 19, 2023
- ASM IP HOLDING B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SPLITTING SEMICONDUCTOR WAFERS
- Publication number 20230005794
- Publication date Jan 5, 2023
- INFINEON TECHNOLOGIES AG
- Christian Beyer
- H01 - BASIC ELECTRIC ELEMENTS

of organic layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chuck assembly, planarization process, apparatus and method of manu...

Atomic layer etch process using plasma in conjunction with a rapid...

Method for forming semiconductor device structure with gate and res...

Etching method with metal hard mask

Semiconductor device with encapsulant deposited along sides and sur...

Ambient controlled two-step thermal treatment for spin-on coating l...

Forming a protective layer to prevent formation of leakage paths

Resist underlayer film-forming composition

Info structure with copper pillar having reversed profile

Manufacturing method of semiconductor structure

Method and system for loading a superstrate onto a superstrate chuck

Semiconductor package and method

Method of manufacturing a semiconductor device

Apparatus and method for treating substrate

Semiconductor structure and manufacturing method thereof

Ambient controlled two-step thermal treatment for spin-on coating l...

Selective deposition of etch-stop layer for enhanced patterning

Multi-layer line structure and method for manufacturing thereof

Method of manufacturing semiconductor device

Method to improve profile control during selective etching of silic...

Selective layer formation using deposition and removing

Semiconductor device and method of manufacture

Semiconductor structure and manufacturing method thereof

Multi-layer structures and methods of forming

Chuck assembly, planarization process, apparatus and method of manu...

Method of manufacturing semiconductor package structure

Metal etching with in situ plasma ashing

Improving surface topography by forming spacer-like components

Method for forming planarization layer and pattern forming method u...

Vertical capacitor structure having capacitor in cavity, and method...

Patents Applicationslast 30 patents

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE

AMBIENT CONTROLLED TWO-STEP THERMAL TREATMENT FOR SPIN-ON COATING L...

SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE FILM AND MET...

METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE WITH GATE AND RES...

CONTACT APPARATUS FOR ARRANGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE AND METHOD

DEGRADABLE SUBSTRATE FOR ELECTRONIC DEVICE, DEGRADABLE SUBSTRATE AS...

SEMICONDUCTOR STRUCTURE

ENHANCED DRY DESMEAR EQUIPMENT WITH PROTECTIVE FILM PEELING CAPABIL...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

METHOD TO IMPROVE PROFILE CONTROL DURING SELECTIVE ETCHING OF SILIC...

ETCHING METHOD WITH METAL HARD MASK

MULTI-LAYER LINE STRUCTURE

SUPERSTRATE INCLUDING A BODY AND LAYERS AND METHODS OF FORMING AND...

METHOD OF FORMING PATTERNS

AMBIENT CONTROLLED TWO-STEP THERMAL TREATMENT FOR SPIN-ON COATING L...

Multi-Layer Structures and Methods of Forming

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

CHUCK ASSEMBLY, PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANU...

Info Structure with Copper Pillar Having Reversed Profile

CHEMICAL MECHANICAL POLISHING PADS FOR IMPROVED REMOVAL RATE AND PL...

TEMPLATE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

PLANARIZING AGENT FOR FORMING ORGANIC FILM, COMPOSITION FOR FORMING...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

FILM FORMING METHOD, ARTICLE MANUFACTURING METHOD, SUPPLY DEVICE, F...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHODS OF FORMING NANOSTRUCTURES INCLUDING METAL OXIDES USING BLOC...

METHOD TO IMPROVE PROFILE CONTROL DURING SELECTIVE ETCHING OF SILIC...

SELECTIVE LAYER FORMATION USING DEPOSITION AND REMOVING

METHOD FOR SPLITTING SEMICONDUCTOR WAFERS