by blanket deposition of the material of the layer connector

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H01L2224/274

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/274by blanket deposition of the material of the layer connector

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing an electronic device
- Patent number 12,173,207
- Issue date Dec 24, 2024
- Celanese Mercury Holdings Inc.
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 12,132,002
- Issue date Oct 29, 2024
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Atomic layer deposition bonding layer for joining two semiconductor...
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- Issue date Sep 17, 2024
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- Kuang-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact and die attach metallization for silicon carbide based devi...
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- Issue date Jul 30, 2024
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die, a semiconductor die stack, and a semiconductor m...
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- Issue date Jul 23, 2024
- SK hynix Inc.
- Jin Woong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems of applying materials to components
- Patent number 12,040,306
- Issue date Jul 16, 2024
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layer structure with an intermetallic phase layer and a chip packag...
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- Issue date Jul 2, 2024
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- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Systems and methods for fabricating silicon die stacks for electron...
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- Issue date Jul 2, 2024
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Information Patent Grant
Electronic device and method of transferring electronic element usi...
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- Issue date Jun 11, 2024
- Seoul National University R&DB Foundation
- Yongtaek Hong
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Information Patent Grant
Structure and method of forming a joint assembly
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- Issue date Jun 11, 2024
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- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
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- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
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Information Patent Grant
Composition for provisional fixation and method for producing bonde...
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Information Patent Grant
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Information Patent Grant
Integrated circuit package and method of forming same
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Information Patent Grant
Semiconductor structure having silver-indium transient liquid phase...
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- Yongjun Huo
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Information Patent Grant
Semiconductor structure and manufacturing method thereof
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Information Patent Grant
Nanowires plated on nanoparticles
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Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
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Information Patent Grant
Semiconductor device and method
- Patent number 11,855,014
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of transferring electronic element usi...
- Patent number 11,848,303
- Issue date Dec 19, 2023
- Seoul National University R&DB Foundation
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
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- Issue date Dec 12, 2023
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- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,842,992
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures and methods for forming the same
- Patent number 11,837,568
- Issue date Dec 5, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
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Information Patent Grant
Semiconductor element bonding structure, method for producing semic...
- Patent number 11,810,885
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- Waseda University
- Kohei Tatsumi
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Information Patent Grant
Methods for establishing thermal joints between heat spreaders or l...
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- Issue date Oct 3, 2023
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- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass-based bonding structures for power electronics
- Patent number 11,749,632
- Issue date Sep 5, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic device
- Patent number 11,742,319
- Issue date Aug 29, 2023
- Innolux Corporation
- Yi-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connecting structure having nano-twins copper
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- Issue date Aug 1, 2023
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film-shaped firing material, film-shaped firing material provided w...
- Patent number 11,707,787
- Issue date Jul 25, 2023
- Lintec Corporation
- Isao Ichikawa
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
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Information Patent Application
LOW PRESSURE SINTERING POWDER
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Information Patent Application
ELECTRONIC DEVICE WITH WAFER LEVEL CAPACITOR
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- TEXAS INSTRUMENTS INCORPORATED
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Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
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Information Patent Application
SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...
- Publication number 20240371819
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Information Patent Application
ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR...
- Publication number 20240363578
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- Kuang-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A LAYER STRUCTURE, CHIP PACKAGE AND CHIP ARRANGEMENT
- Publication number 20240335912
- Publication date Oct 10, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20240332250
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Antonio BELLIZZI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20240332241
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Jin Woong KIM
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Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240321809
- Publication date Sep 26, 2024
- STMicroelectronics International N.V.
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TECHNIQUES FOR STACKED TRANSISTOR STRUCTURES
- Publication number 20240321855
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- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Channel Manufacturing Method
- Publication number 20240312943
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- SEIKO EPSON CORPORATION
- Junichi OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING FILM FRAMES AND RELATED METHODS
- Publication number 20240304596
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- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE
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- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Forming a Joint Assembly
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- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER
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- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240282593
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240282634
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF INTERCONNECTING SEMICONDUCTOR DEVICES AND ASSEMBLY OF INT...
- Publication number 20240266320
- Publication date Aug 8, 2024
- Yibu Semiconductor Co., Ltd.
- Yifan Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGING THERMAL INTERFACE MATERIAL ALLOY CREATED IN-SITU
- Publication number 20240243091
- Publication date Jul 18, 2024
- The Indium Corporation of America
- Richard McDonough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
- Publication number 20240227089
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- Hidefumi YASUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Die Attach with Adhesive Layer C...
- Publication number 20240194628
- Publication date Jun 13, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE METALLIZATION THIN FILM STRUCTURE AND METHOD FOR FORMING...
- Publication number 20240170434
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- AG MATERIALS TECHNOLOGY CO., LTD.
- Chien-Hsun CHUANG
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Information Patent Application
SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...
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- Jin Li
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- Dongjoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240145430
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Te Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
- Publication number 20240131633
- Publication date Apr 25, 2024
- Sekisui Chemical Co., Ltd.
- Hidefumi YASUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240113066
- Publication date Apr 4, 2024
- Sony Semiconductor Solutions Corporation
- Takashi IMAHIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...
- Publication number 20240105670
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- Chi-Hung Su
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CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD...
- Publication number 20240096845
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- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS

by blanket deposition of the material of the layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing an electronic device

Bridge interconnection with layered interconnect structures

Low pressure sintering powder

Atomic layer deposition bonding layer for joining two semiconductor...

Contact and die attach metallization for silicon carbide based devi...

Semiconductor die, a semiconductor die stack, and a semiconductor m...

Systems of applying materials to components

Layer structure with an intermetallic phase layer and a chip packag...

Systems and methods for fabricating silicon die stacks for electron...

Electronic device and method of transferring electronic element usi...

Structure and method of forming a joint assembly

Advanced device assembly structures and methods

Composition for provisional fixation and method for producing bonde...

Method for repairing a light-emitting device and a method for manuf...

Integrated circuit package and method of forming same

Semiconductor structure having silver-indium transient liquid phase...

Semiconductor structure and manufacturing method thereof

Nanowires plated on nanoparticles

Semiconductor components having conductive vias with aligned back s...

Semiconductor device and method

Electronic device and method of transferring electronic element usi...

Electronic device with multi-layer contact and system

Seal ring structures and methods of forming same

Bonding structures and methods for forming the same

Semiconductor element bonding structure, method for producing semic...

Methods for establishing thermal joints between heat spreaders or l...

Glass-based bonding structures for power electronics

Method of manufacturing electronic device

Electrical connecting structure having nano-twins copper

Film-shaped firing material, film-shaped firing material provided w...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

LOW PRESSURE SINTERING POWDER

ELECTRONIC DEVICE WITH WAFER LEVEL CAPACITOR

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...

ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR...

METHOD OF FORMING A LAYER STRUCTURE, CHIP PACKAGE AND CHIP ARRANGEMENT

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

ELECTRONIC DEVICE

BONDING TECHNIQUES FOR STACKED TRANSISTOR STRUCTURES

Channel Manufacturing Method

SINTERING FILM FRAMES AND RELATED METHODS

OPTICAL SENSOR PACKAGE

Structure and Method of Forming a Joint Assembly

INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

METHOD OF INTERCONNECTING SEMICONDUCTOR DEVICES AND ASSEMBLY OF INT...

PHASE CHANGING THERMAL INTERFACE MATERIAL ALLOY CREATED IN-SITU

NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...

Semiconductor Device and Method of Die Attach with Adhesive Layer C...

BACK SIDE METALLIZATION THIN FILM STRUCTURE AND METHOD FOR FORMING...

SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...

ELECTRONIC DEVICE

ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...

CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD...